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    • 42. 发明授权
    • Molding resin and process for production thereof
    • 成型树脂及其制造方法
    • US07169882B2
    • 2007-01-30
    • US10508954
    • 2003-08-19
    • Takashi MiharaShouji ImamuraMasao Kamikura
    • Takashi MiharaShouji ImamuraMasao Kamikura
    • C08G63/00
    • C08L67/00C08G63/60C08G2261/126C08L67/04C08L87/005C08L2666/18
    • A molding resin formed from a block copolymer comprising polyhydroxycarboxylic acid structural units (I), and polyester structural units (II) derived from a dicarboxylic acid and a diol; wherein the weight ratio (I)/(II) between the polyhydroxycarboxylic acid structural units (I) and the polyester structural units (II) is within a range from 95/5 to 10/90; the resin has a microphase separated structure in which either the polyhydroxycarboxylic acid structural units (I) or the polyester structural units (II) forms domains within a matrix formed by the other structural units; the average domain size of the domains is within a range from 0.08 to 5.0 μm; and the weight average molecular weight of the molding resin is within a range from 10,000 to 400,000.
    • 由包含聚羟基羧酸结构单元(I)和由二羧酸和二醇衍生的聚酯结构单元(II)的嵌段共聚物形成的模制树脂; 其中聚羟基羧酸结构单元(I)和聚酯结构单元(II)之间的重量比(I)/(II)在95/5至10/90的范围内; 所述树脂具有微相分离结构,其中所述多羟基羧酸结构单元(I)或所述聚酯结构单元(II)在由其它结构单元形成的基质内形成结构域; 域的平均域大小在0.08至5.0μm的范围内; 成型树脂的重均分子量在10,000〜400,000的范围内。
    • 43. 发明授权
    • Semiconductor optical amplifier suitable for coarse WDM communications and light amplification method
    • 半导体光放大器适用于粗WDM通信和光放大方法
    • US07167301B2
    • 2007-01-23
    • US10708219
    • 2004-02-17
    • Tomoyuki Akiyama
    • Tomoyuki Akiyama
    • H10S5/0683
    • B82Y20/00H01S5/0425H01S5/0625H01S5/06812H01S5/1053H01S5/1096H01S5/34H01S5/341H01S5/3412H01S5/50
    • An active layer contains quantum structures. The active layer amplifies light propagating therein while current is injected therein. Electrodes are provided for sections of the active layer sectionalized along a light propagation direction. The electrodes inject different currents into the sections. Current is supplied to the electrodes in such a manner that a first current density is set to one section of the active layer and a second current density is set to another section. The first current density is lower than that at a cross point and the second current density is higher than that at the cross point. The cross point is a cross point between gain coefficient curves at least two different transition wavelengths of the quantum structures. The curves are drawn in a graph showing a relation between a density of current injected into the active layer and a gain coefficient of the active layer.
    • 活性层包含量子结构。 有源层在其中注入电流的同时放大其中传播的光。 为沿着光传播方向分段的有源层的部分提供电极。 电极注入不同的电流到这些部分。 以这样的方式将电流提供给电极,即将第一电流密度设置为有源层的一个部分,并将第二电流密度设置为另一部分。 第一电流密度低于交叉点,第二电流密度高于交叉点。 交叉点是量子结构的至少两个不同跃迁波长的增益系数曲线之间的交叉点。 曲线以示出注入有源层的电流密度与有源层的增益系数之间的关系的曲线图示出。
    • 47. 发明授权
    • Tray for semiconductor device and semiconductor device
    • 半导体器件和半导体器件托盘
    • US07163104B2
    • 2007-01-16
    • US10958393
    • 2004-10-06
    • Misao InokeYukio AndoHideyasu Hashiba
    • Misao InokeYukio AndoHideyasu Hashiba
    • B65D85/00
    • H01L21/67333H01L23/49816H01L2924/0002Y10S206/821H01L2924/00
    • A tray for a semiconductor device and the semiconductor device are disclosed in which the resist of the semiconductor is not easily separated from the substrate. A tray for semiconductor device has a support section formed as a pocket for carrying the semiconductor device, a pair of first protrusions formed on the opposite sides of the support section, and a pair of second protrusions formed on the opposite sides of the tray on the surface side reverse to the surface side where the support section are provided. The second protrusions are arranged in spaced relation to and in the same direction as the first protrusions. The interval between the first protrusions is larger than the interval between the second protrusions, so that in the case where the tray receives a shock, the semiconductor device comes into contact with the second protrusions earlier than with the first protrusions, thereby making it difficult for the resist of the semiconductor device to come off.
