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41. 发明申请

WO2005040709A1 FLOW DISTRIBUTING UNIT AND COOLING UNIT 审中-公开
标题翻译：流量分配单元和冷却单元
公开(公告)号：WO2005040709A1
公开(公告)日：2005-05-06
申请号：PCT/DK2004/000735
申请日：2004-10-26
申请人： DANFOSS SILICON POWER GMBH , OLESEN, Klaus, Kristen
发明人： OLESEN, Klaus, Kristen
IPC分类号： F28F3/12
CPC分类号： F28F9/0268 , F28F3/12 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A distributor (1) for distributing a flow of cooling fluid over surface(s) (3) to be cooled has a housing (13) manufactured in a single piece with inlet (8) and outlet (9) manifolds and a plurality of flow cells (26, 27, 28, 29) which makes it easier and more cost effective to manufacture the distributor (1). The flow cells (26, 27, 28, 29) may be connected in parallel between the manifolds (8, 9) and may be adapted to cool two or more surfaces (3) simultaneously. Also disclosed is a fluid-coolable unit comprising the distributor (1) is furthermore suitable for removing heat from an electronic circuit, such as integrated circuit or CPU.
摘要翻译：用于在要冷却的表面（3）上分配冷却流体流的分配器（1）具有壳体（13），该壳体以单件制造，具有入口（8）和出口（9）歧管以及多个流电池（26,27,28,29），使制造分配器（1）更容易并且更具成本效益。流通池（26,27,28,29）可以在歧管（8,9）之间并联连接，并且可以适于同时冷却两个或更多个表面（3）。还公开了一种流体冷却单元，其包括分配器（1）还适合于从诸如集成电路或CPU的电子电路去除热量。

42. 发明申请

WO2023083960A1 JOINING METHOD AND ANVIL FOR USE IN A JOINING METHOD 审中-公开
公开(公告)号：WO2023083960A1
公开(公告)日：2023-05-19
申请号：PCT/EP2022/081464
申请日：2022-11-10
申请人： DANFOSS SILICON POWER GMBH
发明人： TIMMERMANN, Michael , LUKAT, Nils , MARKSCHAT, Hauke , PETERSEN, Owe
IPC分类号： B23K20/10 , B23K37/04
摘要： A joining method (100) for joining a first joining member (101) and a second joining member (103). The method (100) comprises placing (105) the second joining member (103) on a contact material (107) that changes its stiffness depending on a rate of change of mechanical stress applied to the contact material (107), placing (109) the first joining member (101) on the second joining member (103), and applying (111) mechanical stress to the contact material (107) by moving the first joining member (101) relative to the second joining member (103). Further, the present invention relates to an anvil.

43. 发明申请

WO2022229031A1 ELECTRONIC COMPONENT COOLER 审中-公开
公开(公告)号：WO2022229031A1
公开(公告)日：2022-11-03
申请号：PCT/EP2022/060756
申请日：2022-04-22
申请人： DANFOSS SILICON POWER GMBH
发明人： STRÖBEL-MAIER, Henning , LUND, Karsten
IPC分类号： H01L23/473 , F28F9/02
摘要： A coolant coupling device wherein the cooler comprises a cavity wherein the coolant trajectory is altered by an angle of greater than 75 degrees and which is defined by a wall structure incorporating two radii.

