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    • 43. 发明授权
    • Nonvolatile semiconductor memory device
    • 非易失性半导体存储器件
    • US07064379B2
    • 2006-06-20
    • US10873296
    • 2004-06-23
    • Hiroyuki KutsukakeKikuko Sugimae
    • Hiroyuki KutsukakeKikuko Sugimae
    • H01L29/788
    • H01L27/11521H01L21/764H01L27/115H01L27/11519H01L27/11524
    • A nonvolatile semiconductor memory device including a memory cell and a selection transistor, and the memory cell includes a floating gate formed on a semiconductor substrate via a first gate insulation film, a pair of first diffusion layers positioned on the opposite sides of the floating gate and formed in the substrate, first and second control gates formed on the opposite sides of the floating gate to drive the floating gate, and an inter-gate insulation film formed between the first and second control gates and the floating gate. The selection transistor includes a selection gate formed on the substrate via a second gate insulation film, and a pair of second diffusion layers formed in the substrate positioned on the opposite sides of the selection gate and one of which is electrically connected to one of the pair of first diffusion layers.
    • 一种包括存储单元和选择晶体管的非易失性半导体存储器件,并且所述存储单元包括经由第一栅极绝缘膜形成在半导体衬底上的浮置栅极,位于所述浮置栅极的相对侧上的一对第一扩散层和 形成在所述衬底中,形成在所述浮置栅极的相对侧上的驱动所述浮置栅极的第一和第二控制栅极以及形成在所述第一和第二控制栅极与所述浮置栅极之间的栅极间绝缘膜。 选择晶体管包括通过第二栅极绝缘膜形成在衬底上的选择栅极和形成在位于选择栅极的相对侧上的衬底中的一对第二扩散层,并且其中一个电连接到该对中的一个 的第一扩散层。
    • 44. 发明申请
    • Nonvolatile semiconductor memory device
    • 非易失性半导体存储器件
    • US20050023597A1
    • 2005-02-03
    • US10873296
    • 2004-06-23
    • Hiroyuki KutsukakeKikuko Sugimae
    • Hiroyuki KutsukakeKikuko Sugimae
    • G11C16/04H01L21/8247H01L27/115H01L29/788H01L29/792G11C11/34
    • H01L27/11521H01L21/764H01L27/115H01L27/11519H01L27/11524
    • A nonvolatile semiconductor memory device including a memory cell and a selection transistor, and the memory cell includes a floating gate formed on a semiconductor substrate via a first gate insulation film, a pair of first diffusion layers positioned on the opposite sides of the floating gate and formed in the substrate, first and second control gates formed on the opposite sides of the floating gate to drive the floating gate, and an inter-gate insulation film formed between the first and second control gates and the floating gate. The selection transistor includes a selection gate formed on the substrate via a second gate insulation film, and a pair of second diffusion layers formed in the substrate positioned on the opposite sides of the selection gate and one of which is electrically connected to one of the pair of first diffusion layers.
    • 一种包括存储单元和选择晶体管的非易失性半导体存储器件,并且所述存储单元包括经由第一栅极绝缘膜形成在半导体衬底上的浮置栅极,位于所述浮置栅极的相对侧上的一对第一扩散层和 形成在所述衬底中,形成在所述浮置栅极的相对侧上的驱动所述浮置栅极的第一和第二控制栅极以及形成在所述第一和第二控制栅极与所述浮置栅极之间的栅极间绝缘膜。 选择晶体管包括通过第二栅极绝缘膜形成在衬底上的选择栅极和形成在位于选择栅极的相对侧上的衬底中的一对第二扩散层,并且其中一个电连接到该对中的一个 的第一扩散层。
    • 45. 发明授权
    • Nonvolatile semiconductor memory device
    • 非易失性半导体存储器件
    • US08885414B2
    • 2014-11-11
    • US13602738
    • 2012-09-04
    • Hiroyuki Kutsukake
    • Hiroyuki Kutsukake
    • G11C11/34G11C16/30G11C16/10H01L27/115G11C16/16G11C16/04
    • G11C16/14G11C16/0483G11C16/10G11C16/16G11C16/30H01L27/11546
    • A nonvolatile semiconductor memory device of an embodiment includes a p-type semiconductor substrate, a first P-well formed in the semiconductor substrate, and on which a plurality of memory cells is formed, an first N-well surrounding the first P-well and electrically separating the first P-well from the semiconductor substrate, a first negative voltage generation unit configured to generate a first negative voltage, a boost unit configured to boost a voltage and generate a boosted voltage, and a well voltage transmission unit connected to the first negative voltage generation unit, the boost unit, and the first P-well, and configured to switch a voltage between the first negative voltage and the boosted voltage, the voltage being applied to the first P-well.
