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41. 发明申请

US20080088008A1 SEMICONDUCTOR PACKAGE HAVING PAD ARRANGEMENT 审中-公开
标题翻译：具有扁平布置的半导体封装
公开(公告)号：US20080088008A1
公开(公告)日：2008-04-17
申请号：US11858244
申请日：2007-09-20
申请人： Hyun-A KIM , Dong-Han KIM
发明人： Hyun-A KIM , Dong-Han KIM
IPC分类号： H01L23/52
CPC分类号： H01L23/50 , H01L23/4985 , H01L24/06 , H01L24/41 , H01L2224/05554 , H01L2224/06154 , H01L2224/41175 , H01L2924/00014 , H01L2924/14 , H01L2224/37099
摘要： A semiconductor package includes a semiconductor chip, multiple first outer connection pads positioned along a first edge of the semiconductor chip in a first direction, and multiple first outer connection leads electrically connected to the first outer connection pads. Multiple first power pads extend from the first edge of the semiconductor chip in a second direction substantially perpendicular to the first direction. A first power lead is electrically connected to the first power pads.
摘要翻译：半导体封装包括半导体芯片，沿着第一方向沿着半导体芯片的第一边缘定位的多个第一外部连接焊盘以及电连接到第一外部连接焊盘的多个第一外部连接引线。多个第一电源焊盘从基本上垂直于第一方向的第二方向从半导体芯片的第一边缘延伸。第一电源引线电连接到第一电源焊盘。

42. 发明申请

US20080054261A1 SEMICONDUCTOR PACKAGE HAVING TEST PADS ON TOP AND BOTTOM SUBSTRATE SURFACES AND METHOD OF TESTING SAME 有权
标题翻译：具有顶部和底部底板表面上的测试垫的半导体封装及其测试方法
公开(公告)号：US20080054261A1
公开(公告)日：2008-03-06
申请号：US11758176
申请日：2007-06-05
申请人： Eun-seok SONG , Dong-han KIM , Hee-seok LEE
发明人： Eun-seok SONG , Dong-han KIM , Hee-seok LEE
IPC分类号： H01L23/58 , G01R31/26
CPC分类号： G01R31/2884 , H01L22/32 , H01L2924/0002 , H01L2924/15311 , H01L2924/00
摘要： A semiconductor package and testing method is disclosed. The package includes a substrate having top and bottom surfaces, a semiconductor chip mounted in a centrally located semiconductor chip mounting area of the substrate, and a plurality of test pads disposed on top and bottom surfaces of the substrate and comprising a first group of test pads configured on the top and bottom surfaces of the substrate and having a first height above the respective top and bottom surface of the substrate, and a second group of test pads disposed on the lower surface of the substrate and having a second height greater than the first, wherein each one of the second group of test pads includes a solder ball attached thereto.
摘要翻译：公开了半导体封装和测试方法。封装包括具有顶表面和底表面的衬底，安装在衬底的位于中心的半导体芯片安装区域中的半导体芯片以及设置在衬底的顶表面和底表面上的多个测试焊盘，并且包括第一组测试焊盘配置在衬底的顶表面和底表面上并且具有在衬底的相应顶部和底部表面上方的第一高度，以及设置在衬底的下表面上并具有大于第一衬底的第二高度的第二组测试焊盘其中第二组测试垫中的每一个包括附接到其上的焊球。

43. 发明申请

US20070216016A1 Heat-radiating tape carrier package and method for manufacturing the same 有权
标题翻译：散热带载体包装及其制造方法
公开(公告)号：US20070216016A1
公开(公告)日：2007-09-20
申请号：US11585962
申请日：2006-10-25
申请人： Yun-Hyeok Im , Dong-Han Kim , Jae-Wook Yoo
发明人： Yun-Hyeok Im , Dong-Han Kim , Jae-Wook Yoo
IPC分类号： H01L23/52
CPC分类号： H01L23/4334 , H01L23/49572 , H01L24/50 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/181 , H01L2924/00
摘要： A tape carrier package may include an interposer having a first surface and a second surface. The first surface of the interposer may be attached to an exposed active surface of a semiconductor chip. A heat sink may be attached to the second surface of the interposer.
摘要翻译：带状载体封装可以包括具有第一表面和第二表面的插入件。插入器的第一表面可以附接到半导体芯片的暴露的有源表面。散热器可以附接到插入件的第二表面。

