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41. 发明授权

US08555719B2 MEMS sensor with folded torsion springs 有权
标题翻译：具有折叠扭力弹簧的MEMS传感器
公开(公告)号：US08555719B2
公开(公告)日：2013-10-15
申请号：US13012643
申请日：2011-01-24
申请人： Andrew C. McNeil , Gary G. Li
发明人： Andrew C. McNeil , Gary G. Li
IPC分类号： G01P15/125
CPC分类号： G01P15/125 , G01P2015/0831 , G01P2015/086
摘要： A microelectromechanical systems (MEMS) sensor (40) includes a substrate (46) and a suspension anchor (54) formed on a planar surface (48) of the substrate (46). A first folded torsion spring (58) and a second folded torsion spring (60) interconnect the movable element (56) with the suspension anchor (54) to suspend the movable element (56) above the substrate (46). The folded torsion springs (58, 60) are each formed from multiple segments (76) that are linked together by bar elements (78) in a serpentine fashion. The folded torsion springs (58, 60) have an equivalent shape and are oriented relative to one another in rotational symmetry about a centroid (84) of the suspension anchor (54).
摘要翻译：微机电系统（MEMS）传感器（40）包括形成在基板（46）的平面（48）上的基板（46）和悬挂锚（54）。第一折叠扭簧（58）和第二折叠扭簧（60）将可移动元件（56）与悬挂锚固件（54）相互连接，以将可移动元件（56）悬置在基板（46）上方。折叠的扭转弹簧（58,60）各自由多个段（76）形成，所述多个段（76）通过杆元件（78）以蛇形方式连接在一起。折叠的扭转弹簧（58,60）具有等效的形状并且相对于彼此以悬挂锚定件（54）的重心（84）为中心的旋转对称定向。

42. 发明申请

US20130047726A1 ANGULAR RATE SENSOR WITH DIFFERENT GAP SIZES 审中-公开
标题翻译：具有不同间隙尺寸的角速率传感器
公开(公告)号：US20130047726A1
公开(公告)日：2013-02-28
申请号：US13219071
申请日：2011-08-26
申请人： Yizhen Lin , Andrew C. McNeil
发明人： Yizhen Lin , Andrew C. McNeil
IPC分类号： G01P15/08
CPC分类号： G01C19/5712
摘要： An angular rate sensor (20) includes conductive plates (24, 26, 28, 30) mounted on a substrate (22), and a structure (34) coupled to the substrate (22). The structure (34) includes a drive mass (36) and a sense mass (40) suspended above the plates (24, 26, 28, 30). The sense mass (40) includes regions (50, 52) separated by a sense axis of rotation (48). Each of the regions (50, 52) has an outer surface (56) and an inner surface (54). An inner gap (68) exists between the inner surface (54) and plates (24, 26, 28). An outer gap (70) exists between the outer surface (56) and the plate (30). The outer gap (70) is larger than the inner gap (68). Plates (24, 26, 28) may be electrodes for force feedback, frequency tuning, and/or quadrature compensation. Plates (30) may be electrodes for sensing angular velocity.
摘要翻译：角速率传感器（20）包括安装在基板（22）上的导电板（24,26,28,30）和耦合到基板（22）的结构（34）。结构（34）包括悬挂在板（24,26,28,30）上方的驱动质量块（36）和感测质量块（40）。感测质量块（40）包括由感测旋转轴线（48）分开的区域（50,52）。每个区域（50,52）具有外表面（56）和内表面（54）。在内表面（54）和板（24,26,28）之间存在内部间隙（68）。在外表面（56）和板（30）之间存在外部间隙（70）。外部间隙（70）大于内部间隙（68）。板（24,26,28）可以是用于力反馈，频率调谐和/或正交补偿的电极。板（30）可以是用于感测角速度的电极。

