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31. 发明申请

US20060247160A1 Metabolic gene polynucleotides and polypeptides and uses thereof 失效
标题翻译：代谢基因多核苷酸和多肽及其用途
公开(公告)号：US20060247160A1
公开(公告)日：2006-11-02
申请号：US10466376
申请日：2002-01-15
申请人： Mary Ruth Erickson , Barbara Chicca , Bernard Bihain , Hiroaki Tanaka
发明人： Mary Ruth Erickson , Barbara Chicca , Bernard Bihain , Hiroaki Tanaka
IPC分类号： A61K38/22
CPC分类号： A61K38/1709 , A01K2217/05 , A01K2217/075 , C07K14/47
摘要： The present invention relates to the field of metabolic research. Metabolic disorders, such as obesity, are a public health problem that is serious and widespread. GMG-3, GMG-4, Cluster 1, GMG-6A, or GMG-6B polypeptides have been identified that are beneficial in the treatment of metabolic disorders. These compounds should be effective for reducing body mass and for treating metabolic-related diseases and disorders. These metabolic-related diseases and disorders include hyperlipidemias, atherosclerosis, diabetes, and hypertension.
摘要翻译：本发明涉及代谢研究领域。代谢紊乱，如肥胖，是一个严重而广泛的公共卫生问题。已经鉴定出有益于治疗代谢紊乱的GMG-3，GMG-4，簇1，GMG-6A或GMG-6B多肽。这些化合物应该有效减少体重和治疗与代谢有关的疾病和病症。这些代谢相关的疾病和病症包括高脂血症，动脉粥样硬化，糖尿病和高血压。

32. 发明授权

US07105896B2 Thin film transistor circuit device, production method thereof and liquid crystal display using the think film transistor circuit device 有权
标题翻译：薄膜晶体管电路器件及其制造方法以及使用思科晶体管电路器件的液晶显示器
公开(公告)号：US07105896B2
公开(公告)日：2006-09-12
申请号：US10895404
申请日：2004-07-21
申请人： Hiroaki Tanaka , Kyounei Yasuda , Seiji Suzuki
发明人： Hiroaki Tanaka , Kyounei Yasuda , Seiji Suzuki
IPC分类号： H01L27/12
CPC分类号： G02F1/13458 , G02F1/136286 , G02F2001/13629 , H01L27/124 , H01L29/456 , H01L29/4908 , H01L29/66765 , H01L29/78669 , H01L29/78678
摘要： A thin film transistor circuit device and the production method thereof is demanded for a thin film transistor circuit device, which contains wiring having a structure of an aluminum alloy in a lower layer and a molybdenum alloy in an upper layer, wherein corrosion in air of the molybdenum alloy does not proceed easily. A thin film transistor circuit device which exposes a portion of wiring covered with an insulating film that connects thin film transistors of a main circuit region formed on a center portion of a substrate to a protection circuit region formed on an outer periphery of the substrate, which contains on the exposed surface a terminal which is formed of terminal electrode metal, wherein an uppermost surface of the wiring is a molybdenum alloy comprising niobium.
摘要翻译：薄膜晶体管电路器件及其制造方法要求薄膜晶体管电路器件，其包含具有下层中的铝合金结构的布线和上层的钼合金，其中在钼合金不容易进行。一种薄膜晶体管电路器件，其使覆盖有绝缘膜的布线的一部分露出，所述绝缘膜将形成在基板的中心部分上的主电路区域的薄膜晶体管连接到形成在基板的外周上的保护电路区域，在暴露的表面上包含由端子电极金属形成的端子，其中布线的最上表面是包含铌的钼合金。

