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31. 发明申请

US20100032706A1 WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING CONDUCTIVE AREA AND HEAT-DISSIPATING AREA AND METHOD FOR MAKING THE SAME 有权
标题翻译：用于增加导电区域和散热区域的WAFER LEVEL LED封装结构及其制造方法
公开(公告)号：US20100032706A1
公开(公告)日：2010-02-11
申请号：US12346329
申请日：2008-12-30
申请人： Bily Wang , Sung-Yi Hsiao , Jack Chen
发明人： Bily Wang , Sung-Yi Hsiao , Jack Chen
IPC分类号： H01L33/00 , H01L21/02
CPC分类号： H01L33/38 , H01L33/44 , H01L33/508 , H01L2224/48091 , H01L2224/73265 , H01L2933/0016 , H01L2924/00014
摘要： A wafer level LED package structure includes a light-emitting unit, a first conductive unit, a second conductive unit and an insulative unit. The light-emitting unit has a light-emitting body, a positive conductive layer and a negative conductive layer formed on the light-emitting body, and a first insulative layer formed between the positive conductive layer and the negative conductive layer. The first conductive unit has a first positive conductive layer formed on the positive conductive layer and a first negative conductive layer formed on the negative conductive layer. The second conductive unit has a second positive conductive layer formed on the first positive conductive layer and a second negative conductive layer formed on the first negative conductive layer. The insulative unit has a second insulative layer formed on the first insulative layer and disposed between the second positive conductive layer and the second negative conductive layer.
摘要翻译：晶圆级LED封装结构包括发光单元，第一导电单元，第二导电单元和绝缘单元。发光单元具有形成在发光体上的发光体，正导电层和负导电层，以及形成在正导电层和负导电层之间的第一绝缘层。第一导电单元具有形成在正导电层上的第一正导电层和形成在负导电层上的第一负导电层。第二导电单元具有形成在第一正导电层上的第二正导电层和形成在第一负导电层上的第二负导电层。绝缘单元具有形成在第一绝缘层上并设置在第二正导电层和第二负导电层之间的第二绝缘层。

32. 外观设计

USD595675S1 Light emitting diode 有权
公开(公告)号：USD595675S1
公开(公告)日：2009-07-07
申请号：US29309666
申请日：2008-09-24
申请人： Bily Wang , Chao-Yuan Huang , Ping-Chou Yang , Jia-Wen Chen , Hsiu-Wen Wang
设计人： Bily Wang , Chao-Yuan Huang , Ping-Chou Yang , Jia-Wen Chen , Hsiu-Wen Wang

33. 发明授权

US07485480B2 Method of manufacturing high power light-emitting device package and structure thereof 失效
标题翻译：制造大功率发光器件封装的方法及其结构
公开(公告)号：US07485480B2
公开(公告)日：2009-02-03
申请号：US11524462
申请日：2006-09-21
申请人： Bily Wang , Jonnie Chuang , Shih-Yu Wu
发明人： Bily Wang , Jonnie Chuang , Shih-Yu Wu
IPC分类号： H01L21/00
CPC分类号： H01L33/642 , H01L33/54 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/647 , H01L2224/48247 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014
摘要： A method of manufacturing high power light-emitting device packages and structure thereof, wherein the method thereof includes the steps of: (a) forming a plurality of lead frames, each of the lead frames includes a heat-dissipating element and a plurality of leads; (b) electroplating an outer surface of the lead frames each; (c) coating conductive gel on a surface of the heat-dissipatings each; (d) arranging at least one light-emitting chip on the conductive gel; (e) forming an encapsulant on each of the lead frames; (f) connecting at least one top electrode of the light-emitting chip with one of the leads; (g) coating silicon gel for covering the at one light-emitting chip, and forming integrally a focusing light convex surface on a top surface of the silicon gel; and (h) cutting off the tie-bars to separate the lead frames from one another, whereby forming a plurality of high power light-emitting device packages.
摘要翻译：一种制造大功率发光器件封装的方法及其结构，其方法包括以下步骤：（a）形成多个引线框架，每个引线框架包括散热元件和多个引线 ; （b）电镀每个引线框架的外表面; （c）在散热表面上涂覆导电凝胶; （d）在所述导电性凝胶上配置至少一个发光芯片; （e）在每个引线框架上形成密封剂; （f）将所述发光芯片的至少一个顶部电极与所述引线中的一个连接; （g）涂覆硅胶以覆盖一个发光芯片，并且在硅凝胶的顶表面上一体地形成聚焦光凸面; 和（h）切断连接杆以将引线框架彼此分离，从而形成多个高功率发光器件封装。