    • 实施例的非易失性半导体存储器件包括p型半导体衬底,在半导体衬底中形成的第一P阱,并且其上形成有多个存储单元,围绕第一P阱的第一N阱以及 将第一P阱与半导体衬底电分离,配置为产生第一负电压的第一负电压产生单元,被配置为升高电压并产生升压电压的升压单元,以及连接到第一P阱的第一 负电压产生单元,升压单元和第一P阱,并且被配置为在第一负电压和升压电压之间切换电压,该电压被施加到第一P阱。
    • 47. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20130069133A1
    • 2013-03-21
    • US13415010
    • 2012-03-08
    • Yoshiko KATOHiroyuki KUTSUKAKE
    • Yoshiko KATOHiroyuki KUTSUKAKE
    • H01L29/78
    • H01L27/11558H01L27/11531
    • A semiconductor device, includes: a semiconductor substrate; a first conductivity type well and a second conductivity type well; a first active area; a second active area; a first well contact layer; a plurality of first source/drain layers; a first gate insulating film; a first gate electrode; a second well contact layer; a plurality of second source/drain layers; a second gate insulating film; and a second gate electrode. The first well contact layer is formed in the first active area at one end part in the one direction. The one end parts in each of the first active areas and in each of the second active areas are mutually on the same side.
    • 一种半导体器件,包括:半导体衬底; 第一导电类型井和第二导电类型井; 第一个活跃区域; 第二个活跃区域; 第一阱接触层; 多个第一源极/漏极层; 第一栅极绝缘膜; 第一栅电极; 第二阱接触层; 多个第二源极/漏极层; 第二栅绝缘膜; 和第二栅电极。 第一阱接触层在一个方向上的一个端部的第一有源区域中形成。 第一有效区域和第二有源区域中的每一个中的一端部分彼此相同。
    • 48. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US08400812B2
    • 2013-03-19
    • US13231510
    • 2011-09-13
    • Hiroyuki KutsukakeKikuko SugimaeMitsuhiro Noguchi
    • Hiroyuki KutsukakeKikuko SugimaeMitsuhiro Noguchi
    • G11C5/06G11C5/02G11C16/04
    • G11C16/0483G11C5/063G11C8/14H01L27/0207H01L27/088H01L27/11519H01L27/11529
    • According to one embodiment, a semiconductor memory device includes a memory array and a peripheral circuit. The memory array has a plurality of memory cells, word lines, and bit lines, in which a first, second, and third blocks are set in the order along the bit line. The peripheral circuit has a transistor group. The transistor group includes a first transfer transistor belonging to the first block, a second transfer transistor belonging to the second block, and a third transfer transistor belonging to the third block. The first, second, and third transfer transistors share the other of a source and a drain of each. With regard to a direction in which either of the source and the drain is connected to the other in each of the first, second, and third transfer transistors, the directions of the adjacent transfer transistors are different from each other by 90° or 180°.