43. 发明申请

US20120262026A1 MEMS DEVICE WITH CENTRAL ANCHOR FOR STRESS ISOLATION 有权
标题翻译：具有中心锚杆的应力分离的MEMS装置
公开(公告)号：US20120262026A1
公开(公告)日：2012-10-18
申请号：US13088579
申请日：2011-04-18
申请人： Yizhen Lin , Gary G. Li , Andrew C. McNeil , Lisa Z. Zhang , Todd F. Miller
发明人： Yizhen Lin , Gary G. Li , Andrew C. McNeil , Lisa Z. Zhang , Todd F. Miller
IPC分类号： H02N11/00
CPC分类号： B81B3/0072 , B81B2203/0136 , B81B2203/0307
摘要： A MEMS device (20) includes a proof mass (32) coupled to and surrounding an immovable structure (30). The immovable structure (30) includes fixed fingers (36, 38) extending outwardly from a body (34) of the structure (30). The proof mass (32) includes movable fingers (60), each of which is disposed between a pair (62) of the fixed fingers (36, 38). A central area (42) of the body (34) is coupled to an underlying substrate (24), with the remainder of the immovable structure (30) and the proof mass (32) being suspended above the substrate (24) to largely isolate the MEMS device (20) from package stress, Additionally, the MEMS device (20) includes isolation trenches (80) and interconnects (46, 50, 64) so that the fixed fingers (36), the fixed fingers (38), and the movable fingers (60) are electrically isolated from one another to yield a differential device configuration.
摘要翻译： MEMS装置（20）包括联接到并围绕不可移动结构（30）的检验质量块（32）。不动结构（30）包括从结构（30）的主体（34）向外延伸的固定指状物（36,38）。检测质量块（32）包括可动指状物（60），每个指状物设置在固定指状物（36,38）的一对（62）之间。主体（34）的中心区域（42）联接到下面的基板（24），其中不可移动的结构（30）的其余部分和证明质量块（32）悬挂在基板（24）上方以大大隔离另外，MEMS器件（20）包括隔离沟槽（80）和互连（46,50,64），使得固定指状物（36），固定指状物（38）和可动指状物（60）彼此电隔离以产生差分装置构型。

44. 发明申请

US20120204642A1 MEMS Device Having Variable Gap Width and Method of Manufacture 有权
标题翻译：具有可变间隙宽度的MEMS器件和制造方法
公开(公告)号：US20120204642A1
公开(公告)日：2012-08-16
申请号：US13028930
申请日：2011-02-16
申请人： Andrew C. McNeil , Yizhen Lin , Lisa Z. Zhang
发明人： Andrew C. McNeil , Yizhen Lin , Lisa Z. Zhang
IPC分类号： G01P15/125 , H05K3/02
CPC分类号： B81B3/0056 , B81B7/02 , B81B2201/0235 , B81B2203/058 , B81B2203/06 , G01P15/0802 , G01P15/125 , G01P2015/0831 , H01L21/6835 , H01L22/34 , H01L2924/1461 , Y10T29/49156
摘要： A MEMS device (40) includes a base structure (42) and a microstructure (44) suspended above the structure (42). The base structure (42) includes an oxide layer (50) formed on a substrate (48), a structural layer (54) formed on the oxide layer (50), and an insulating layer (56) formed over the structural layer (54). A sacrificial layer (112) is formed overlying the base structure (42), and the microstructure (44) is formed in another structural layer (116) over the sacrificial layer (112). Methodology (90) entails removing the sacrificial layer (112) and a portion of the oxide layer (50) to release the microstructure (44) and to expose a top surface (52) of the substrate (48). Following removal, a width (86) of a gap (80) produced between the microstructure (44) and the top surface (52) is greater than a width (88) of a gap (84) produced between the microstructure (44) and the structural layer (54).
摘要翻译： MEMS器件（40）包括基部结构（42）和悬挂在结构（42）上方的微结构（44）。基底结构（42）包括形成在基板（48）上的氧化物层（50），形成在氧化物层（50）上的结构层（54）和形成在结构层（54）上的绝缘层）。牺牲层（112）形成在基部结构（42）上方，并且微结构（44）形成在牺牲层（112）上方的另一个结构层（116）中。方法（90）需要去除牺牲层（112）和氧化物层（50）的一部分以释放微结构（44）并暴露衬底（48）的顶表面（52）。在移除之后，在微结构（44）和顶表面（52）之间产生的间隙（80）的宽度（86）大于在微结构（44）和微结构（44）之间产生的间隙（84）的宽度（88）结构层（54）。

