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41. 发明授权

US4555076A Film handling device 失效
标题翻译：胶片处理装置
公开(公告)号：US4555076A
公开(公告)日：1985-11-26
申请号：US629399
申请日：1984-07-10
申请人： Kaoru Uchiyama
发明人： Kaoru Uchiyama
IPC分类号： G03D13/00 , G03B1/04 , G11B15/32
CPC分类号： G03D13/001
摘要： A film handling device for pulling out and forwarding a leader from a spool of film after the film has been removed from a film cartridge. The spool of film is held in a film guide having an arcuately formed rear portion shaped to receive the spool of film and a forward guide portion composed of straight sections converging towards a forwarding opening. A pair of film forwarding rollers are selectively engageable with the spool of film through cuts formed in the rear portion of the film guide. A detector positioned in the forward portion of the film guide detects the presence of the film leader. Before the presence of the film leader is detected, the film forwarding rollers rotate the spool of film in the film rewinding direction. Then, the direction of the rollers is reversed.
摘要翻译：一种胶片处理装置，用于在胶片从暗盒中取出之后，从胶片卷轴上拉出和转送前导件。薄膜卷轴被保持在具有弧形形成的后部形状以形成以接收薄膜卷轴的薄膜引导件和由朝向前进开口收敛的直线部分组成的向前引导部分。一对胶片传送辊可以通过形成在胶片导向件的后部中的切口与胶片卷轴选择性地接合。定位在胶片导向件前部的探测器检测胶卷头的存在。在检测到胶卷头的存在之前，胶片传送辊在胶片倒带方向上旋转胶卷卷轴。然后，辊的方向相反。

42. 发明授权

US4540456A Film handling method 失效
标题翻译：胶片处理方法
公开(公告)号：US4540456A
公开(公告)日：1985-09-10
申请号：US629291
申请日：1984-07-09
申请人： Shinichi Kaida , Kaoru Uchiyama
发明人： Shinichi Kaida , Kaoru Uchiyama
IPC分类号： G03D15/04 , G03D13/00 , G03D15/00 , B32B31/18
CPC分类号： G03D15/001 , G03D13/005 , Y10T156/1066
摘要： A film processing method for removing troubled film strips from a series of film strips to which it is spliced for processing. The troubled film strip is removed by cutting along a line located inwardly of a leading end of the troubled film strip by a distance at least equal to the width of a splicing tape from a center line of the splice between the leading end of the troubled film strip and a preceding film strip such that a part of the troubled film strip remains connected to the preceding film strip. A succeeding film strip, or another film strip, is then spliced to the remaining part of the troubled film strip.
摘要翻译：一种胶片处理方法，用于从一系列胶片条中去除麻烦的胶片条，并将其拼接进行处理。通过沿故障薄膜条的前端内侧的线切割至少等于拼接带的宽度的距离，从拼接带的前端之间的接合中心线切割出麻烦的胶片条，带状物和前一胶片条，使得一部分麻烦的胶片条保持连接到前一胶片条上。接下来的胶片条或另一胶片条然后被拼接到困扰的胶片条的剩余部分。

43. 发明授权

US08659130B2 Power module and power module manufacturing method 有权
标题翻译：电源模块和电源模块制造方法
公开(公告)号：US08659130B2
公开(公告)日：2014-02-25
申请号：US13640512
申请日：2011-04-26
申请人： Yusuke Takagi , Kaoru Uchiyama , Tokihito Suwa , Kinya Nakatsu , Takeshi Tokuyama , Shinji Hiramitsu
发明人： Yusuke Takagi , Kaoru Uchiyama , Tokihito Suwa , Kinya Nakatsu , Takeshi Tokuyama , Shinji Hiramitsu
IPC分类号： H01L23/62
CPC分类号： H01L23/3675 , H01L23/4093 , H01L23/4334 , H01L23/473 , H01L24/34 , H01L25/162 , H01L25/18 , H01L2224/32245 , H01L2224/33 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H05K7/209 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A power module includes: a sealing body including a semiconductor element having a plurality of electrode surfaces, a first conductor plate connected to one electrode surface of the semiconductor element via solder, and a sealing material for sealing the semiconductor element and the first conductor plate, the sealing body having at least a first surface and a second surface on the opposite side of the first surface; and a case for housing the sealing body. The case is configured by a first heat radiation plate opposed to the first surface of the sealing body, a second heat radiation plate opposed to the second surface of the sealing body, and an intermediate member that connects the first heat radiation plate and the second heat radiation plate. The intermediate member has a first thin section having thickness smaller than the thickness of the first heat radiation plate, more easily elastically deformed than the first heat radiation plate, and formed to surround the first heat radiation plate. The sealing body is pressed against and fixed to the second heat radiation plate via the first heat radiation plate by elastic force generated in the first thin section.
摘要翻译：电源模块包括：密封体，包括具有多个电极表面的半导体元件，通过焊料连接到半导体元件的一个电极表面的第一导体板和用于密封半导体元件和第一导体板的密封材料，所述密封体具有在所述第一表面的相对侧上的至少第一表面和第二表面; 以及用于容纳密封体的壳体。壳体由与密封体的第一面相对的第一散热板，与密封体的第二面相对的第二散热板，以及将第一散热板和第二热连接的中间部件构成辐射板。中间构件具有厚度小于第一散热板的厚度的第一薄部分，比第一散热板更容易弹性变形，并且形成为围绕第一散热板。密封体经由第一散热板通过在第一薄部分中产生的弹力被压靠并固定到第二散热板。

