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41. 发明申请

US20080110268A1 INTEGRATED SENSOR INCLUDING A PRESSURE SENSOR AND A TEMPERATURE SENSOR 有权
标题翻译：集成传感器，包括压力传感器和温度传感器
公开(公告)号：US20080110268A1
公开(公告)日：2008-05-15
申请号：US11937950
申请日：2007-11-09
申请人： Kazunori SAITO , Kimihiro ASHINO , Katsumichi UEYANAGI
发明人： Kazunori SAITO , Kimihiro ASHINO , Katsumichi UEYANAGI
IPC分类号： G01L19/04 , G01L7/00
CPC分类号： G01K13/02 , G01K1/14 , G01K1/18 , G01K2205/02 , G01L19/0092 , G01L23/24
摘要： An integrated sensor includes a pressure sensor integrated with a temperature sensor. When the sensor is attached to an object of attachment at a mounting position at an angle of θrq degrees with respect to an ideal attachment position, in which a central axis of at sensor body element of the temperature sensor element is disposed perpendicular to a direction in which a gas to be measured passes through the object of attachment, an inclination angle θpos at which the central axis of the sensor body element is inclined at the mounting position with respect to a position of the central axis of the main body element at the ideal attachment position is set according to the following equation: (θrq−θallow)≦θpos≦(θrq+θallow) wherein θallow represents an allowable angle at which an allowable response speed of the temperature sensor element is obtained.
摘要翻译：集成传感器包括与温度传感器集成的压力传感器。当传感器相对于理想的安装位置以相对于理想的安装位置的角度附接到安装位置处的安装位置时，其中温度传感器的传感器主体元件的中心轴线元件垂直于待测量气体通过附着物体的方向设置，传感器主体元件的中心轴线在安装位置处倾斜的倾斜角度θ3，相对于在理想的附接位置处的主体元件的中心轴的位置根据以下等式设置：<？in-line-formula description =“In-line formula”end =“lead”？> 允许允许允许允许 SUB>）<？in-line-formula description =“In-line Formulas”end =“tail”？>其中θ<允许表示允许的温度传感器电极ele 获得。

42. 发明授权

US07370536B2 Pressure sensor device and pressure sensor cell thereof 有权
标题翻译：压力传感器装置及其压力传感器单元
公开(公告)号：US07370536B2
公开(公告)日：2008-05-13
申请号：US11372465
申请日：2006-03-10
申请人： Katsumichi Ueyanagi , Shigeru Shinoda , Kimihiro Ashino , Kazunori Saito
发明人： Katsumichi Ueyanagi , Shigeru Shinoda , Kimihiro Ashino , Kazunori Saito
IPC分类号： G01L9/00
CPC分类号： G01L19/0627 , G01L19/0084 , G01L19/147 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2924/01322 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： A pressure sensor device includes a pressure sensor cell that includes a sensor chip having a diaphragm with piezo-resistors, an amplifying circuit, and various adjusting circuits, and a base member to which the sensor chip is joined, with the diaphragm facing a through hole of the base member. The base member and a metallic member are joined together with a joining member so that their respective through holes communicate with each other. A protective film or filler covers the joining member between the base member and the metallic pipe member. The metallic pipe member is bonded to a resin case, and a signal terminal of the resin case and the pressure sensor chip are electrically connected together by wire bonding, thus forming a pressure sensor cell. The metallic pipe member protrudes beyond an end face of the resin case to support load.
摘要翻译：压力传感器装置包括压力传感器单元，该压力传感器单元包括具有压电电阻的隔膜的传感器芯片，放大电路和各种调节电路，以及传感器芯片接合的基座构件，隔膜面向通孔的基础成员。基部构件和金属构件与接合构件接合在一起，使得它们各自的通孔彼此连通。保护膜或填充物覆盖基部构件和金属管构件之间的接合构件。金属管构件接合到树脂壳体上，并且树脂壳体的信号端子和压力传感器芯片通过引线接合电连接在一起，从而形成压力传感器单元。金属管构件突出超过树脂壳体的端面以支撑负载。

