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31. 发明申请

US20070070117A1 SPITTING METHOD OF AN ARRAY-TYPE INKJET IMAGE FORMING APPARATUS 有权
标题翻译：阵列型喷墨图像形成装置的偏移方法
公开(公告)号：US20070070117A1
公开(公告)日：2007-03-29
申请号：US11532609
申请日：2006-09-18
申请人： Jin-ho Park
发明人： Jin-ho Park
IPC分类号： B41J2/165
CPC分类号： B41J2/16585 , B41J2/16526
摘要： A spitting method of an array-type inkjet image forming apparatus which prints one or more papers and then ejects ink several times to keep nozzles in the optimal condition for printing, in which the number of spitting dots is in proportion to the number of resting dots of each of the nozzles during the printing process.
摘要翻译：一种阵列式喷墨图像形成装置的喷墨方法，其打印一张或多张纸，然后喷出墨水数次，以保持喷嘴处于打印的最佳状态，其中喷点的数量与静止点数成比例在打印过程中每个喷嘴。

32. 发明申请

US20060284928A1 Inkjet image forming apparatus and image-shift printing method thereof 审中-公开
标题翻译：喷墨图像形成装置及其图像转印印刷方法
公开(公告)号：US20060284928A1
公开(公告)日：2006-12-21
申请号：US11453149
申请日：2006-06-15
申请人： Jin-ho Park
发明人： Jin-ho Park
IPC分类号： B41J2/155
CPC分类号： B41J2/155 , B41J2/04513 , B41J2/04551 , B41J2/0458 , B41J2/04581 , B41J2202/20
摘要： An inkjet image forming apparatus and an image-shift printing method thereof. The image-shift printing method of the inkjet image forming apparatus that includes a printhead having a nozzle unit corresponding to the width of a print medium and iteratively prints identical data on a plurality of print media, includes shifting a print image at least once in a width direction of the print medium and printing the print image on the print medium.
摘要翻译：喷墨图像形成装置及其图像转换打印方法。喷墨图像形成装置的图像转换打印方法包括具有与打印介质的宽度相对应的喷嘴单元的打印头，并且在多个打印介质上迭代地打印相同的数据，包括将打印图像至少一次移动到打印介质的宽度方向并将打印图像打印在打印介质上。

33. 发明授权

US06666599B2 Carriage assembly of printer employing movable print head 有权
标题翻译：使用可移动打印头的打印机的支架组件
公开(公告)号：US06666599B2
公开(公告)日：2003-12-23
申请号：US09896113
申请日：2001-07-02
申请人： Jin-ho Park
发明人： Jin-ho Park
IPC分类号： B41J1122
CPC分类号： F16C29/02 , B41J19/00 , B41J25/304
摘要： In a carriage assembly of a printer employing a movable print head, bosses provided with respective bearing supporting holes, each inner circumferential surface of which has a predetermined radius of curvature, are formed at a side of a carriage, and bearing bushings, each of which has an outer circumferential surface having a different predetermined radius of curvature corresponding to that of the bearing supporting hole, are also formed so as to make a spherical pair with the bearing supporting hole. A shaft through-hole, through which a guiding rod is inserted slidably, is formed through each bearing bushing. The bearing bushing can rotate freely in the bearing supporting hole, and therefore, the axes of the carriage assembly and the guiding rod can be aligned automatically.
摘要翻译：在采用可移动打印头的打印机的托架组件中，在托架的一侧形成有各自的轴承支承孔的凸台，每个轴承支承孔的每个内圆周表面均具有预定的曲率半径，具有与轴承支撑孔相对应的具有不同的预定曲率半径的外周面也形成为与轴承支撑孔成球形。通过每个轴承衬套形成导向杆可滑动插入的轴通孔。轴承衬套可以在轴承支撑孔中自由旋转，因此滑架组件和导杆的轴线可以自动对齐。

