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    • 37. 发明授权
    • Method for welding contact plates and contact elements obtained with the method
    • 用该方法焊接接触板和接触元件的方法
    • US07592566B2
    • 2009-09-22
    • US10500366
    • 2002-12-10
    • Massimo MauraFederico Gamba
    • Massimo MauraFederico Gamba
    • B23K26/02
    • H01H11/041H01H11/045H01H2011/0087Y10T29/49204Y10T29/49213
    • A method for mutually welding a plate that has at least one layer based on Ag alloys and a copper body, comprising the use of laser means for performing the welding, its particularity consisting of the fact that it comprises the steps that consist in:—superimposing and coupling one face of the plate on a surface of the copper body;—starting the welding process by focusing the laser means on a point located proximate to the joint between the face of the plate and the surface of the copper body;—maintaining an angle of incidence of the laser means at values other than 0° with respect to the perpendicular to the surface to be welded;—moving the laser means with respect to the joint, so that the weldpool is pushed along the joint.
    • 一种用于相互焊接具有基于Ag合金的至少一层的板和铜体的方法,其包括使用用于执行焊接的激光装置,其特性包括以下事实:其包括以下步骤: - 超越 并且将所述板的一个面耦合在所述铜体的表面上;通过将所述激光装置聚焦在位于所述板的表面和所述铜体的表面之间的接合处附近的点处,来启动所述焊接过程; - 保持 激光装置的入射角相对于待焊接表面的垂直线为0°以外的值; - 相对于接头移动激光装置,使得焊缝沿着接头被推动。