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    • 31. 发明授权
    • Automatic calibration system for wafer transfer robot
    • 晶圆传送机器人自动校准系统
    • US06075334A
    • 2000-06-13
    • US270261
    • 1999-03-15
    • Paul SaguesJohn T. PeurachSanjay D. Aggarwal
    • Paul SaguesJohn T. PeurachSanjay D. Aggarwal
    • B25J9/10B25J9/18B25J13/08H01L21/677H01L21/68
    • H01L21/681H01L21/67766
    • A system for automatically calibrating a semiconductor wafer handling robot so that the robot will move wafers into and out of precise locations within enclosures that form process stations or storage cassettes is disclosed. The system comprises a controller having memory and logic sections connected to a robot having an articulated arm that is movable in vertical (Z), horizontal (.theta.), and radial (R) directions and having a wafer retaining wand at the end of the arm. Dimensional characteristics of the robot wand and the enclosures are stored in the controller memory. Sensors are provided at each enclosure and/or the robot wand which are activated and provide signals to the controller that are relative to the wand position. The robot is programmed to execute a series of progressive movements at each enclosure location which are controlled by a combination of sensor response signals and the appropriate dimensional characteristics. At the end of the programmed movements, the robot wand is positioned within a process station or cassette so that it can engage for removal or release a wafer therein at a precise predetermined location.
    • 公开了一种用于自动校准半导体晶片处理机器人的系统,使得机器人将晶片移入和移出形成处理站或存储盒的外壳内的精确位置。 该系统包括具有连接到机器人的存储器和逻辑部分的控制器,该机器人具有可在垂直(Z),水平(θ)和径向(R)方向上移动的铰接臂,并且在臂的端部具有晶片保持杆 。 机器人手柄和外壳的尺寸特性存储在控制器存储器中。 在每个外壳和/或机器人棒上提供传感器,其被激活并且向控制器提供相对于杆的位置的信号。 机器人被编程为在每个封闭位置执行一系列逐步运动,这些运动由传感器响应信号和适当尺寸特性的组合来控制。 在编程运动结束时,机器人棒位于处理站或盒内,使得其可以在精确的预定位置处接合以移除或释放其中的晶片。
    • 33. 发明专利
    • DE60131162T2
    • 2008-08-14
    • DE60131162
    • 2001-05-30
    • BERKELEY PROCESS CONTROL INC
    • SAGUES PAULWIGGERS ROBERT THARDING NATHAN HAGGARWAL SANJAY K
    • B25J9/10G01R1/04B25J9/18B25J9/22H01L21/00H01L21/677
    • Briefly, a preferred embodiment of the present invention includes a wafer carrier buffer for storage of a plurality of carriers containing wafers either waiting to be taken for processing in an adjacent wafer processing system, or waiting to be taken from the buffer following the processing. The buffer has a sliding carrier first input apparatus for taking a carrier from outside the buffer through a buffer input door and into the buffer interior. A buffer controller is included for directing robotic apparatus to take the carrier from the input apparatus and place it on a selected one of a plurality of carrier storage locations, and from a carrier storage location to a first output for delivery of wafers to processing. The robotic apparatus also delivers an empty carrier to a second input apparatus for receiving wafers from the processing area, and for delivery of a carrier with processed wafers to a second sliding output apparatus for removal from the buffer through a buffer output door. The controller is programmed to direct an automatic calibration of all of the carrier storage locations and the input and output positions. The robotic apparatus includes a sensor for detecting the position of a flange on a calibration fixture that is placed by the robot at a carrier storage location. The flange is accurately positioned on the fixture to correspond to a similar flange on each carrier that is used to engage with a tool on the robotic apparatus for moving the carrier. The calibration is preferably done by directing the robotic apparatus to place the calibration fixture at a location in need of calibration and then sensing the precise position of the fixture flange with the sensor apparatus. The controller then calculates the coordinates required to place a carrier accurately in that location. This process is repeated for each carrier storage location and the input and output locations.
    • 34. 发明专利
    • Self teaching robotic carrier handling system
    • AU6523701A
    • 2001-12-24
    • AU6523701
    • 2001-05-30
    • BERKELEY PROCESS CONTROL INC
    • SAGUES PAULWIGGERS ROBERT THARDING NATHAN HAGGARWAL SANJAY K
    • B25J9/10B25J9/18B25J9/22H01L21/00H01L21/677G01R1/04
    • Briefly, a preferred embodiment of the present invention includes a wafer carrier buffer for storage of a plurality of carriers containing wafers either waiting to be taken for processing in an adjacent wafer processing system, or waiting to be taken from the buffer following the processing. The buffer has a sliding carrier first input apparatus for taking a carrier from outside the buffer through a buffer input door and into the buffer interior. A buffer controller is included for directing robotic apparatus to take the carrier from the input apparatus and place it on a selected one of a plurality of carrier storage locations, and from a carrier storage location to a first output for delivery of wafers to processing. The robotic apparatus also delivers an empty carrier to a second input apparatus for receiving wafers from the processing area, and for delivery of a carrier with processed wafers to a second sliding output apparatus for removal from the buffer through a buffer output door. The controller is programmed to direct an automatic calibration of all of the carrier storage locations and the input and output positions. The robotic apparatus includes a sensor for detecting the position of a flange on a calibration fixture that is placed by the robot at a carrier storage location. The flange is accurately positioned on the fixture to correspond to a similar flange on each carrier that is used to engage with a tool on the robotic apparatus for moving the carrier. The calibration is preferably done by directing the robotic apparatus to place the calibration fixture at a location in need of calibration and then sensing the precise position of the fixture flange with the sensor apparatus. The controller then calculates the coordinates required to place a carrier accurately in that location. This process is repeated for each carrier storage location and the input and output locations.
    • 35. 发明专利
    • Self teaching robotic wafer handling system
    • AU5929401A
    • 2001-11-12
    • AU5929401
    • 2001-04-30
    • BERKELEY PROCESS CONTROL INC
    • SAGUES PAULWIGGERS ROBERT TAGGARWAL SANJAY KSOUZA KEVIN D DHARDING NATHAN H
    • B25J9/16B25J9/18B25J9/22H01L21/00H01L21/677H01L21/68
    • A wafer handling apparatus having input and output robotic systems directed by a programmed controller. Each system has components including a robot, a twist and rotate, and a carrier and automated carrier rail. The input system is for removing wafers from their wafer pod, placing them in the carrier and transporting them via the rail to a wafer processing area. The output system performs the reverse operation, taking wafers from a carrier following processing and placing them in a pod. Each robot includes a plurality of interconnected, articulated cantilevered arms. The last one of the arms has a wand on one end and a laser emitter detector on the other end, and operates in cooperation with the controller to provide location detection of system components. The controller also includes circuitry for sensing contact of the wand with an object by measuring the increased robot motor torque occurring upon contact. The controller is pre-programmed with approximate physical dimensions of the system components and their relative positions. The controller is additionally programmed to automatically perform a precision calibration/teaching routine to gather more precise location data. The process of precision teaching/calibration begins by placing a pod calibration fixture on a pedestal. The controller then directs the input robot to sense the fixture position, which gives the controller precise data relating to the position of a pod on the pedestal. The robot then senses the position of the twist and rotate components. The process begins by sensing the height of two arms of the twist and rotate, and the controller adjusts the arm heights until they are level. The controller then directs the robot to sense the R and theta dimensions of the twist and rotate, and these precise dimensions are saved in the controller.