44. 发明授权

US07179065B2 Linear compressor 有权
标题翻译：线性压缩机
公开(公告)号：US07179065B2
公开(公告)日：2007-02-20
申请号：US11191902
申请日：2005-07-29
申请人： Dong Han Kim
发明人： Dong Han Kim
IPC分类号： F04B17/04 , F04B35/04
CPC分类号： F04B35/045 , F04B39/102
摘要： Disclosed herein is a linear compressor. In the present invention, a spring sheet is equipped in an exhale cover to prevent an edge and an outer circumference of an exhale spring from touching with the exhale cover. A surface of the spring sheet is treated with a metal of the high hardness, thereby protecting against its abrasion and transformation, caused by a repetitive load from the exhale spring. Furthermore, the durability is improved by enduring the excessive or local load from the exhale spring.
摘要翻译：本文公开了一种线性压缩机。在本发明中，弹簧片配置在呼气罩中，以防止呼气弹簧的边缘和外周与呼气罩接触。弹簧片的表面用高硬度的金属处理，从而防止由于呼气弹簧的重复载荷引起的磨损和变形。此外，通过忍受来自呼气弹簧的过量或局部负荷来提高耐久性。

45. 发明申请

US20070034404A1 Tab tape for tape carrier package 有权
标题翻译：贴带胶带用于胶带载体包装
公开(公告)号：US20070034404A1
公开(公告)日：2007-02-15
申请号：US11341614
申请日：2006-01-30
申请人： Na-Rae Shin , Dong-Han Kim
发明人： Na-Rae Shin , Dong-Han Kim
IPC分类号： H05K7/06
CPC分类号： H05K1/0271 , H01L23/49838 , H01L23/4985 , H01L2924/0002 , H05K1/0393 , H05K1/118 , H05K2201/0969 , H05K2201/09727 , H05K2201/09781 , H01L2924/00
摘要： A TAB tape for a tape carrier package may have an opening formed in a shortest connection portion. The opening may be provided in the shortest connection portion and a portion of the corresponding second lead. The opening may be arranged near a boundary between the corresponding first lead and the shortest connection portion. The opening may be sized to reduce the change of the lead width from the first lead to the second lead.
摘要翻译：用于载带封装的TAB带可以具有形成在最短连接部分中的开口。开口可以设置在最短连接部分和相应的第二引线的一部分中。开口可以布置在相应的第一引线和最短连接部分之间的边界附近。该开口的尺寸可以减小引线宽度从第一引线到第二引线的变化。

