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    • 39. 发明申请
    • ELECTROLYTIC SOLUTION FOR ELECTROCHEMICAL DEPOSIT OF PALLADIUM OR ITS ALLOYS
    • 电解液用于电化学沉积钯或其合金
    • WO01077417A1
    • 2001-10-18
    • PCT/FR2001/001021
    • 2001-04-05
    • C25D3/50C25D3/52C25D3/56
    • C25D3/52C25D3/567
    • The invention concerns an aqueous electrolytic solution with acid pH for electrochemical deposit of palladium or its alloys comprising a palladium compound, and optionally at least a secondary metal compound to be co-deposited in the form of an alloy with the palladium, and comprising further ethylenediamine as complexing agent for the palladium and an organic brightening agent wherein said brightening agent is 3-(3-pyridyl)acrylic acid, 3-(3-quinolyl)acrylic acid or one of their salts. The invention also concerns a method for electroplating palladium or a palladium alloy comprising electrolysis of an electrolytic solution as defined above, using current densities ranging between 0.5 and 150 A/dm .
    • 本发明涉及一种具有酸性pH的酸性电解液,其用于电化学沉积钯或其合金,其包含钯化合物和任选的至少二次金属化合物,以与钯的合金形式共沉积,并且还包含另外的乙二胺 作为钯的络合剂和有机增白剂,其中所述增亮剂是3-(3-吡啶基)丙烯酸,3-(3-喹啉基)丙烯酸或其盐之一。 本发明还涉及一种电镀钯或钯合金的方法,其中包括电解密度在0.5至150A / dm 2之间的如上定义的电解溶液的电解。