45. 发明授权

US08096182B2 Capacitive sensor with stress relief that compensates for package stress 有权
标题翻译：具有应力消除的电容式传感器可补偿封装应力
公开(公告)号：US08096182B2
公开(公告)日：2012-01-17
申请号：US12129548
申请日：2008-05-29
申请人： Yizhen Lin , Andrew C. McNeil
发明人： Yizhen Lin , Andrew C. McNeil
IPC分类号： G01P15/125
CPC分类号： H01L27/1203 , G01P15/125 , G01P21/00 , G01P2015/0831 , H01L28/40 , H01L28/60 , Y10T29/49002
摘要： A microelectromechanical systems (MEMS) capacitive sensor (52) includes a movable element (56) pivotable about a rotational axis (68) offset between ends (80, 84) thereof. A static conductive layer (58) is spaced away from the movable element (56) and includes electrode elements (62, 64). The movable element (56) includes a section (74) between the rotational axis (68) and one end (80) that exhibits a length (78). The movable element (56) further includes a section (76) between the rotational axis (68) and the other end (84) that exhibits a length (82) that is less than the length (78) of the section (74). The section (74) includes slots (88) extending through movable element (56) from the end (80) toward the rotational axis (68). The slots (88) provide stress relief in section (74) that compensates for package stress to improve sensor performance.
摘要翻译：微电子机械系统（MEMS）电容传感器（52）包括可围绕其端部（80,84）之间偏移的旋转轴线（68）枢转的可移动元件（56）。静电导电层（58）与可动元件（56）间隔开并且包括电极元件（62,64）。可移动元件（56）包括在旋转轴线（68）和呈现长度（78）的一端（80）之间的部分（74）。可移动元件（56）还包括在旋转轴线（68）和另一端（84）之间的部分（76），该部分具有小于部分（74）的长度（78）的长度（82）。部分（74）包括从端部（80）朝向旋转轴线（68）延伸穿过可移动元件（56）的槽（88）。槽（88）在部分（74）中提供应力释放，其补偿包装应力以改善传感器性能。

46. 发明申请

US20090255339A1 RESONANT ACCELEROMETER WITH LOW SENSITIVITY TO PACKAGE STRESS 有权
标题翻译：对包装应力敏感性低的共振加速度计
公开(公告)号：US20090255339A1
公开(公告)日：2009-10-15
申请号：US12102645
申请日：2008-04-14
申请人： Andrew C. McNeil , Yizhen Lin
发明人： Andrew C. McNeil , Yizhen Lin
IPC分类号： G01P15/097 , H02K15/00
CPC分类号： G01P15/097 , B81B3/0072 , B81B2201/0235 , B81B2203/0307 , G01P15/0802 , G01P15/18 , G01P2015/084 , Y10T29/49009
摘要： A resonant accelerometer (24) includes a single anchor (28) fixed to a substrate (32). A proof mass (34) is positioned above a surface (30) of the substrate (32) and is positioned symmetrically about the anchor (28). The proof mass (34) has a central opening (38). Each of a number of suspension beams (42, 44, 46, 48) resides in the central opening (38) and has one end (50) affixed to the anchor (28) and another end (52) attached to an inner peripheral wall (40) of the proof mass (34). A resonant frequency of the beams (42, 44) in a direction (64) aligned with a common axis (58) of the beams (42, 44) changes according to acceleration in the direction (64). A resonant frequency of the beams (46, 48) in a direction (66) aligned with a common axis (62) of the beams (46, 48) changes according to acceleration in the direction (66).
摘要翻译：谐振加速度计（24）包括固定到基板（32）上的单个锚（28）。校准质量块（34）位于衬底（32）的表面（30）上方，并且围绕锚（28）对称地定位。检测质量块（34）具有中心孔（38）。多个悬挂梁（42,44,46,48）中的每一个都位于中央开口（38）中，并且具有固定到锚固件（28）的一个端部（50），并且另一个端部（52）附接到内周壁（34）的（40）。在与梁（42,44）的公共轴（58）对准的方向（64）上的梁（42,44）的共振频率根据方向（64）的加速度而变化。在与梁（46,48）的共同轴线（62）对准的方向（66）上的梁（46,48）的共振频率根据方向（66）的加速度而变化。