46. 发明申请

US20070015338A1 Substrate applicable to both wire bonding and flip chip bonding, smart card modules having the substrate and methods for fabricating the same 审中-公开
标题翻译：适用于引线接合和倒装芯片接合的基板，具有基板的智能卡模块及其制造方法
公开(公告)号：US20070015338A1
公开(公告)日：2007-01-18
申请号：US11487484
申请日：2006-07-17
申请人： Seok-Won Lee , Kyoung-Sei Choi , Dong-Han Kim , Young-Hoon Ro
发明人： Seok-Won Lee , Kyoung-Sei Choi , Dong-Han Kim , Young-Hoon Ro
IPC分类号： H01L21/76
CPC分类号： H01L23/49855 , H01L21/563 , H01L23/3121 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/85 , H01L24/90 , H01L2221/68377 , H01L2224/0401 , H01L2224/05599 , H01L2224/16225 , H01L2224/26175 , H01L2224/32057 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/484 , H01L2224/73204 , H01L2224/73265 , H01L2224/8121 , H01L2224/81815 , H01L2224/83102 , H01L2224/83192 , H01L2224/83385 , H01L2224/85399 , H01L2224/90 , H01L2224/92125 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/15151 , H01L2924/181 , H05K3/244 , H05K3/4084 , H05K2201/0394 , H05K2201/09472 , H05K2201/09509 , H05K2203/049 , H05K2203/1189 , H05K2203/1461 , H01L2224/45099 , H01L2924/00012 , H01L2924/00
摘要： A substrate, a smart card module having the substrate and methods for fabricating the same are provided. A substrate having metal patterns formed on both sides and applicable to both wire bonding and flip chip bonding, a smart card module having the same and methods of fabricating the same are also provided. The substrate may include an insulating layer, an upper metal pattern, a bottom metal pattern, a first plating layer, a second plating layer and a substrate. The insulating layer may have a plurality of via holes. The upper metal pattern may be formed on the insulating layer and side surfaces of the plurality of via holes. The bottom metal pattern may be formed on the bottom of the insulating layer and electrically connected to the upper metal pattern. The first plating layer may be formed on the upper metal pattern and the upper surface of the bottom metal pattern. The second plating layer may be formed on the bottom of the bottom metal pattern. The substrate may include contact holes having side surfaces of the plurality of via holes covered by the upper metal pattern and the first plating layer. The bottom surface of the insulating layer may be supported by the bottom metal pattern and the first plating layer.
摘要翻译：提供基板，具有基板的智能卡模块及其制造方法。还提供了一种具有形成在两面上并且适用于引线接合和倒装芯片接合的金属图案的基板，具有该金属图案的智能卡模块及其制造方法。基板可以包括绝缘层，上金属图案，底金属图案，第一镀层，第二镀层和基板。绝缘层可以具有多个通孔。上部金属图案可以形成在多个通孔的绝缘层和侧表面上。底部金属图案可以形成在绝缘层的底部并且电连接到上部金属图案。第一镀层可以形成在上金属图案和底部金属图案的上表面上。第二镀层可以形成在底部金属图案的底部上。基板可以包括具有由上金属图案和第一镀层覆盖的多个通孔的侧表面的接触孔。绝缘层的底面可以由底部金属图案和第一镀层支撑。

47. 发明申请

US20070013396A1 UNIVERSAL PCB AND SMART CARD USING THE SAME 失效
标题翻译：通用PCB和智能卡使用相同
公开(公告)号：US20070013396A1
公开(公告)日：2007-01-18
申请号：US11457734
申请日：2006-07-14
申请人： Dong-Han KIM , Young-Hoon RO
发明人： Dong-Han KIM , Young-Hoon RO
IPC分类号： G01R31/02
CPC分类号： G06K19/077 , G06K19/07743 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H05K1/0286 , H01L2924/00014
摘要： A smart card is provided including a body with a cavity, an IC chip inserted into the cavity, and a universal PCB on which the IC chip can be mounted and electrically contacted regardless of its size, type and bonding structure. The universal PCB comprises groups of contact pads suitable for contacting IC chips of different sizes and designs.
摘要翻译：提供了一种智能卡，包括具有空腔的主体，插入到空腔中的IC芯片，以及通用PCB，IC芯片可以安装在该通用PCB上，而不管其大小，类型和结合结构如何。通用PCB包括适于接触不同尺寸和设计的IC芯片的接触焊盘组。

48. 发明申请

US20060233270A1 Method and apparatus for uplink carrier frequency synchronization and antenna weight vector estimation in OFDMA system having smart antenna 失效
标题翻译：具有智能天线的OFDMA系统中的上行链路载波频率同步和天线权重向量估计的方法和装置
公开(公告)号：US20060233270A1
公开(公告)日：2006-10-19
申请号：US11303484
申请日：2005-12-16
申请人： Jae-Young Ahn , Yong-Soo Cho , Dong-Han Kim
发明人： Jae-Young Ahn , Yong-Soo Cho , Dong-Han Kim
IPC分类号： H04K1/10
CPC分类号： H04L27/2657 , H04B7/0851 , H04L27/2675
摘要： Provided are a method and apparatus for uplink carrier frequency synchronization and antenna weight vector estimation in an Orthogonal Frequency Division Multiple Access System (OFDMA) having a smart antenna. The inventive method comprises the steps of receiving and storing training symbols in the time domain transmitted to estimate an antenna weight vector during a training symbol transmission interval; estimating carrier frequency offsets using training symbols in the frequency domain that are obtained by performing a Fast Fourier Transformation (FFT) algorithm with respect to the training symbols received during the training symbol transmission interval; compensating the stored training symbols in the time domain based on the estimated carrier frequency offsets; and estimating an antenna weight vector using training symbols in the frequency domain that are obtained by applying an FFT algorithm with respect to the training symbols in the time domain derived by compensating the carrier frequency offsets during the training symbol transmission interval.
摘要翻译：提供了一种具有智能天线的正交频分多址系统（OFDMA）中的上行链路载波频率同步和天线权重向量估计的方法和装置。本发明的方法包括以下步骤：在训练符号发送间隔期间，在发送的时域中接收和存储训练符号以估计天线权重向量; 使用通过针对在训练符号传输间隔期间接收到的训练符号执行快速傅里叶变换（FFT）算法获得的频域中的训练符号来估计载波频率偏移; 基于估计的载波频率偏移补偿在时域中存储的训练符号; 以及使用通过在训练符号发送间隔期间通过补偿载波频率偏移导出的时域中的训练符号应用FFT算法获得的频域中的训练符号来估计天线权重向量。