44. 发明申请

WO2020127443A3 ASSEMBLY FOR SINTERING AN EL. MODULE WITH A SINTERING DEVICE COMPRISING A BOTTOM PUNCH AND A TOP PUNCH, AN EL. MODULE ARRANGED ON THE BOTTOM PUNCH, AND A SEPARATING FILM COMPRISING A METAL ARRANGED BETWEEN THE TOP PUNCH AND THE EL. MODULE 审中-公开
公开(公告)号：WO2020127443A3
公开(公告)日：2020-06-25
申请号：PCT/EP2019/085885
申请日：2019-12-18
申请人： DANFOSS SILICON POWER GMBH
发明人： RUDZKI, Jacek , EISELE, Ronald , OSTERWALD, Frank , BECKER, Martin , BASTOS ABIBE, André
IPC分类号： H01L21/67 , H01L21/603
摘要： An assembly for sintering of an electronic module (2+1+3+4+5) comprises a sintering device with a bottom punch (13) and a top punch (7), an electronic module (2+1+3+4+5) arranged on the bottom punch (13) and a separating film (6) arranged between the top punch (7) and the electronic module (2+1+3+4+5), wherein the separating film (6) comprises a metal. The electronic module (2+1+3+4+5) may consist of a substrate (2+1) comprising two copper layers (1) and a ceramic layer (2) arranged between the copper layers (1) and of a semiconductor (3) with electrical contacts (4, 5) arranged on the upper copper layer (1). The separating film (6) may comprise a layer comprising the metal, facing the electronic module (2+1+3+4+5). The separating film (6) may also have a coating (12) of the metal, arranged on a carrier (11), such as a plastic film (e.g., poly-tetrafluoroethylene (PTFE) or polyimide (PI)). The metal may be gold, silver, platinum or another noble metal and is preferably aluminium, resulting in a cost-effective, recyclable material. The metal film may be interlaced similarly to a crepe paper, on the surface facing the semiconductor (3+4+5), which improves the heat transfer of the punch heat to the substrate (2+1) and distributes, free from pressure peaks, the quasi-hydrostatic pressure on the surfaces to be sintered. The separating film (6) may also have a plurality of slits (9) perforating the separating film (6), preferably arranged outside of the semiconductor (3+4+5) and adjacent to the edge of the separating film (6), reducing any mechanical stress on the separating film (6) in the area of the semiconductor edges and preventing the separating film (6) from tearing.

45. 发明申请

WO2020094411A1 MOLD TOOL FOR MOLDING A SEMICONDUCTOR POWER MODULE WITH TOP-SIDED PIN CONNECTORS AND METHOD OF MANUFACTURING SUCH A SEMICONDUCTOR POWER MODULE 审中-公开
公开(公告)号：WO2020094411A1
公开(公告)日：2020-05-14
申请号：PCT/EP2019/079023
申请日：2019-10-24
申请人： DANFOSS SILICON POWER GMBH
发明人： MÜLLER, Zeno , FILIPIAK-RESSEL, Tino , BEER, Holger , PAULSEN, Lars , STREIBEL, Alexander
IPC分类号： B29C45/14 , B29L31/34 , H01L21/56
摘要： A mold tool (1) is described for molding a semiconductor power module having an electrical contact pin (2) which comprises an electrical contact portion (3) for contacting a substrate (4) with another electrical component. The pin (2) comprises a protruding portion (5) being a top-sided pin connector. The mold tool (1) comprises a first (6) and a second mold die which, when brought together for molding, form a cavity to be filled with a mold compound for encapsulating electrical components of the semiconductor power module, and a recess (7) in the first die 6 which communicates with the cavity within the second die. The recess (7) is filled with a cushion-like soft material (8) into which the top-sided pin connector is pushed thereinto and completely surrounded by the soft material so that a sealing means is formed that prevents any contamination of the electrical contact portion (3) of the pin (2) by the molding compound introduced into the cavity. Furthermore, a method of manufacturing such a semiconductor power module is described.

46. 发明申请

WO2019068502A1 POWER MODULE WITH INTEGRATED COOLING DEVICE 审中-公开
公开(公告)号：WO2019068502A1
公开(公告)日：2019-04-11
申请号：PCT/EP2018/075878
申请日：2018-09-25
申请人： DANFOSS SILICON POWER GMBH
发明人： OLESEN, Klaus , PAULSEN, Lars
IPC分类号： H05K7/20
摘要： An electric device, comprising: a power module having a circuit carrier on which a circuit component is disposed; a cooling structure; and an intermediate structure disposed between the circuit carrier and the cooling structure, wherein the cooling structure is made of a first metal material, and the intermediate structure is made of a second metal material having a higher thermal conductivity than that of the first metal material.

47. 发明申请

WO2018134031A1 ELECTRONIC POWER SYSTEM AND METHOD FOR MANUFACTURING THE SAME 审中-公开
公开(公告)号：WO2018134031A1
公开(公告)日：2018-07-26
申请号：PCT/EP2017/084484
申请日：2017-12-22
申请人： DANFOSS SILICON POWER GMBH
发明人： WECKER, Georg , MÜHLFELD, Ole , PAULSEN, Lars , STRÖBEL-MAIER, Henning , BEER, Holger , KLAEHR, Christopher , OLESEN, Klaus
IPC分类号： H05K7/20
摘要： The invention relates to an electronic power system (1) comprising at least one electronic power module (2). The electronic power module (2) comprises a base plate (3) and at least one heat generating component arranged on a first side of the base plate (3). The electronic power module (2) comprises a cooling structure (4) transporting heat away from the electronic power module (2) via a coolant that is guided by the cooling structure (4). The cooling structure (4) is arranged on a second side (5) of the base plate (3) opposite to the first side. Task of the invention is to provide an electronic power system (1) with an improved cooling. According to the present invention this task is solved in that the cooling structure (4) is integrally formed with the base plate (3).