43. 发明申请

US20060243054A1 Pressure detecting apparatus 有权
标题翻译：压力检测装置
公开(公告)号：US20060243054A1
公开(公告)日：2006-11-02
申请号：US11354959
申请日：2006-02-16
申请人： Kazunori Saito , Yuji Ichimura , Kei Yamaguchi , Katsumichi Ueyanagl , Shigeru Shinoda
发明人： Kazunori Saito , Yuji Ichimura , Kei Yamaguchi , Katsumichi Ueyanagl , Shigeru Shinoda
IPC分类号： G01L9/00
CPC分类号： G01L19/143 , G01L19/0084 , G01L19/146 , G01L19/147
摘要： A pressure detecting apparatus has a pressure detecting device that converts a strain caused by a stress exerted thereto to an electrical signal, and outputs the converted electrical signal. The apparatus has a housing base including a housing recess that houses the pressure detecting device therein, and a connecting material interposed between the pressure detecting device and the housing recess. The connecting material connects the pressure detecting device and the housing recess with a tensile elongation percentage of about 400% or higher. The pressure detecting apparatus facilitates preventing thermal stress from adversely affecting the detection performance thereof, and produces excellent thermal response.
摘要翻译：压力检测装置具有压力检测装置，其将施加于其上的应力引起的应变转换为电信号，并输出转换后的电信号。该装置具有壳体基部，该壳体基部包括容纳凹部，该壳体凹部容纳其中的压力检测装置，以及插入在压力检测装置和壳体凹部之间的连接材料。连接材料以约400％以上的拉伸伸长率连接压力检测装置和容纳凹部。压力检测装置有助于防止热应力对其检测性能产生不利影响，并且产生优异的热响应。

44. 发明申请

US20060041863A1 Data processing method, date processing device computer program and recording medium 失效
标题翻译：数据处理方法，日期处理装置计算机程序和记录介质
公开(公告)号：US20060041863A1
公开(公告)日：2006-02-23
申请号：US10523690
申请日：2003-08-04
申请人： Kazunori Saito
发明人： Kazunori Saito
IPC分类号： G06F9/44
CPC分类号： G06F21/566
摘要： The branch origin address and branch destination address of a branch instruction (jmp instruction) are stored, a judgment is made as to whether or not a call instruction for calling an instruction code group for executing an external command is associated with the branch destination address, a judgment is made as to whether or not the call destination address is between the branch origin address and the branch destination address if the call instruction is associated with the branch destination address, and information indicating that malicious code was detected is generated if the call destination of the call instruction is between the branch origin address and the branch destination address.
摘要翻译：存储分支指令（jmp指令）的分支起始地址和分支目的地地址，判断用于调用用于执行外部命令的指令代码组的调用指令是否与分支目的地地址相关联，如果呼叫指示与分支目的地地址相关联，则判定呼叫目的地地址是否在分支起始地址和分支目的地地址之间，并且如果呼叫目的地产生了指示检测到恶意代码的信息的呼叫指令位于分支起始地址和分支目的地址之间。

45. 发明授权

US06979552B2 Method of lipid assay and reagent for use therein 有权
标题翻译：脂质测定方法及其中使用的试剂
公开(公告)号：US06979552B2
公开(公告)日：2005-12-27
申请号：US10416166
申请日：2001-11-13
申请人： Mitsuaki Yamamoto , Shoko Yamamoto , Mitsuhiro Nakamura , Kazunori Saito
发明人： Mitsuaki Yamamoto , Shoko Yamamoto , Mitsuhiro Nakamura , Kazunori Saito
IPC分类号： G01N33/92 , C12Q1/60 , C12Q1/00 , C12Q1/34 , C12Q1/26 , C12Q1/28
CPC分类号： G01N33/92 , C07F7/18 , C12Q1/44 , C12Q1/60 , C12Q1/61 , G01N2800/044
摘要： A method of lipid assay characterized by assaying the lipids contained in a blood component in the presence of an organic silicon compound. The method can cause specific conditions for direct methods while satisfying requirements such as no influence on precision of assay, no burden on assay apparatus, and easy availability.
摘要翻译：一种脂质测定方法，其特征在于在有机硅化合物存在下测定血液成分中所含的脂质。该方法可以满足直接方法的特定条件，同时满足对测定精度无影响，测定仪器无负担，易于获得的要求。