44. 发明申请

US20130062751A1 Power Module and Power Module Manufacturing Method 有权
标题翻译：功率模块和功率模块制造方法
公开(公告)号：US20130062751A1
公开(公告)日：2013-03-14
申请号：US13640512
申请日：2011-04-26
申请人： Yusuke Takagi , Kaoru Uchiyama , Tokihito Suwa , Kinya Nakatsu , Takeshi Tokuyama , Shinji Hiramitsu
发明人： Yusuke Takagi , Kaoru Uchiyama , Tokihito Suwa , Kinya Nakatsu , Takeshi Tokuyama , Shinji Hiramitsu
IPC分类号： H01L23/34 , H01L21/58
CPC分类号： H01L23/3675 , H01L23/4093 , H01L23/4334 , H01L23/473 , H01L24/34 , H01L25/162 , H01L25/18 , H01L2224/32245 , H01L2224/33 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H05K7/209 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A power module includes: a sealing body including a semiconductor element having a plurality of electrode surfaces, a first conductor plate connected to one electrode surface of the semiconductor element via solder, and a sealing material for sealing the semiconductor element and the first conductor plate, the sealing body having at least a first surface and a second surface on the opposite side of the first surface; and a case for housing the sealing body. The case is configured by a first heat radiation plate opposed to the first surface of the sealing body, a second heat radiation plate opposed to the second surface of the sealing body, and an intermediate member that connects the first heat radiation plate and the second heat radiation plate. The intermediate member has a first thin section having thickness smaller than the thickness of the first heat radiation plate, more easily elastically deformed than the first heat radiation plate, and formed to surround the first heat radiation plate. The sealing body is pressed against and fixed to the second heat radiation plate via the first heat radiation plate by elastic force generated in the first thin section.
摘要翻译：电源模块包括：密封体，包括具有多个电极表面的半导体元件，通过焊料连接到半导体元件的一个电极表面的第一导体板和用于密封半导体元件和第一导体板的密封材料，所述密封体具有在所述第一表面的相对侧上的至少第一表面和第二表面; 以及用于容纳密封体的壳体。壳体由与密封体的第一面相对的第一散热板，与密封体的第二面相对的第二散热板，以及将第一散热板和第二热连接的中间部件构成辐射板。中间构件具有厚度小于第一散热板的厚度的第一薄部分，比第一散热板更容易弹性变形，并且形成为围绕第一散热板。密封体经由第一散热板通过在第一薄部分中产生的弹力被压靠并固定到第二散热板。

45. 发明申请

US20120267950A1 ENGINE START CONTROL APPARATUS 审中-公开
标题翻译：发动机起动控制装置
公开(公告)号：US20120267950A1
公开(公告)日：2012-10-25
申请号：US13450521
申请日：2012-04-19
申请人： Masato Saito , Hiroyuki Abe , Kaoru Uchiyama , Shigehiko Omata
发明人： Masato Saito , Hiroyuki Abe , Kaoru Uchiyama , Shigehiko Omata
IPC分类号： B60R99/00 , H03K3/36
CPC分类号： H01L23/34 , F02N11/087 , F02N2200/066 , H01L2224/32245 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/49111 , H01L2224/73265 , H01L2924/10253 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/19105 , H02P29/68 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The accuracy of measuring the temperature of a semiconductor element is improved, while a method for measuring the temperature using a general-purpose semiconductor element is provided at low cost. A fourth conductor that is a part of a first conductor connected to a power semiconductor element and is a thin line pattern extends under a chip thermometer. The fourth conductor and the thermometer are connected to each other through high thermal conductive resin.
摘要翻译：提高了测量半导体元件的温度的精度，而以低成本提供了使用通用半导体元件测量温度的方法。连接到功率半导体元件并且是细线图案的第一导体的一部分的第四导体在芯片温度计下方延伸。第四导体和温度计通过高导热性树脂相互连接。