48. 发明申请

WO2017202749A1 CONVERTER ARRANGEMENT 审中-公开
标题翻译：转换器安排
公开(公告)号：WO2017202749A1
公开(公告)日：2017-11-30
申请号：PCT/EP2017/062222
申请日：2017-05-22
申请人： DANFOSS SILICON POWER GMBH
发明人： STRÖBEL-MAIER, Henning , LENZ, Kevin
IPC分类号： H02M7/487
摘要： Converter arrangement (1) comprising an upper bridge branch, which is arranged between a positive input connection (+) and a centre tap (0), and a lower bridge branch, which is arranged between a negative input connection (-) and the centre tap (0), wherein the upper bridge branch has at least two controlled upper semiconductor elements (T1, T2) and the lower bridge branch has at least two controlled lower semiconductor elements (T3, T4), characterized in that, in each of the two bridge branches, the controlled semiconductor elements (T1, T2; T3, T4) are arranged parallel next to one another with a maximum overlap (z).
摘要翻译：转换器装置（1）包括布置在正输入连接（+）与中心抽头（0）之间的上桥支路和布置在负支路之间的下桥支路输入连接（ - ）和中心抽头（0），其中上桥臂具有至少两个受控的上半导体元件（T1，T2），并且下桥臂分支具有至少两个受控的下半导体元件（T3，T4），其特征在于，在两个桥支路中的每一个中，受控半导体元件（T1，T2; T3，T4）以最大重叠（z）并排布置。

49. 发明申请

WO2017085131A1 POWER SEMICONDUCTOR MODULE HAVING A GLOB TOP POTTING COMPOUND COVERING A POWER SEMICONDUCTOR 审中-公开
标题翻译：功率半导体模块具有覆盖功率半导体的GLOB顶部浇注复合物
公开(公告)号：WO2017085131A1
公开(公告)日：2017-05-26
申请号：PCT/EP2016/077867
申请日：2016-11-16
申请人： DANFOSS SILICON POWER GMBH
发明人： LUND, Jeppe , BICAKCI, Aylin , RUDZKI, Jacek , EISELE, Ronald , OSTERWALD, Frank , PAULSEN, Lars , HEYDENREICH, Michael , OLESEN, Klaus , BREDTMANN, Rüdiger
IPC分类号： H01L23/31
CPC分类号： H01L23/3135 , H01L21/56 , H01L2224/48091 , H01L2224/8592 , H01L2924/19107 , H01L2924/00014
摘要： A power semiconductor module (10) having a power semiconductor (20), an electrical conductor (30) contacting the power semiconductor (20) and a glob top potting compound (40) covering the power semiconductor (20) completely and the electrical conductor (30) at least partly, characterized in that the glob top potting compound (40) is a highly thermally conductive polymer.
摘要翻译：功率半导体模块（10）具有功率半导体（20），接触功率半导体（20）的电导体（30）以及覆盖功率半导体（20）的顶部封装化合物（40） 20）和电导体（30）至少部分地连接，其特征在于，球形顶部封装化合物（40）是高度导热的聚合物。

50. 发明申请

WO2017016808A1 POWER SEMICONDUCTOR MODULE 审中-公开
标题翻译：功率半导体模块
公开(公告)号：WO2017016808A1
公开(公告)日：2017-02-02
申请号：PCT/EP2016/065683
申请日：2016-07-04
申请人： DANFOSS SILICON POWER GMBH
发明人： OSTERWALD, Frank , EISELE, Ronald , ULRICH, Holger
IPC分类号： H01L23/31
CPC分类号： H01L23/3121 , H01L2224/29339
摘要： The present invention discloses a power semiconductor module, comprising: a substrate; a semiconductor provided on a top side of the substrate; and a package formed on the semiconductor and the substrate, wherein the package has openings at a top side thereof, through which terminal contacts of the semiconductor and the substrate are exposed outside and accessible from outside.
摘要翻译：本发明公开了一种功率半导体模块，包括：基板; 设置在所述基板的上侧的半导体; 以及形成在半导体和基板上的封装，其中封装在其顶侧具有开口，半导体和基板的端子触点通过该开口暴露在外部并可从外部访问。

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