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    • 38. 发明申请
    • Composite heater and chill plate
    • 复合加热器和冷却板
    • US20070251456A1
    • 2007-11-01
    • US11414730
    • 2006-04-27
    • Harald HerchenSharathchandra SomayajiTetsuya IshikawaBrian Lue
    • Harald HerchenSharathchandra SomayajiTetsuya IshikawaBrian Lue
    • C23C16/00
    • H01L21/67109
    • An integrated system for baking and chilling wafers includes a heater for heating a wafer to an elevated temperature, a chiller for cooling the wafer, and a shuttle operatively connected to the heater and the chiller for transferring the wafer between the heater and the chiller. The chiller further includes a low thermal mass wafer support for providing support to a bottom surface of a wafer and a chill plate coupled to the low thermal mass wafer support for cooling the wafer. The low thermal mass wafer support has a higher thermal conductivity in the plane parallel to the bottom surface of the wafer than in the direction perpendicular to the bottom surface of the wafer. The low thermal mass wafer support can further include a plurality of proximity pins for supporting the wafer.
    • 用于烘烤和冷却晶片的集成系统包括用于将晶片加热到高温的加热器,用于冷却晶片的冷却器和可操作地连接到加热器的梭子和用于在加热器和冷却器之间传送晶片的冷却器。 冷却器还包括用于向晶片的底表面提供支撑的低热质量晶片支撑件和耦合到低热质量晶片支撑件以冷却晶片的冷却板。 低热质量晶片支架在垂直于晶片底表面的方向上平行于晶片底表面的平面具有较高的热导率。 低热质量晶片支撑件还可以包括用于支撑晶片的多个接近销。