33. 发明授权

US07074901B2 Isolated human vCOL16A1 polypeptide and fragments thereof 失效
标题翻译：分离的人vCOL16A1多肽及其片段
公开(公告)号：US07074901B2
公开(公告)日：2006-07-11
申请号：US09924340
申请日：2001-08-06
申请人： Stephane Bejanin , Hiroaki Tanaka
发明人： Stephane Bejanin , Hiroaki Tanaka
IPC分类号： C07K14/78
CPC分类号： C07K14/4711 , A01K2217/05 , A61K38/00 , A61K48/00 , C07K14/47 , C07K2319/02 , C12Q1/6883 , G01N33/5023 , G01N33/6896 , G01N2800/2821
摘要： The invention concerns GENSET polynucleotides and polypeptides. Such GENSET products may be used as reagents in forensic analyses, as chromosome markers, as tissue/cell/organelle-specific markers, in the production of expression vectors. In addition, they may be used in screening and diagnosis assays for abnormal GENSET expression and/or biological activity and for screening compounds that may be used in the treatment of GENSET-related disorders.
摘要翻译：本发明涉及GENSET多核苷酸和多肽。在产生表达载体中，这种GENSET产品可用作法医分析中的试剂，作为染色体标记物，作为组织/细胞/细胞器特异性标志物。此外，它们可用于异常GENSET表达和/或生物活性的筛选和诊断测定，并用于筛选可用于治疗GENSET相关疾病的化合物。

34. 发明授权

US07002227B2 Pressure detecting device 有权
标题翻译：压力检测装置
公开(公告)号：US07002227B2
公开(公告)日：2006-02-21
申请号：US10759122
申请日：2004-01-20
申请人： Inao Toyoda , Teruo Oda , Seiichirou Otake , Hiroaki Tanaka
发明人： Inao Toyoda , Teruo Oda , Seiichirou Otake , Hiroaki Tanaka
IPC分类号： H01L29/84
CPC分类号： G01L9/0098 , G01L9/0052
摘要： A pressure detecting device includes a semiconductor substrate (30, 200, 300, 400) for outputting an electrical signal corresponding to an applied pressure received from a pressure transmitting member (20) having electrically conductive properties disposed on the front surface of the semiconductor substrate (30, 200, 300, 400). The substrate (30, 200, 300, 400) and the pressure transmitting member (20) are accommodated in a housing (10). A lead member (50) electrically independent of the housing (10) is accommodated in the housing (10) at the back surface side of the semiconductor substrate (30, 200, 300, 400), and the lead member (50) and an electrode (35b) of the substrate (30, 200, 300, 400) are electrically connected to each other through conductive adhesive material (40). The housing (10) preferably includes a first portion (101), a second portion (102) having smaller thermal conductivity than the first portion, and an electrically conductive partition portion (103).
摘要翻译：压力检测装置包括半导体衬底（30,200,300,400），用于输出对应于从具有设置在半导体衬底的前表面上的导电性能的压力传递部件（20）接收的施加的压力的电信号（ 30,200,300,400）。衬底（30,200,300,400）和压力传递构件（20）容纳在壳体（10）中。电气独立于壳体（10）的引线构件（50）在半导体衬底（30,200,300,400）的背面侧容纳在壳体（10）中，并且引线构件（50）和基板（30,200,300,400）的电极（35b）通过导电粘合材料（40）彼此电连接。壳体（10）优选地包括第一部分（101），具有比第一部分更小的热导率的第二部分（102）和导电分隔部分（103）。

35. 发明申请

US20050269654A1 Pressure sensor 有权
标题翻译：压力传感器
公开(公告)号：US20050269654A1
公开(公告)日：2005-12-08
申请号：US11137404
申请日：2005-05-26
申请人： Hiroaki Tanaka , Inao Toyoda , Ichiharu Kondo , Makoto Totani
发明人： Hiroaki Tanaka , Inao Toyoda , Ichiharu Kondo , Makoto Totani
IPC分类号： G01L9/00 , G01L9/04 , G01L9/06 , G01L19/06 , H01L29/84
CPC分类号： G01L19/147 , G01L9/0054
摘要： A pressure sensor chip includes a diaphragm and pads. A flexible printed circuit board (FPC) includes a resin sheet having a through-hole and wiring patterns that are formed within the resin sheet and sealed. The resin sheet is press-fitted to the pressure sensor chip such that the diaphragm is bared at the through-hole. The wiring patterns are connected to the pads, and junctions between the wiring patterns and the pads are sealed with the resin sheet.
摘要翻译：压力传感器芯片包括隔膜和垫片。柔性印刷电路板（FPC）包括具有通孔的树脂片和形成在树脂片内并被密封的布线图案。树脂片被压配合到压力传感器芯片，使得隔膜在通孔处露出。布线图案连接到焊盘，并且布线图案和焊盘之间的接合部用树脂片密封。