47. 发明授权

US07578190B2 Symmetrical differential capacitive sensor and method of making same 有权
标题翻译：对称差动电容式传感器及其制作方法
公开(公告)号：US07578190B2
公开(公告)日：2009-08-25
申请号：US11833476
申请日：2007-08-03
申请人： Yizhen Lin , Marco Fuhrmann , Andrew C. McNeil
发明人： Yizhen Lin , Marco Fuhrmann , Andrew C. McNeil
IPC分类号： G01P15/00 , G01P15/125
CPC分类号： G01P15/125 , G01P2015/0831
摘要： A symmetrical differential capacitive sensor (60) includes a movable element (66) pivotable about a geometrically centered rotational axis (70). The element (66) includes sections (86, 88). Each of the sections (86, 88) has a stop (94, 96) spaced equally away from the rotational axis (70). Each of the sections (86, 88) also has a different configuration (104, 108) of apertures (102, 106). The configurations (104, 108) of apertures (102, 106) create a mass imbalance between the sections (86, 88) so that the element (66) pivots about the rotational axis (70) in response to acceleration. The apertures (102, 106) also facilitate etch release during manufacturing and reduce air damping when the element (66) rotates. Apertures (126, 128) are formed in electrodes (78, 80) underlying the apertures (102, 106) to match the capacitance between the two sections (86, 88) of movable element (86) to provide the same bi-directional actuation capability.
摘要翻译：对称差分电容传感器（60）包括可围绕几何中心的旋转轴线（70）枢转的可移动元件（66）。元件（66）包括部分（86,88）。每个部分（86,88）具有与旋转轴线（70）等距离间隔的止挡件（94,96）。每个部分（86,88）还具有不同的孔（102,106）的构造（104,108）。孔（102,106）的构造（104,108）在各部分（86,88）之间产生质量不平衡，使得元件（66）响应加速度绕旋转轴线（70）枢转。孔（102,106）还有助于制造过程中的蚀刻释放并且当元件（66）旋转时减小空气阻尼。孔径（126,128）形成在孔（102,106）下面的电极（78,80）中，以匹配可移动元件（86）的两个部分（86,88）之间的电容，以提供相同的双向致动能力。

48. 发明申请

US20090031809A1 SYMMETRICAL DIFFERENTIAL CAPACITIVE SENSOR AND METHOD OF MAKING SAME 有权
标题翻译：对称差分电容式传感器及其制造方法
公开(公告)号：US20090031809A1
公开(公告)日：2009-02-05
申请号：US11833476
申请日：2007-08-03
申请人： Yizhen Lin , Marco Fuhrmann , Andrew C. McNeil
发明人： Yizhen Lin , Marco Fuhrmann , Andrew C. McNeil
IPC分类号： G01P15/125
CPC分类号： G01P15/125 , G01P2015/0831
摘要： A symmetrical differential capacitive sensor (60) includes a movable element (66) pivotable about a geometrically centered rotational axis (70). The element (66) includes sections (86, 88). Each of the sections (86, 88) has a stop (94, 96) spaced equally away from the rotational axis (70). Each of the sections (86, 88) also has a different configuration (104, 108) of apertures (102, 106). The configurations (104, 108) of apertures (102, 106) create a mass imbalance between the sections (86, 88) so that the element (66) pivots about the rotational axis (70) in response to acceleration. The apertures (102, 106) also facilitate etch release during manufacturing and reduce air damping when the element (66) rotates. Apertures (126, 128) are formed in electrodes (78, 80) underlying the apertures (102, 106) to match the capacitance between the two sections (86, 88) of movable element (86) to provide the same bi-directional actuation capability.
摘要翻译：对称差分电容传感器（60）包括可围绕几何中心的旋转轴线（70）枢转的可移动元件（66）。元件（66）包括部分（86,88）。每个部分（86,88）具有与旋转轴线（70）等距离间隔的止挡件（94,96）。每个部分（86,88）还具有不同的孔（102,106）的构造（104,108）。孔（102,106）的构造（104,108）在各部分（86,88）之间产生质量不平衡，使得元件（66）响应加速度绕旋转轴线（70）枢转。孔（102,106）还有助于制造过程中的蚀刻释放并且当元件（66）旋转时减小空气阻尼。孔径（126,128）形成在孔（102,106）下面的电极（78,80）中，以匹配可移动元件（86）的两个部分（86,88）之间的电容，以提供相同的双向致动能力。