46. 发明申请

US20050087020A1 Pressure sensor device and cell thereof 有权
标题翻译：压力传感器及其单元
公开(公告)号：US20050087020A1
公开(公告)日：2005-04-28
申请号：US10926797
申请日：2004-08-26
申请人： Katsumichi Ueyanagi , Shigeru Shinoda , Kimihiro Ashino , Kazunori Saito
发明人： Katsumichi Ueyanagi , Shigeru Shinoda , Kimihiro Ashino , Kazunori Saito
IPC分类号： G01L19/14 , G01L9/00 , G01L9/04 , G01L19/00 , H01L29/84
CPC分类号： G01L19/0084 , G01L19/0038 , G01L19/143 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： A pressure sensor device includes a pressure sensor chip containing a diaphragm, piezo-resistors, an amplifying circuit and various kinds of adjusting circuits, and a base member to which the sensor chip is joined, with the diaphragm facing a through hole of the base member. The base member and a metallic member are joined so that their respective through holes communicate with each other. The metallic member is bonded to a resin case, and a signal terminal of the resin case and the pressure sensor chip are electrically connected to form a pressure sensor cell. With an O-ring attached to the metallic member and with the resin case pressed from above, the pressure sensor cell is secured to an enclosure, such as an oil enclosing block. Using a connector having a bending section and a threaded section, the pressure sensor cell can be secured to the connector by bending the bending section over the pressure sensor cell. The threaded section can be screwed into the enclosure.
摘要翻译：一种压力传感器装置包括：压力传感器芯片，其包含隔膜，压电电阻器，放大电路和各种调节电路;以及传感器芯片接合的基座构件，隔膜面向基座构件的通孔。基部构件和金属构件接合，使得它们各自的通孔彼此连通。将金属构件接合到树脂壳体上，并且树脂壳体的信号端子和压力传感器芯片电连接以形成压力传感器单元。通过将O形环连接到金属构件并且从上方按压树脂壳体，压力传感器单元固定到例如油封块的外壳上。使用具有弯曲部分和螺纹部分的连接器，压力传感器单元可以通过弯曲压力传感器单元上的弯曲部分而固定到连接器。螺纹部分可以拧入外壳。

47. 发明授权

US06747346B2 Container for semiconductor sensor, manufacturing method therefor, and semiconductor sensor device 失效
标题翻译：用于半导体传感器的容器，其制造方法和半导体传感器装置
公开(公告)号：US06747346B2
公开(公告)日：2004-06-08
申请号：US10121431
申请日：2002-04-12
申请人： Kazunori Saito , Kimihiro Ashino , Katsumichi Ueyanagi
发明人： Kazunori Saito , Kimihiro Ashino , Katsumichi Ueyanagi
IPC分类号： H01L2312
CPC分类号： G01L19/142 , G01L19/147 , H01L23/057 , H01L23/10 , H01L23/24 , H01L2224/48091 , H01L2224/73265 , H01L2924/16195 , H01L2924/16315 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A container for a semiconductor sensor includes a housing body and a cover. On the upper surface of the housing body outer than the pressure detection room, a groove is provided to trap the gel protective material overflowed from the pressure detection room. The housing body and the cover are respectively provided with a recess portion and a protruding portion, engaging with each other, to secure adhesion of the cover to the housing body. The clearance between the housing body and the lead terminal is filled with filler that is formed by applying and curing polyimide resin. The sensor-mounting pit is provided with a relief portion for releasing excess portion of the adhesive, which is used for adhering the pedestal. The excess adhesive is released into the relief portion, to suppress creeping up of the adhesive.
摘要翻译：用于半导体传感器的容器包括壳体和盖。在壳体的比压力检测室以外的上表面设置有用于捕获从压力检测室溢出的凝胶保护材料的槽。壳体和盖分别设置有彼此接合的凹部和突出部分，以确保盖与壳体的粘附。壳体与引线端子之间的间隙填充有通过涂覆和固化聚酰亚胺树脂形成的填料。传感器安装凹坑设置有用于释放用于粘附基座的粘合剂的多余部分的释放部分。多余的粘合剂被释放到浮雕部分中，以抑制粘合剂的蠕变。

48. 发明授权

US06553909B2 Apparatus for semi-automating switching operations of web offset printing press 失效
标题翻译：用于半自动化卷筒纸胶印机的切换操作的装置
公开(公告)号：US06553909B2
公开(公告)日：2003-04-29
申请号：US09852686
申请日：2001-05-11
申请人： Kazunori Saito
发明人： Kazunori Saito
IPC分类号： B41F1706
CPC分类号： B41F33/16
摘要： An offset rotary printing press for semi-automating switch operations has a first switch for reducing an ink amount to a basic ink layer thickness distribution by an ink supplement device 800 and web rolls 101 and 102 are exchanged and succeeded by continuous supply device 100, a second switch for operating printing plate change device 207, 208 and folding device status switch in the folding device 700, and a third switch for activating ink supplement device 800 that overlaps an ink layer thickness distribution corresponding to the next printing.
摘要翻译：用于半自动切换操作的胶印旋转印刷机具有第一开关，用于通过墨补充装置800将墨量减少到基本油墨层厚度分布，并且卷筒纸101和102由连续供应装置100交换并成功，用于在折叠装置700中操作印版更换装置207,208和折叠装置状态开关的第二开关，以及用于启动与第二打印相对应的油墨层厚度分布重叠的油墨补充装置800的第三开关。