34. 发明申请

US20060038485A1 Laminated light-emitting diode display device and manufacturing method thereof 审中-公开
公开(公告)号：US20060038485A1
公开(公告)日：2006-02-23
申请号：US10920306
申请日：2004-08-18
申请人： Bily Wang , Jonnie Chuang , Chuanfa Lin , Chao-Yuan Huang
发明人： Bily Wang , Jonnie Chuang , Chuanfa Lin , Chao-Yuan Huang
IPC分类号： H05B33/08 , H05B33/00
CPC分类号： G09F9/302 , G09F9/33 , H05K1/0306 , H05K1/0393 , H05K1/181 , H05K2201/0108 , H05K2201/10106 , Y02P70/611
摘要： A laminated light-emitting diode display device and a manufacturing method thereof are described. The laminated light-emitting diode display device has an insulator, a circuitry device placed on the insulator and having of a plurality of circuits interconnected with each other, and a plurality of SMT-type light-emitting diodes electrically connected to the circuits of the circuitry unit.

35. 发明申请

US20050265834A1 Fan structure 审中-公开
标题翻译：风扇结构
公开(公告)号：US20050265834A1
公开(公告)日：2005-12-01
申请号：US10855381
申请日：2004-05-28
申请人： Jia-Yeh Wang , Chih-Ming Cheng , Ta-Yun Tai , Wen-Sung Li
发明人： Jia-Yeh Wang , Chih-Ming Cheng , Ta-Yun Tai , Wen-Sung Li
IPC分类号： F04D29/04 , F04D29/058 , F04D29/64 , H02K5/167 , H02K7/08 , H02K7/14 , H02K11/00 , H02K21/22
CPC分类号： F04D29/058 , F04D25/062 , F04D29/646 , H02K7/083 , H02K7/14 , H02K21/22
摘要： A fan structure of the present invention has a base having a first supporting piece, a motor stator mounted on the base, a motor rotor defined corresponding to the motor stator, a fan blade having a hub located at a central portion thereof, one end of the hub abutting the first supporting piece. The motor rotor is mounted on an inner wall of the fan blade. An upper cover body covers a periphery of the fan blade, the upper cover body has an oblique resilient portion defined on a top portion thereof, the resilient portion defines a second support piece thereon, and the second support piece abuts another end of the hub. The improved fan structure is a bearingless structure, which can simplify the overall structure, is easy to assemble, effectively reduces manufacturing costs and improves a rotating stability of the hub.
摘要翻译：本发明的风扇结构具有基座，其具有第一支撑件，安装在基座上的电机定子，对应于电动机定子的电动机转子，具有位于其中心部分的毂的风扇叶片，轮毂邻接第一支撑件。马达转子安装在风扇叶片的内壁上。上盖主体覆盖风扇叶片的周边，上盖主体具有限定在其顶部的倾斜弹性部分，弹性部分在其上限定第二支撑件，第二支撑件邻接毂的另一端。改进的风扇结构是无轴承结构，可以简化整体结构，易于组装，有效降低制造成本，提高轮毂的旋转稳定性。

36. 外观设计

USD511328S1 Light-emitting diode 失效
公开(公告)号：USD511328S1
公开(公告)日：2005-11-08
申请号：US29207971
申请日：2004-06-23
申请人： Bily Wang , Jonnie Chuang , Huang Hui Yen
设计人： Bily Wang , Jonnie Chuang , Huang Hui Yen