49. 发明申请

US20060113648A1 Semiconductor chip and tab package having the same 有权
标题翻译：具有相同的半导体芯片和接头封装
公开(公告)号：US20060113648A1
公开(公告)日：2006-06-01
申请号：US11261260
申请日：2005-10-28
申请人： Ye-Chung Chung , Dong-Han Kim , Sa-Yoon Kang
发明人： Ye-Chung Chung , Dong-Han Kim , Sa-Yoon Kang
IPC分类号： H01L23/02
CPC分类号： H01L23/49838 , H01L21/4839 , H01L23/49572 , H01L23/4985 , H01L24/13 , H01L24/17 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/13099 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor chip, having an active surface including a peripheral area and a central area, presents a connection area formed on a portion of the peripheral area. The semiconductor chip includes output pads formed in the peripheral area of the active surface and input pads formed in the central area of the active surface. The input pads may be connected to wiring patterns of a TAB tape passing over the connection area.
摘要翻译：具有包括周边区域和中心区域的活性表面的半导体芯片具有形成在周边区域的一部分上的连接区域。半导体芯片包括形成在有源表面的周边区域中的输出焊盘和形成在有源表面的中心区域中的输入焊盘。输入焊盘可以连接到通过连接区域的TAB磁带的布线图案。

50. 发明申请

US20060093506A1 Scroll compressor 审中-公开
标题翻译：涡旋压缩机
公开(公告)号：US20060093506A1
公开(公告)日：2006-05-04
申请号：US11178450
申请日：2005-07-12
申请人： Dong-Han Kim
发明人： Dong-Han Kim
IPC分类号： F01C1/02 , F04C2/00 , F01C1/063 , F04C18/00 , F03C2/00
CPC分类号： F04C29/0021 , F04C18/0215
摘要： A scroll compressor includes an orbiting scroll orbiting and having a boss in which an eccentric portion of a rotating shaft is inserted, a main frame having a pocket in which a boss of the orbiting scroll is inserted and a thrust bearing surface to which a thrust bearing surface of the orbiting scroll is supported, and an elastic support portion installed at an upper surface of the main frame and functioning as a buffer so as to prevent abrasion of the thrust bearing surface by being elastically deformed when the orbiting scroll is deformed. Thus, although the orbiting scroll is deformed during compression, the scroll compressor can reduce a friction loss between the thrust bearing surfaces of the orbiting scroll and the main frame and prevent abrasion of the thrust bearing surfaces.
摘要翻译：涡旋压缩机包括绕动涡旋盘旋转的涡旋盘，其具有插入旋转轴的偏心部的凸台，具有凹槽的主框架，其中绕动涡旋盘的凸台被插入其中，推力轴承表面支撑绕动涡盘的表面，以及弹性支撑部，其安装在主框架的上表面并用作缓冲器，以防止当绕动涡旋件变形时弹性变形推力轴承表面的磨损。因此，涡旋压缩机虽然在压缩过程中变形，但也可以减小绕动涡盘的推力轴承面与主机架之间的摩擦损失，并防止推力轴承面的磨损。

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