    • 公开了一种用于半导体器件的托盘和半导体器件,其中半导体的抗蚀剂不容易与基底分离。 用于半导体器件的托盘具有形成为用于承载半导体器件的袋的支撑部,形成在支撑部的相对侧上的一对第一突起和形成在托盘的相对侧上的一对第二突起 表面侧与设置有支撑部的表面侧相反。 第二突起以与第一突起间隔开并且与第一突起相同的方向布置。 第一突起之间的间隔大于第二突起之间的间隔,使得在托盘受到冲击的情况下,半导体器件比第一突起更早地与第二突起接触,从而难以 半导体器件的抗蚀剂脱落。
    • 48. 发明授权
    • Transmembrane nfat inhibitory peptide
    • 跨膜抑制肽
    • US07160863B2
    • 2007-01-09
    • US10504333
    • 2003-02-26
    • Hideki MatsuiMasayuki Matsushita
    • Hideki MatsuiMasayuki Matsushita
    • A61K38/16C07K7/08C07K2/00C07K14/00
    • C07K14/4702A61K38/00C07K2319/10
    • The present invention aims to solve the conventional problems by providing a peptide compound, in which when administered to a patient of immunologic disease, cardiac hypertrophy or a disease caused by NFAT activation, the period from administration to actual exhibition of effectiveness is short and there are no side effects or antigenicity. Specifically, the present invention relates to a membrane permeable NFAT inhibitory peptide comprising several consecutive arginines and a NFAT-activity inhibitory peptide sequence; a NFAT activation inhibitory agent comprising the peptide; and a immunosuppressive agent and cardiac hypertrophy suppressive agent, comprising the peptide compound as the active ingredient.
    • 本发明旨在通过提供一种肽化合物来解决常规问题,其中当向免疫疾病患者施用心脏肥大或由NFAT激活引起的疾病时,从施用到实际展现效果的时间短,并且存在 无副作用或抗原性。 具体而言,本发明涉及包含数个连续的精氨酸和NFAT-活性抑制肽序列的膜渗透性NFAT抑制肽; 包含该肽的NFAT激活抑制剂; 以及包含肽化合物作为活性成分的免疫抑制剂和心脏肥大抑制剂。
    • 50. 发明授权
    • Sealing construction
    • 密封结构
    • US07159874B2
    • 2007-01-09
    • US11148311
    • 2005-06-09
    • Atsushi Hosokawa
    • Atsushi Hosokawa
    • F16J15/10
    • F16J15/127F16J15/123F16J2015/0856
    • A sealing construction provided with a plate member of metal and a rubber member forming a sealing portion and unitedly fixed to the plate member on which a ring concave groove is formed on an obverse face. And, plural through holes, having enlarged opening end portions on a reverse face, are formed through a bottom face of the ring concave groove and the reverse face. Further, a ring plate is disposed as to contact the bottom face of the ring concave groove and partially close the opening portions of the through holes toward the bottom face, and the rubber member, fit to the through hole and surrounding the ring plate, is unitedly connected to the sealing portion in the ring concave groove.
    • 一种密封结构,其具有金属板构件和橡胶构件,所述橡胶构件形成密封部并且整体地固定到在正面上形成有环形凹槽的板构件。 并且,通过环形凹槽和反面的底面形成有在反面上具有扩大的开口端部的多个通孔。 此外,环形板设置成与环形凹槽的底面接触并且朝向底面部分地关闭通孔的开口部分,并且配合到通孔并围绕环形板的橡胶构件是 与环形凹槽中的密封部一体地连接。