    • 根据一个实施例,半导体存储器件包括存储器阵列和外围电路。 存储器阵列具有多个存储单元,字线和位线,其中按照位线的顺序设置第一,第二和第三块。 外围电路具有晶体管组。 晶体管组包括属于第一块的第一转移晶体管,属于第二块的第二转移晶体管和属于第三块的第三转移晶体管。 第一,第二和第三转移晶体管共享每个的源极和漏极中的另一个。 关于源极和漏极中的任一个与第一,第二和第三转移晶体管中的每一个连接到另一个的方向,相邻的转移晶体管的方向彼此相差90°或180° 。
    • 49. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US08294221B2
    • 2012-10-23
    • US12952637
    • 2010-11-23
    • Yoshiko KatoHiroyuki KutsukakeMasayuki Ichige
    • Yoshiko KatoHiroyuki KutsukakeMasayuki Ichige
    • H01L21/70
    • H01L27/11521H01L27/11519
    • According to one embodiment, a semiconductor memory device includes a plurality of memory cell blocks, a plurality of first wirings, a plurality of second wirings, and a contact. Each of the memory cell blocks includes a plurality of memory cell units. Each of the plurality of memory cell units includes a plurality of memory cells and is provided in a first direction at a prescribed spacing. The plurality of memory cell blocks is arranged in a second direction intersecting with the first direction. The plurality of first wirings extends in the second direction and is provided in the first direction at a prescribed spacing. The plurality of second wirings is provided at least one of above and below the first wiring. The contact is provided at both end portions of the second wiring in the second direction and connects the first wiring to the second wiring. A width dimension of the second wiring along the first direction is larger than a width dimension of the first wiring along the first direction.
    • 根据一个实施例,半导体存储器件包括多个存储器单元块,多个第一布线,多个第二布线和一个触点。 每个存储单元块包括多个存储单元单元。 多个存储单元单元中的每一个包括多个存储单元,并且以规定间隔沿第一方向设置。 多个存储单元块被布置在与第一方向交叉的第二方向上。 多个第一配线在第二方向上延伸并且以规定间隔沿第一方向设置。 多个第二布线被设置在第一布线的上方和下方中的至少一个。 在第二方向的第二配线的两端设置接点,将第一配线连接到第二配线。 沿着第一方向的第二布线的宽度尺寸大于沿着第一方向的第一布线的宽度尺寸。
    • 50. 发明申请
    • NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
    • 非易失性半导体存储器件及其制造方法
    • US20120193698A1
    • 2012-08-02
    • US13234644
    • 2011-09-16
    • Mitsuhiko NODAHiroyuki KutsukakeMitsuhiro Noguchi
    • Mitsuhiko NODAHiroyuki KutsukakeMitsuhiro Noguchi
    • H01L29/788H01L21/28
    • H01L29/7881H01L21/28273H01L27/11543H01L29/42324
    • According to one embodiment, a nonvolatile semiconductor memory device includes an element region, a gate insulating film, a first gate electrode, an intergate insulating film, a second gate electrode and an element isolation region. The gate insulating film is formed on the element region. The first gate electrode is formed on the gate insulating film. The intergate insulating film is formed on the first gate electrode and has an opening. The second gate electrode is formed on the intergate insulating film and in contact with the first gate electrode via the opening. The element isolation region encloses a laminated structure formed by the element region, the gate insulating film, and the first gate electrode. The air gap is formed between the element isolation region and side surfaces of the element region, the gate insulating film and the first gate electrode.
    • 根据一个实施例,非易失性半导体存储器件包括元件区域,栅极绝缘膜,第一栅极电极,栅极间绝缘膜,第二栅极电极和元件隔离区域。 栅极绝缘膜形成在元件区域上。 第一栅电极形成在栅极绝缘膜上。 栅极绝缘膜形成在第一栅电极上并具有开口。 第二栅电极形成在栅间绝缘膜上并经由开口与第一栅电极接触。 元件隔离区域包围由元件区域,栅极绝缘膜和第一栅极电极形成的层叠结构。 在元件隔离区域和元件区域,栅极绝缘膜和第一栅极电极的侧表面之间形成气隙。