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31. 发明授权

US07591068B2 Board positioning method 有权
标题翻译：电路板定位方法
公开(公告)号：US07591068B2
公开(公告)日：2009-09-22
申请号：US11663766
申请日：2006-02-13
申请人： Masaru Kawazoe , Shigeo Masaki , Yoshihiro Mimura , Noriyuki Tani
发明人： Masaru Kawazoe , Shigeo Masaki , Yoshihiro Mimura , Noriyuki Tani
IPC分类号： H05K3/30 , B23P23/00
CPC分类号： H05K13/0452 , H05K13/0061 , Y10T29/4913 , Y10T29/5136 , Y10T29/5137 , Y10T29/5313 , Y10T29/53178 , Y10T29/53187 , Y10T29/53191
摘要： A mounter including at least two mounting stages 109 and 110 where components are mounted onto boards transported from the upstream side in transportation direction of the board 120 and then transport the boards to the downstream side, and the mounter includes a first stopping unit 135 for stopping the board to place a board edge on the downstream side on a first fixed position which is in the downstream side from a first mountable area A, the first mountable area A being a mountable region where the components can be mounted on the first mounting stage 109 on the upstream side, and a second stopping unit 136 for stopping the board to place a board edge on the upstream side on a second fixed position which is the upstream side from a second mountable area A, the second mountable area A being a mountable region where the components can be mounted on the second mounting stage 110.
摘要翻译：一种安装器，包括至少两个安装台109和110，其中部件安装在从板120的运输方向上游侧传送的板上，然后将板运送到下游侧，并且安装器包括用于停止的第一停止单元135 所述板将第一固定位置的下游侧的板边缘从第一可安装区域A设置在下游侧，所述第一安装区域A为可安装在所述第一安装台109上的部件的安装区域以及第二止动单元136，用于在第二可固定区域A的上游侧的第二固定位置上停止基板在上游侧设置板边缘，第二可安装区域A为可安装区域其中组件可以安装在第二安装台110上。

32. 发明申请

US20060285965A1 Apparatus and method for removing semiconductor chip 有权
标题翻译：用于去除半导体芯片的装置和方法
公开(公告)号：US20060285965A1
公开(公告)日：2006-12-21
申请号：US10568501
申请日：2004-09-07
申请人： Akira Kabeshita , Kurayasu Hamasaki , Shozo Minamitani , Yoichi Makino , Noriyuki Tani
发明人： Akira Kabeshita , Kurayasu Hamasaki , Shozo Minamitani , Yoichi Makino , Noriyuki Tani
IPC分类号： B65G1/133
CPC分类号： H01L21/67132 , Y10T156/1132 , Y10T156/1944
摘要： While a vicinity of a bottom surface-side region of a pressure-sensitive adhesive sheet (3) corresponding to an adhesion region (R1) of a semiconductor chip (1) are sucked and held, a plurality of protruding portions (30) of a removing member (21) are brought into contact with the bottom surface of the semiconductor chip through the adhesive sheet at the region. Also, the adhesive sheet is sucked in between the respective protruding portions so as to change a surface bonding of the semiconductor chip to the adhesive sheet by-adhesion to a point bonding, and further the removing member is moved along the bottom surface of the semiconductor chip so as to change a position of the point bonding and decrease bonding force to the adhesive sheet by the adhesion. Then, the semiconductor chip is removed from the adhesive sheet.
摘要翻译：在与半导体芯片（1）的粘合区域（R 1）对应的粘合片（3）的底面侧区域的附近被吸住并保持的情况下，将多个突起部（30）移除部件（21）通过该区域的粘合片与半导体芯片的底面接触。此外，粘合片被吸入各个突出部分之间，以便将半导体芯片与粘合片的表面粘合改变为点粘合，并且还可以沿着半导体的底表面移动移除构件从而改变点粘合的位置，并通过粘合降低粘合片的粘合力。然后，将半导体芯片从粘合片上取出。