36. 发明授权

US06890783B2 Active matrix substrate plate and manufacturing method therefor 失效
标题翻译：有源矩阵基板及其制造方法
公开(公告)号：US06890783B2
公开(公告)日：2005-05-10
申请号：US10242011
申请日：2002-09-12
申请人： Shigeru Kimura , Takahiko Watanabe , Tae Yoshikawa , Hiroyuki Uchida , Shusaku Kido , Shinichi Nakata , Tsutomu Hamada , Hisanobu Shimodouzono , Satoshi Doi , Toshihiko Harano , Akitoshi Maeda , Satoshi Ihida , Hiroaki Tanaka , Takasuke Hayase , Shouichi Kuroha , Hirofumi Ihara , Kazushige Takechi
发明人： Shigeru Kimura , Takahiko Watanabe , Tae Yoshikawa , Hiroyuki Uchida , Shusaku Kido , Shinichi Nakata , Tsutomu Hamada , Hisanobu Shimodouzono , Satoshi Doi , Toshihiko Harano , Akitoshi Maeda , Satoshi Ihida , Hiroaki Tanaka , Takasuke Hayase , Shouichi Kuroha , Hirofumi Ihara , Kazushige Takechi
IPC分类号： G02F1/1343 , G02F1/136 , G02F1/1368 , G09F9/30 , H01L21/00 , H01L21/3205 , H01L21/336 , H01L21/84 , H01L23/52 , H01L29/423 , H01L29/43 , H01L29/49 , H01L29/786 , H01L31/036
CPC分类号： G02F1/134363
摘要： An active matrix substrate plate having superior properties is manufactured at high yield using four photolithographic fabrication steps. In step 1, the scanning line and the gate electrode extending from the scanning line are formed in the glass plate. In step 2, the gate insulation layer and the semiconductor layer comprised by amorphous silicon layer and n+ amorphous silicon layer is laminated to provide the semiconductor layer for the TFT section. In step 3, the transparent conductive layer and the metallic layer are laminated, and the signal line, the drain electrode extending from the signal line, the pixel electrode and the source electrode extending from the pixel electrode are formed, and the n+ amorphous silicon layer of the channel gap is removed by etching. In step 4, the protective insulation layer is formed, and the protective insulation layer and the metal layer above the pixel electrode are removed by etching.
摘要翻译：使用四个光刻制造步骤以高产率制造具有优异性能的有源矩阵基板。在步骤1中，扫描线和从扫描线延伸的栅电极形成在玻璃板中。在步骤2中，层叠由非晶硅层和n + +非晶硅层构成的栅绝缘层和半导体层，以提供TFT部分的半导体层。在步骤3中，层叠透明导电层和金属层，形成信号线，从信号线延伸的漏极，从像素电极延伸的像素电极和源电极，通过蚀刻除去沟道间隙的+非晶硅层。在步骤4中，形成保护绝缘层，通过蚀刻除去保护绝缘层和像素电极上方的金属层。