46. 发明授权

US08002076B2 Electric power steering apparatus 有权
标题翻译：电动助力转向装置
公开(公告)号：US08002076B2
公开(公告)日：2011-08-23
申请号：US11488079
申请日：2006-07-18
申请人： Hideto Yoshinari , Masahide Harada , Kaoru Uchiyama , Osamu Koizumi
发明人： Hideto Yoshinari , Masahide Harada , Kaoru Uchiyama , Osamu Koizumi
IPC分类号： B62D5/04
CPC分类号： B62D5/0406 , H02K5/225 , H02K11/33
摘要： The present invention provides an electric power steering apparatus, in which reduction and thickness thereof can be achieved, radiation performance thereof can concurrently be ensured, and manufacturing and running costs thereof can also be reduced, even when the apparatus includes a structure having a motor and a motor control device integrated therewith. The apparatus includes a motor which assists in steering operations, a motor control device which controls the motor, and a housing which accommodates the motor and the motor control device. The housing includes a motor accommodation portion which accommodates the motor, and a control device accommodation portion which accommodates the motor control device. The motor control device includes a drive unit which drives the motor, and a control unit which controls the motor. The drive unit is disposed in a position in the control device accommodation portion, the position being in proximity to the motor accommodation portion.
摘要翻译：本发明提供一种电动助力转向装置，其中可以实现其减小和厚度，同时可以确保其辐射性能，并且即使当该装置包括具有电机和与其集成的电动机控制装置。该装置包括辅助转向操作的电动机，控制电动机的电动机控制装置以及容纳电动机和电动机控制装置的壳体。壳体包括容纳电动机的电动机容纳部分和容纳电动机控制装置的控制装置容纳部分。马达控制装置包括驱动马达的驱动单元和控制马达的控制单元。驱动单元设置在控制装置容纳部分中的位置，该位置靠近电动机容纳部分。

47. 发明授权

US07554039B2 Electronic device 有权
标题翻译：电子设备
公开(公告)号：US07554039B2
公开(公告)日：2009-06-30
申请号：US10535857
申请日：2003-06-20
申请人： Takehide Yokozuka , Masahide Harada , Shiro Yamashita , Kaoru Uchiyama , Shuji Eguchi , Masahiko Asano , Koji Sato
发明人： Takehide Yokozuka , Masahide Harada , Shiro Yamashita , Kaoru Uchiyama , Shuji Eguchi , Masahiko Asano , Koji Sato
IPC分类号： H05K1/00
CPC分类号： H05K1/021 , H01L23/3677 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L24/48 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/19105 , H05K1/0206 , H05K1/056 , H05K1/182 , H05K3/3436 , H05K3/4608 , H05K2201/10734 , H05K2203/049 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In an electronic device having an interposer substrate as an MCM structure, heat dissipation properties are enhanced while the reliability of joint between the interposer substrate and a motherboard is maintained. In the invention, a metal core base material of great heat capacity and high thermal conductivity is used for both the interposer substrate and the motherboard. Furthermore, a part where a core metal is exposed is provided on at least one of the interposer substrate and the motherboard. A solder joint pad is directly formed on the core metal exposed part, and the interposer substrate is solder-joined to the motherboard.
摘要翻译：在具有作为MCM结构的插入器基板的电子设备中，提高了散热性能，同时保持了插入器基板和母板之间的接合的可靠性。在本发明中，中间层基板和母板两者都使用具有高热容量和高导热性的金属芯基材。此外，在内插基板和母板的至少一个上设置有芯金属露出的部分。在芯金属露出部上直接形成焊点焊盘，并将插入基板与母板焊接。

