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    • 33. 发明授权
    • Method for manufacturing a semiconductor device
    • 半导体器件的制造方法
    • US07402495B2
    • 2008-07-22
    • US11412951
    • 2006-04-28
    • Minori KajimotoMitsuhiro Noguchi
    • Minori KajimotoMitsuhiro Noguchi
    • H01L21/336H01L21/8236H01L21/8238
    • H01L27/105H01L21/76807H01L27/11526H01L27/11546H01L29/78
    • A method of manufacturing a semiconductor device includes forming a first semiconductor region of a first conductive type and a second semiconductor region of a second conductive type in a predetermined region of the semiconductor substrate of a first conductive type; and first to third ion implantation processes sequentially executed for controlling threshold voltages corresponding to each transistor formed on the semiconductor substrate the first semiconductor region, and the second semiconductor region respectively. The first ion implantation process is executed in a high-threshold low-voltage transistor forming region of the first semiconductor region after forming the first semiconductor region. The second ion implantation process is executed in a high-threshold low-voltage transistor forming region of the second semiconductor region. The third ion implantation is executed simultaneously in the low-threshold low-voltage transistor forming regions of the semiconductor substrate and the second semiconductor region respectively.
    • 一种制造半导体器件的方法包括在第一导电类型的半导体衬底的预定区域中形成第一导电类型的第一半导体区域和第二导电类型的第二半导体区域; 以及分别顺序地执行用于控制对应于形成在半导体衬底上的每个晶体管的第一半导体区域和第二半导体区域的阈值电压的第一至第三离子注入工艺。 在形成第一半导体区域之后,第一离子注入工艺在第一半导体区域的高阈值低电压晶体管形成区域中执行。 在第二半导体区域的高阈值低压晶体管形成区域中执行第二离子注入工艺。 分别在半导体衬底和第二半导体区域的低阈值低压晶体管形成区域中同时执行第三离子注入。
    • 36. 发明授权
    • Nonvolatile semiconductor memory
    • 非易失性半导体存储器
    • US07245534B2
    • 2007-07-17
    • US11135415
    • 2005-05-24
    • Akira GodaMitsuhiro NoguchiMinori KajimotoYuji Takeuchi
    • Akira GodaMitsuhiro NoguchiMinori KajimotoYuji Takeuchi
    • G11C11/34
    • G11C8/10G11C16/0483G11C16/08G11C16/10H01L27/115H01L27/11521
    • A nonvolatile semiconductor memory includes: a memory cell array constituted by word lines, bit lines, and electrically erasable/rewritable memory cell transistors, which have respective tunnel insulating films and are arranged at the intersections of the word lines and the bit lines; and a word line transfer transistor, which is separated by an element isolation region, has a source diffusion layer, a channel region, a gate insulating film on the channel region, and a drain diffusion layer, and is connected to a word line and a gate electrode formed on the gate insulating film via a word line contact plug formed in the drain diffusion layer. The channel width of the word line transfer transistor is at least six times width of the word line contact plug, and the distance in a second direction between the word line contact plug and corresponding element isolation region is greater than distance in a first direction between the word line contact plug and corresponding element isolation region where, the first direction denotes a direction from the source diffusion layer towards the drain diffusion layer, and the second direction denotes a direction perpendicular to the first direction.
    • 非易失性半导体存储器包括:由字线,位线和电可擦除/可重写存储单元晶体管构成的存储单元阵列,其具有相应的隧道绝缘膜并且布置在字线和位线的交点处; 并且由元件隔离区隔开的字线传输晶体管在沟道区上具有源极扩散层,沟道区,栅极绝缘膜和漏极扩散层,并且连接到字线和 栅极通过形成在漏极扩散层中的字线接触插塞形成在栅极绝缘膜上。 字线传输晶体管的沟道宽度是字线接触插塞的至少六倍宽度,并且字线接触插塞和对应元件隔离区域之间的第二方向上的距离大于第二方向上的距离 字线接触插塞和对应元件隔离区域,其中第一方向表示从源极扩散层朝向漏极扩散层的方向,第二方向表示与第一方向垂直的方向。