37. 发明申请

US20050075285A1 Gssp4 polynucleotides and polypeptides and uses thereof 失效
标题翻译： Gssp4多核苷酸和多肽及其用途
公开(公告)号：US20050075285A1
公开(公告)日：2005-04-07
申请号：US10467554
申请日：2002-02-07
申请人： Barbara Bour , John Chicca , Blake Denison , Frances Yen-Potin , Bernard Bihain , Stephane Bejanin , Hiroaki Tanaka , Severin Jobert , Jean-Yves Giordano , Jean-Baptiste Dumas Milne Edwards
发明人： Barbara Bour , John Chicca , Blake Denison , Frances Yen-Potin , Bernard Bihain , Stephane Bejanin , Hiroaki Tanaka , Severin Jobert , Jean-Yves Giordano , Jean-Baptiste Dumas Milne Edwards
IPC分类号： A61K38/00 , A61K38/10 , A61K38/08
CPC分类号： C07K14/5759 , A61K38/00 , C07K14/775 , Y10S514/909
摘要： The present invention relates to the field of metabolic research. Metabolic disorders, such as obesity, are a public health problem that is serious and widespread. GSSP4 polypeptides have been identified that are believed to be beneficial in the treatment of metabolic disorders. These compounds should be effective for reducing cholesterol levels, body mass, body fat, and for treating metabolic-related diseases and disorders. The metabolic-related diseases or disorders envisioned to be treated by the methods of the invention include, but are not limited to: obesity, hyperlipidemia, hypercholesterolemia, atherosclerosis, diabetes, glucose intolerance, insulin resistance and hypertension.
摘要翻译：本发明涉及代谢研究领域。代谢紊乱，如肥胖，是一个严重而广泛的公共卫生问题。已经鉴定出GSSP4多肽被认为在治疗代谢紊乱中是有益的。这些化合物应有效降低胆固醇水平，体重，体脂肪，以及治疗与代谢有关的疾病和病症。预期通过本发明的方法治疗的代谢相关疾病或病症包括但不限于：肥胖症，高脂血症，高胆固醇血症，动脉粥样硬化，糖尿病，葡萄糖不耐受，胰岛素抵抗和高血压。

38. 发明申请

US20050052851A1 Integrated circuit card and a method of manufacturing the same 失效
标题翻译：集成电路卡及其制造方法
公开(公告)号：US20050052851A1
公开(公告)日：2005-03-10
申请号：US10902024
申请日：2004-07-30
申请人： Nobuaki Yamada , Kazunari Suzuki , Bunshi Kuratomi , Hiroaki Tanaka , Akira Onozawa
发明人： Nobuaki Yamada , Kazunari Suzuki , Bunshi Kuratomi , Hiroaki Tanaka , Akira Onozawa
IPC分类号： B42D15/10 , G06K19/077 , H01L21/44 , H01L21/48 , H01L21/50 , H01L23/02 , H04B1/38 , H04M1/00 , H05K1/14
CPC分类号： G06K19/07745 , G06K19/077 , G06K19/07718 , G06K19/07724 , G06K19/07733 , G06K19/07743 , H01L2224/45144 , H01L2224/48091 , H01L2224/48228 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/19041 , H01L2924/00014 , H01L2924/00
摘要： A multi-function structure of a plug-in universal IC card is to be promoted and the manufacturing cost is to be reduced. The body of the plug-in UICC is constructed of a molding resin. A tape substrate and a chip mounted on one side of the tape substrate are sealed in the interior of the molding resin. A side opposite to the chip mounting side of the tape substrate is exposed to the exterior of the molding resin and constitutes a surface portion of the plug-in UICC. Contact patterns serving as external terminals of the plug-in UICC are formed on the surface of the tape substrate exposed to the exterior of the molding resin. In the plug-in UICC whose body is constructed of molding resin, cracking of the chip can be prevented effectively even in the case where the chip is large-sized.
摘要翻译：推动插入式通用IC卡的多功能结构，降低制造成本。插件UICC的主体由模制树脂构成。胶带基板和安装在带基材一侧的芯片被密封在模塑树脂的内部。与带基片的芯片安装侧相对的一侧暴露于模制树脂的外部，构成插件UICC的表面部分。作为插件UICC的外部端子的接触图案形成在暴露于成型树脂的外部的带基材的表面上。在其主体由模制树脂构成的插件UICC中，即使在芯片尺寸较大的情况下也可以有效地防止芯片的开裂。