33. 发明申请

US20060042913A1 Substrate transfer apparatus for component mounting machine 失效
标题翻译：元件安装机基板输送装置
公开(公告)号：US20060042913A1
公开(公告)日：2006-03-02
申请号：US10521815
申请日：2003-08-04
申请人： Noriyuki Tani , Noboru Furuta
发明人： Noriyuki Tani , Noboru Furuta
IPC分类号： B65G43/10
CPC分类号： H05K13/0061
摘要： A mounting-waiting process for making a substrate to be transferred into a mounting process wait before the mounting process; and a substrate discharge-waiting process for making the substrate transferred from the mounting process wait before the following process are provided. When transfer of an unmounted substrate into the mounting process and transfer of a mounted substrate from the mounting process to the substrate discharge-waiting process are performed simultaneously, it is detected, by a substrate-arrival detecting sensor for detecting the mounted substrate transferred to the substrate discharge-waiting process and a substrate-continuity detecting sensor for detecting the unmounted substrate continuously transferred following to the mounted substrate, that a plurality of substrates have been transferred into the discharge-waiting process continuously.
摘要翻译：用于使衬底转移到安装过程中的安装等待过程在安装过程之前等待; 以及用于使从安装过程转移的衬底的衬底放电等待处理在提供以下处理之前等待。当将未安装的基板转移到安装过程中并且将安装的基板从安装过程传送到基板放电等待处理时，通过基板到达检测传感器检测被传送到基板的安装基板基板放电等待处理和基板连续性检测传感器，用于检测在安装的基板之后连续转印的未安装的基板，多个基板已经被连续转移到放电等待处理中。

34. 发明授权

US5739225A Process for preparing olefin polymer, and ethylenic polymer 失效
标题翻译：制备烯烃聚合物和烯属聚合物的方法
公开(公告)号：US5739225A
公开(公告)日：1998-04-14
申请号：US666471
申请日：1996-06-28
申请人： Toshinori Tazaki , Shuji Machida , Nobuo Kawasaki , Nobuhiro Yabunouchi , Yasunori Kadoi , Mizutomo Takeuchi , Kenji Nakacho , Haruo Shikuma , Noriyuki Tani
发明人： Toshinori Tazaki , Shuji Machida , Nobuo Kawasaki , Nobuhiro Yabunouchi , Yasunori Kadoi , Mizutomo Takeuchi , Kenji Nakacho , Haruo Shikuma , Noriyuki Tani
IPC分类号： C08F4/6392 , C08F4/64 , C08F4/642 , C08F4/659 , C08F4/6592 , C08F10/00 , C08F10/02 , C08F110/02 , C08F210/02 , C08F210/16 , C08F210/18
CPC分类号： C08F10/02 , C08F10/00 , C08F110/02 , C08F210/02 , C08F210/16 , C08F210/18 , C08F4/6392 , C08F4/65912 , C08F4/6592 , Y10S526/943
摘要： An olefin polymer is prepared by homopolymerizing an olefin or copolymerizing two different olefins or an olefin and another polymerizable unsaturated compound in the presence of a polymerization catalyst containing (A) a transition metal compound represented by the formula (I): CpML.sub.x-1 (I) wherein M is a metallic element of Groups 3 to 10 of the Periodic Table or a metallic element of the lanthanide series; Cp is a cyclic compound group having a cyclopentadienyl skeleton of 5 to 30 carbon atoms; L is R', OR', SR', SO.sub.3 R'N'R'R", PR'R", wherein R' and R" are each a C.sub.1-20 hydrocarbon group or a silyl group, NO.sub.2, a halogen atom, a 1-pyrrolyl group or a 1-pyrrolidinyl group, with the proviso that at least one of the L groups is OR', SR', N'R'R" or PR'R", wherein R' and R" are each a C.sub.1-20 hydrocarbon group or a silyl group; and x is a valence number of M, and when a plurality of L's are present, the respective L's may be the same or different, and (B) an aluminoxane, wherein the molar ratio of the component (B)/component (A) (in terms of the metallic atoms) is in the range of 2 to 500.
摘要翻译： PCT No.PCT / JP94 / 02251 Sec。 371日期：1996年6月28日 102（e）日期1996年6月28日PCT 1994年12月27日PCT PCT。 WO95 / 18158 PCT出版物日期：1995年7月6日烯烃聚合物通过在含有（A）由式（I）表示的过渡金属化合物的聚合催化剂存在下，使烯烃均聚或共聚两种不同的烯烃或烯烃和另一种可聚合不饱和化合物来制备： CpMLx-1（I）其中M是周期表第3至10族的金属元素或镧系金属元素; Cp是具有5至30个碳原子的环戊二烯基骨架的环状化合物基团; L是R'，OR'，SR'，SO3R'N'R'R“，PR'R”，其中R'和R“各自为C1-20烃基或甲硅烷基，NO2，卤素原子，1-吡咯基或1-吡咯烷基，条件是至少一个L基团是OR'，SR'，N'R'R“或PR'R”，其中R' 和R“各自为C 1-20烃基或甲硅烷基; （B）/成分（A）的摩尔比，X是价数M，当存在多个L s时，各自的L可以相同或不同，（B）铝氧烷，（以金属原子计）在2〜500的范围内。

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