49. 发明授权

US4892613A Process for etching light-shielding thin film 失效
标题翻译：蚀刻光屏蔽薄膜的工艺
公开(公告)号：US4892613A
公开(公告)日：1990-01-09
申请号：US290076
申请日：1988-12-27
申请人： Noboru Motai , Sakae Tanaka , Yoshiaki Watanabe , Katsuo Shirai , Yaeko Suzuki , Yoshihisa Ogiwara , Kazunori Saito , Keiko Shibuki
发明人： Noboru Motai , Sakae Tanaka , Yoshiaki Watanabe , Katsuo Shirai , Yaeko Suzuki , Yoshihisa Ogiwara , Kazunori Saito , Keiko Shibuki
IPC分类号： H01L21/302 , H01L21/027 , H01L21/28 , H01L21/3065 , H01L21/3205 , H01L21/336 , H01L23/52 , H01L29/78 , H01L29/786
CPC分类号： H01L29/66765 , H01L21/0274 , H01L21/28008 , H01L29/78633
摘要： A light shielding thin film is provided on a light transmitting substrate, and the film is covered by a photoresist. The photoresist is exposed and developed to form a pattern, and the film is etched using the pattern as a mask. The pattern is then exposed through the substrate, using the film as a mask, the pattern then being developed to form a pattern of reduced size. The film is then etched using the reduced size pattern as a mask.
摘要翻译：在透光性基板上设置遮光薄膜，由光致抗蚀剂覆盖薄膜。光致抗蚀剂被曝光和显影以形成图案，并且使用该图案作为掩模蚀刻该膜。然后将该图案通过基底曝光，使用该膜作为掩模，然后将该图案显影以形成尺寸减小的图案。然后使用减小尺寸的图案作为掩模蚀刻该膜。

50. 发明授权

US08304847B2 Semiconductor pressure sensor 有权
标题翻译：半导体压力传感器
公开(公告)号：US08304847B2
公开(公告)日：2012-11-06
申请号：US12092226
申请日：2005-11-01
申请人： Toshiaki Kaminaga , Masahide Hayashi , Katsumichi Ueyanagi , Kazunori Saito , Mutsuo Nishikawa
发明人： Toshiaki Kaminaga , Masahide Hayashi , Katsumichi Ueyanagi , Kazunori Saito , Mutsuo Nishikawa
IPC分类号： H01L29/02
CPC分类号： G01L15/00 , G01L19/0038 , G01L19/0084 , G01L19/0627 , G01L19/141 , G01L19/147 , H01L2224/05553 , H01L2224/45124 , H01L2224/45144 , H01L2224/48465 , H01L2924/01004 , H01L2924/01013 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/00
摘要： An object of the present invention is to solve problems in that aluminum electrodes, aluminum wires, and I/O terminals are corroded by corrosive gasses when a pressure of a pressure medium containing corrosive matters such as exhaust gas is measured with a semiconductor sensor; and improve not only the corrosion resistance of the sensor chip but also the corrosion resistance of the portion particularly functioning as the pressure receiver.Each of the aluminum electrodes that is likely to be corroded portions is prevented from being corroded by forming a titanium-tungsten layer and gold layer on the aluminum electrode. The connecting wires are prevented from being corroded by corrosive matters by using gold wires. The I/O terminals are also prevented from being corroded by applying gold plating.
摘要翻译：本发明的一个目的是解决当用半导体传感器测量含有废气等腐蚀性物质的压力介质的压力时，铝电极，铝线和I / O端子被腐蚀性气体腐蚀的问题。并且不仅提高了传感器芯片的耐腐蚀性，而且提高了作为压力容器特别起作用的部分的耐腐蚀性。通过在铝电极上形成钛 - 钨层和金层，可以防止可能被腐蚀部分的每个铝电极被腐蚀。通过使用金线防止连接线被腐蚀性物质腐蚀。也可以通过镀金来防止I / O端子被腐蚀。

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