48. 发明授权

US07281423B2 Characteristics adjusting apparatus of physical quantity sensing device and a thermal type air flow measuring instrument, and associated adjusting method 有权
标题翻译：物理量感测装置的特性调节装置和热式气流测量仪，以及相关调整方法
公开(公告)号：US07281423B2
公开(公告)日：2007-10-16
申请号：US10806291
申请日：2004-03-23
申请人： Shinya Igarashi , Kaoru Uchiyama , Hitoshi Ishikawa
发明人： Shinya Igarashi , Kaoru Uchiyama , Hitoshi Ishikawa
IPC分类号： G01F1/68
CPC分类号： F02M35/021 , F02D41/187 , F02D41/2474 , F02D2041/283 , F02D2200/0414 , G01F1/684 , G01F1/6842 , G01F1/6965 , G01F1/699
摘要： The output characteristics of the sensing device or the control quantity of the sensing element can be adjusted by extracting an adjusting terminal in addition to a power source terminal, a ground terminal, an output terminal and the like outside a housing containing and protecting an electronic circuit. Further, by arranging the adjusting terminal inside a connector housing containing terminals such as the power source terminal, the ground terminal, the output terminal and the like, it is possible to prevent contact of foreign objects to the adjusting terminal and to water-proof the terminals for preventing corrosion since an associated connector is attached to the connector when the sensing device is actually used.
摘要翻译：感测装置的输出特性或感测元件的控制量可以通过在包含和保护电子电路的外壳之外的电源端子，接地端子，输出端子等之外提取调节端子来调节。此外，通过将调整端子配置在包含电源端子，接地端子，输出端子等端子的连接器壳体的内部，可以防止异物与调整端子接触并防水用于防止腐蚀的端子，因为当实际使用感测装置时，将相关连接器连接到连接器。

49. 发明申请

US20070145473A1 Semiconductor device and electronic control unit using the same 有权
标题翻译：半导体装置和使用该装置的电子控制装置
公开(公告)号：US20070145473A1
公开(公告)日：2007-06-28
申请号：US11635561
申请日：2006-12-08
申请人： Masahiko Asano , Yasuo Akutsu , Masahide Harada , Kaoru Uchiyama , Shinichi Fujiwara , Isamu Yoshida
发明人： Masahiko Asano , Yasuo Akutsu , Masahide Harada , Kaoru Uchiyama , Shinichi Fujiwara , Isamu Yoshida
IPC分类号： H01L29/76
CPC分类号： H01L23/49822 , H01L23/142 , H01L23/3677 , H01L23/49816 , H01L24/48 , H01L25/165 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01019 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/181 , H01L2924/19105 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device with enhanced heat releasability and low-cost manufacturability is disclosed. This device has a substrate with an electronic circuit disposed on a first principal surface, a semiconductor element which is provided at the first surface of the substrate and electrically connected by wire bonding to the electronic circuit, a metallic core layer which is provided in the substrate and electrically connected to the semiconductor element, a plurality of conductive bumps provided on a second principal surface opposite to the first surface of the substrate, a thermal hardenable sealing resin for sealing at least the semiconductor element and the first surface side of the substrate, and a metal plate provided at the second surface for being electrically connected to the metal core layer. An electronic control module using the device is also disclosed.
摘要翻译：公开了具有增强的散热性和低成本可制造性的半导体器件。该器件具有设置在第一主表面上的电子电路的基板，设置在基板的第一表面并通过引线键合而与电子电路电连接的半导体元件，设置在基板中的金属芯层并且电连接到所述半导体元件，设置在与所述基板的第一表面相对的第二主表面上的多个导电凸块，用于至少密封所述基板的所述半导体元件和所述第一表面侧的热可硬化密封树脂，以及设置在第二表面处用于电连接到金属芯层的金属板。还公开了一种使用该装置的电子控制模块。

50. 发明申请

US20060216967A1 Device for controlling a vehicle 失效
标题翻译：用于控制车辆的装置
公开(公告)号：US20060216967A1
公开(公告)日：2006-09-28
申请号：US11375057
申请日：2006-03-15
申请人： Masahiko Asano , Yasuo Akutsu , Shuji Eguchi , Kunito Nakatsuru , Kaoru Uchiyama
发明人： Masahiko Asano , Yasuo Akutsu , Shuji Eguchi , Kunito Nakatsuru , Kaoru Uchiyama
IPC分类号： H01R12/00
CPC分类号： H05K5/0069 , H01L23/49811 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/165 , H01L2224/32225 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/19041 , H01L2924/19105 , H01R12/725 , Y10S439/949 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A device for controlling a vehicle 8 comprising a housing 3, a rectangular printed circuit board 4 which is fixed to the inside of the housing and has a control circuit thereon, and plugs 1a and 1b provided along one side of the rectangular printed circuit board 4 to transfer signals between the inside and the outside of said housing 3; wherein the plugs 1a and 1b respectively contain plug pins and the plug pins 2 are electrically connected to the printed circuit board 4 via bonding wires 5 inside the housing 3.
摘要翻译：一种用于控制车辆8的装置，包括壳体3，固定到壳体内部并且具有控制电路的矩形印刷电路板4，以及沿矩形印刷电路的一侧设置的插头1a和1b 板4在所述壳体3的内部和外部之间传递信号; 其中插头1a和1b分别包含插头销，并且插头销2通过壳体3内部的接合线5电连接到印刷电路板4。

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