39. 发明授权

US06838513B2 Ink for golf ball 有权
标题翻译：油墨高尔夫球
公开(公告)号：US06838513B2
公开(公告)日：2005-01-04
申请号：US10152680
申请日：2002-05-23
申请人： Yoshiyuki Okido , Satoru Komatsu , Hiroaki Tanaka , Kazuhisa Fushihara
发明人： Yoshiyuki Okido , Satoru Komatsu , Hiroaki Tanaka , Kazuhisa Fushihara
IPC分类号： A63B37/00 , A63B37/12 , A63B45/02 , B41M1/40 , C08G18/40 , C08G18/79 , C09D11/037 , C09D11/10 , C09D11/102 , A63B37/14
CPC分类号： C09D11/102 , A63B37/0003 , A63B37/0024 , A63B37/0039 , A63B37/0097 , A63B37/12 , A63B45/02 , B41M1/40 , C08G18/4081 , C08G18/792
摘要： A golf ball 1 has a core 2, a cover 3, a mark layer 4, and a finishing coat layer 5. An ink used for the mark layer 4 includes an isocyanate curing agent that contains a diisocyanate trimer, a base material, and a colorant. Preferred curing agent contains an isophorone diisocyanate trimer. The ink includes a diisocyanate curing agent at equal to or greater than 1% by weight and equal to or less than 20% by weight, calculated on the basis of the solid content. The base material includes a polymer having a hydroxyl group as a principal component. The “NCO/OH” value, which is a ratio of isocyanate groups of the isocyanate curing agent and hydroxyl groups of the base material, is equal to or greater than 0.5 and equal to or less than 2.0. The mark layer 4 may be printed on a base coat layer, alternatively, may be printed on a crosslinked rubber. This ink has excellent adhesiveness to a base.
摘要翻译：高尔夫球1具有芯2，盖3，标记层4和精加工涂层5.用于标记层4的油墨包括异氰酸酯固化剂，其含有二异氰酸酯三聚物，基材和着色剂。优选的固化剂含有异佛尔酮二异氰酸酯三聚体。该油墨包括基于固体含量计算的等于或大于1重量％且等于或小于20重量％的二异氰酸酯固化剂。基材包括具有羟基作为主要成分的聚合物。异氰酸酯固化剂的异氰酸酯基与基材的羟基的比例为“NCO / OH”，为0.5以上且2.0以下。标记层4可以印刷在底涂层上，或者可以印刷在交联橡胶上。该油墨对基材具有优异的粘附性。

40. 发明授权

US06798320B2 Microstrip line having a line electrode with integral edge electrodes 有权
标题翻译：微带线具有具有整体边缘电极的线电极
公开(公告)号：US06798320B2
公开(公告)日：2004-09-28
申请号：US10059623
申请日：2002-01-29
申请人： Yutaka Ida , Yoshikazu Yagi , Tsutomu Ieki , Hiroaki Tanaka , Osamu Chikagawa
发明人： Yutaka Ida , Yoshikazu Yagi , Tsutomu Ieki , Hiroaki Tanaka , Osamu Chikagawa
IPC分类号： H01P308
CPC分类号： H01P3/081 , H01P1/20363 , H01P1/20381 , H01P3/088 , H01P7/082 , H01P11/003 , H05K1/0237 , H05K1/0242 , H05K1/162 , H05K3/107 , H05K3/4092 , H05K2201/037 , H05K2201/09036 , H05K2201/098 , H05K2201/09981
摘要： A microstrip line includes a strip conductor, a line electrode, and edge electrodes provided at the edges on both sides of the line electrode. The construction of the microstrip line greatly reduces the edge effect of the line electrode and decreases the conductor loss of the line electrode.
摘要翻译：微带线包括带状导体，线电极和设置在线电极两侧边缘的边缘电极。微带线的结构大大降低了线电极的边缘效应，并降低了线电极的导体损耗。

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