会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 33. 发明授权
    • Processes for improving tool life and surface finish in high speed machining
    • 在高速加工中提高刀具寿命和表面光洁度的工艺
    • US08490526B2
    • 2013-07-23
    • US13477864
    • 2012-05-22
    • Sundaresa V. Subramanian
    • Sundaresa V. Subramanian
    • B23B29/00B23B37/00
    • B23B29/125B23B1/00B23B2222/14B23B2226/125B23P25/006Y10T82/10Y10T82/25Y10T82/2502Y10T82/2583Y10T82/2585Y10T407/235Y10T409/306552
    • Processes for high speed machining of workpiece materials using high performance tools with prolonged tool life and improved surface finish are provided by vibrating the tool and/or the workpiece at a frequency greater than the frequency of shear localization in the primary shear zone or chip segmentation occurring in the absence of tool vibration, with an amplitude sufficient to break up the tool-chip atomic contact, thereby decreasing the tool-chip contact length through decreasing the tool-chip contact time, thereby suppressing accelerated chemical tool wear caused by dissolution of the tool into the workpiece by nanocrystalline grain boundary diffusion and grain boundary sliding mechanisms by preventing shear localization associated with nanocrystalline grain formation in the primary shear zone of the chip, and suppressing oxidation wear of the tool by preventing segmentation of the chip.
    • 使用具有延长的刀具寿命和改进的表面光洁度的高性能刀具对工件材料进行高速加工的工艺通过以大于主剪切带中的剪切定位频率或芯片分割的频率振动工具和/或工件来提供工件材料和/或工件 在没有工具振动的情况下,具有足以分解工具芯片原子接触的幅度,从而通过减少刀具接触时间来减小刀具接触长度,从而抑制由于刀具溶解引起的加速的化学工具磨损 通过防止芯片主要剪切区域中与纳米晶粒形成相关的剪切定位,通过防止芯片的分割来抑制工具的氧化磨损,通过纳米晶界扩散和晶界滑动机制进入工件。
    • 39. 发明申请
    • PROCESSES FOR IMPROVING TOOL LIFE AND SURFACE FINISH IN HIGH SPEED MACHINING
    • 改进高速加工中的工具寿命和表面处理的工艺
    • US20120297942A1
    • 2012-11-29
    • US13477864
    • 2012-05-22
    • Sundaresa V. Subramanian
    • Sundaresa V. Subramanian
    • B23B3/36
    • B23B29/125B23B1/00B23B2222/14B23B2226/125B23P25/006Y10T82/10Y10T82/25Y10T82/2502Y10T82/2583Y10T82/2585Y10T407/235Y10T409/306552
    • Processes for high speed machining of workpiece materials using high performance tools with prolonged tool life and improved surface finish are provided by vibrating the tool and/or the workpiece at a frequency greater than the frequency of shear localization in the primary shear zone or chip segmentation occurring in the absence of tool vibration, with an amplitude sufficient to break up the tool-chip atomic contact, thereby decreasing the tool-chip contact length through decreasing the tool-chip contact time, thereby suppressing accelerated chemical tool wear caused by dissolution of the tool into the workpiece by nanocrystalline grain boundary diffusion and grain boundary sliding mechanisms by preventing shear localization associated with nanocrystalline grain formation in the primary shear zone of the chip, and suppressing oxidation wear of the tool by preventing segmentation of the chip.
    • 使用具有延长的刀具寿命和改进的表面光洁度的高性能刀具对工件材料进行高速加工的工艺通过以大于主剪切带中的剪切定位频率或芯片分割的频率振动工具和/或工件来提供工件材料和/或工件 在没有工具振动的情况下,具有足以分解工具芯片原子接触的幅度,从而通过减少刀具接触时间来减小刀具接触长度,从而抑制由于刀具溶解引起的加速的化学工具磨损 通过防止芯片主要剪切区域中与纳米晶粒形成相关的剪切定位,通过防止芯片的分割来抑制工具的氧化磨损,通过纳米晶界扩散和晶界滑动机制进入工件。