37. 发明申请

US20050236958A1 White light-emitting device 审中-公开
标题翻译：白色发光装置
公开(公告)号：US20050236958A1
公开(公告)日：2005-10-27
申请号：US10830009
申请日：2004-04-23
申请人： Bily Wang , Jonnie Chuang , Chuanfa Lin , Chih Yu
发明人： Bily Wang , Jonnie Chuang , Chuanfa Lin , Chih Yu
IPC分类号： C09K11/77 , H01L33/50 , H05B33/00
CPC分类号： C09K11/7734 , C09K11/7731 , H01L33/502 , H01L33/504 , Y02B20/181
摘要： A white light source has a substrate with a blue light-emitting diode placed thereon and a phosphor mixture coated on the blue light-emitting diode and made of a red phosphor, a green phosphor and a yellow phosphor. The red phosphor can be CaS:Eu or SrS:Eu; the green phosphor can be SrGa2S4:Eu or Ca8EuMnMg(SiO4)4C12; and the yellow phosphor can be YAG:Ce or ThAG:Ce. The red phosphor, the green phosphor and the yellow phosphor emit, respectively, red light, green light and yellow light after receiving blue light from the blue light-emitting diode to mix a white light with a good color-rendering property.
摘要翻译：白色光源具有放置在其上的蓝色发光二极管的基板和涂布在蓝色发光二极管上并由红色荧光体，绿色荧光体和黄色荧光体构成的荧光体混合物。红色荧光体可以是CaS：Eu或SrS：Eu; 绿色荧光体可以是SrGa 2 S 4：Eu或Ca 8 O 5 MnMg（SiO 4） 4 12 黄色荧光体可以是YAG：Ce或ThAG：Ce。在从蓝色发光二极管接收蓝光后，红色荧光体，绿色荧光体和黄色荧光体分别发出红色光，绿色光和黄色光，以混合具有良好显色性能的白色光。

38. 外观设计

USD509809S1 Metal base design for surface mount device LED 失效
标题翻译：金属基座设计用于表面贴装LED
公开(公告)号：USD509809S1
公开(公告)日：2005-09-20
申请号：US29210937
申请日：2004-08-10
申请人： Bily Wang , Jonnie Chuang , Hui Yen Huang
设计人： Bily Wang , Jonnie Chuang , Hui Yen Huang

39. 发明申请

US20050169006A1 Led chip lamp apparatus 审中-公开
标题翻译： LED芯片灯装置
公开(公告)号：US20050169006A1
公开(公告)日：2005-08-04
申请号：US10766827
申请日：2004-01-30
申请人： Bily Wang , Jonnie Chuang , Ching Ko
发明人： Bily Wang , Jonnie Chuang , Ching Ko
IPC分类号： F21S2/00 , F21K99/00 , F21V7/04
CPC分类号： F21V29/74 , F21K9/00 , F21V29/505 , F21V29/83 , F21Y2107/40 , F21Y2115/10
摘要： An LED chap lamp apparatus has a heat sink with a reflector, an LED lamp module and a heat pipe. The LED lamp module is assembled on an inside of the reflector for reflecting light of the LED lamp module. The two ends of the heat pipe each connect to the LED lamp module and the heat sink to conduct and disperse the heat produced form the LED chips to increase the lifetime and the light-emitting efficiency of the LED chap lamp apparatus.
摘要翻译： LED灯具具有具有反射器的散热器，LED灯模块和热管。 LED灯模块组装在反射器的内侧，用于反射LED灯模块的光。热管的两端分别连接到LED灯模块和散热器，以对从LED芯片产生的热量进行分散，从而提高LED灯具的使用寿命和发光效率。

40. 外观设计

USD506187S1 Metal base design for surface mount device LED (light emitting diode) 有权
标题翻译：表面贴装元件LED（发光二极管）金属基座设计
公开(公告)号：USD506187S1
公开(公告)日：2005-06-14
申请号：US29214779
申请日：2004-10-12
申请人： Bily Wang , Jonnie Chuang , Heng-Yen Lee , Hui-Yen Huang
设计人： Bily Wang , Jonnie Chuang , Heng-Yen Lee , Hui-Yen Huang

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