49. 发明授权

US07005193B2 Method of adding mass to MEMS structures 失效
标题翻译：向MEMS结构添加质量的方法
公开(公告)号：US07005193B2
公开(公告)日：2006-02-28
申请号：US10426148
申请日：2003-04-29
申请人： Andrew C. McNeil , Gary Li , Gary J. O'Brien
发明人： Andrew C. McNeil , Gary Li , Gary J. O'Brien
IPC分类号： B32B15/00 , G01P15/02 , C23F1/00
CPC分类号： B81B3/0078 , B81B2201/025 , G01P15/08 , G01P15/0802 , G01P15/0888 , G01P2015/0814 , Y10T428/24917
摘要： A proof mass (11) for a MEMS device is provided herein. The proof mass comprises a base (13) comprising a semiconductor material, and at least one appendage (15) adjoined to said base by way of a stem (21). The appendage (15) comprises a metal (17) or other such material that may be disposed on a semiconductor material (19). The metal increases the total mass of the proof mass (11) as compared to a proof mass of similar dimensions made solely from semiconductor materials, without increasing the size of the proof mass. At the same time, the attachment of the appendage (15) by way of a stem (21) prevents stresses arising from CTE differentials in the appendage from being transmitted to the base, where they could contribute to temperature errors.
摘要翻译：本文提供了用于MEMS器件的检测质量（11）。检测质量块包括一个包括半导体材料的基底（13）和至少一个通过杆（21）与所述底座邻接的附属物（15）。附件（15）包括可以设置在半导体材料（19）上的金属（17）或其他这样的材料。与仅由半导体材料制成的类似尺寸的检验质量相比，金属与总体质量（11）相比增加，而不增加检测质量。同时，通过杆（21）附接附件（15）可防止附件中产生的CTE差异的应力传输到基座，在那里它们可能导致温度误差。

50. 发明授权

US09926187B2 Microelectromechanical system devices having crack resistant membrane structures and methods for the fabrication thereof 有权
公开(公告)号：US09926187B2
公开(公告)日：2018-03-27
申请号：US14537498
申请日：2014-11-10
申请人： Chad S Dawson , Dubravka Bilic , Lianjun Liu , Andrew C McNeil
发明人： Chad S Dawson , Dubravka Bilic , Lianjun Liu , Andrew C McNeil
IPC分类号： G01L9/12 , B81B3/00 , G01L9/00
CPC分类号： B81B3/007 , B81B2201/0264 , B81B2203/0127 , G01L9/0072
摘要： Methods for fabricating crack resistant Microelectromechanical (MEMS) devices are provided, as are MEMS devices produced pursuant to such methods. In one embodiment, the method includes forming a sacrificial body over a substrate, producing a multi-layer membrane structure on the substrate, and removing at least a portion of the sacrificial body to form an inner cavity within the multi-layer membrane structure. The multi-layer membrane structure is produced by first forming a base membrane layer over and around the sacrificial body such that the base membrane layer has a non-planar upper surface. A predetermined thickness of the base membrane layer is then removed to impart the base membrane layer with a planar upper surface. A cap membrane layer is formed over the planar upper surface of the base membrane layer. The cap membrane layer is composed of a material having a substantially parallel grain orientation.

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