34. 发明授权

US06648322B2 Paper feeding device for printer 有权
标题翻译：打印机送纸装置
公开(公告)号：US06648322B2
公开(公告)日：2003-11-18
申请号：US10210073
申请日：2002-08-02
申请人： Jin-ho Park
发明人： Jin-ho Park
IPC分类号： B65H306
CPC分类号： B65H3/0684 , B65H2301/423245 , B65H2402/31 , B65H2403/42
摘要： A paper feeding device for a printer. The device includes a paper feeding cassette to load a plurality of paper sheets, and a driving power source. A driving gear is driven by the driving power source, and a passive gear rotates interlockingly with the driving gear. A first link is provided, with one end pivotally installed on a rotation shaft of the driving gear, and another end coupled to a rotation shaft of the passive gear. A pickup gear rotates interlockingly with the passive gear, and a second link is provided, with one end rotatably installed on the rotation shaft of the passive gear, and with another end coupled to a rotation shaft of the pickup gear. A pickup roller is coaxially coupled to the pickup gear, to simultaneously rotate and press the paper so as to feed the paper sheets one by one into the printer body. A supporting arm is provided, with a first end coupled to a rotation shaft of the pickup roller, and a second end pivotally installed on a side of the printer body. Accordingly, variation of the paper contact angle with respect to the variation of the height of the paper stack is kept to a minimum, and therefore, paper feeding errors are prevented.
摘要翻译：一种用于打印机的送纸装置。该装置包括用于装载多个纸张的供纸盒和驱动电源。驱动齿轮由驱动动力驱动，被动齿轮与驱动齿轮联动旋转。提供第一连杆，其一端枢转地安装在驱动齿轮的旋转轴上，另一端联接到被动齿轮的旋转轴。拾取齿轮与被动齿轮互锁地旋转，并且提供第二连杆，其一端可旋转地安装在被动齿轮的旋转轴上，另一端联接到拾取齿轮的旋转轴。拾取辊同轴地联接到拾取齿轮，以同时旋转并按压纸张，以将纸张逐一送入打印机主体。提供支撑臂，其第一端联接到拾取辊的旋转轴，第二端枢转地安装在打印机主体的一侧。因此，纸张接触角相对于纸叠的高度的变化的变化保持最小，因此防止送纸错误。

35. 发明授权

US5755469A Wafer transfer blade 失效
标题翻译：晶圆转移叶片
公开(公告)号：US5755469A
公开(公告)日：1998-05-26
申请号：US501168
申请日：1995-07-11
申请人： Sun-yong Choi , Keun-hong Ryoo , Jin-ho Park
发明人： Sun-yong Choi , Keun-hong Ryoo , Jin-ho Park
IPC分类号： B65G49/07 , H01L21/677 , H01L21/68 , H01L21/687 , B25J15/00
CPC分类号： H01L21/68707 , Y10S414/141
摘要： A wafer transfer blade in a wafer transfer arm employed for a semiconductor device manufacturing process, includes a flat region whereon a wafer is loaded; and an end region being integral with the flat region and having a rounded side surface so as to deflect impact on the wafer when colliding with the transfer blade, to thereby reduce wafer edge chipping.
摘要翻译：用于半导体器件制造工艺的晶片传送臂中的晶片传送刀片包括其中加载晶片的平坦区域; 以及与平坦区域成一体的端部区域，并且具有圆形的侧表面，以便在与转印叶片碰撞时偏转对晶片的冲击，从而减少晶片边缘碎裂。

36. 发明授权

US08606146B2 Image forming apparatus and structure for installing consumables thereof 有权
标题翻译：用于安装其消耗品的图像形成装置和结构
公开(公告)号：US08606146B2
公开(公告)日：2013-12-10
申请号：US12923620
申请日：2010-09-29
申请人： Byung-jo Lee , Jin-ho Park , Kwoang-joe Seorl , Gun-wook Kim
发明人： Byung-jo Lee , Jin-ho Park , Kwoang-joe Seorl , Gun-wook Kim
IPC分类号： G03G15/04
CPC分类号： G03G21/1619 , G03G15/0121 , G03G15/0863 , G03G15/0896 , G03G21/16 , G03G21/1623 , G03G21/1676 , G03G21/1875 , G03G2221/163
摘要： A structure for installing consumables of an image forming apparatus, the structure comprising: a frame; a plurality of consumables which comprises irregular installation preventing units in different locations; a plurality of irregular installation preventing keys which prevents an irregular installation of the plurality of consumables by an interaction with the irregular installation preventing units; and an installation guide member which is installed in the frame, comprising a key installation unit to guide the plurality of irregular installation preventing keys to be installed differently for each of the consumables and having the plurality of consumables installed therein.
摘要翻译：一种用于安装图像形成装置的消耗品的结构，所述结构包括：框架; 多个消耗品，其包括不同位置的不规则安装防止单元; 多个不规则安装防止键，通过与不规则安装防止单元的相互作用防止多个消耗品的不规则安装; 以及安装在所述框架中的安装引导构件，所述安装引导构件包括键安装单元，用于引导所述多个不规则安装防止键以针对每个所述消耗品不同地安装并且安装有所述多个消耗品。

37. 发明授权

US08288275B2 Method forming contact plug for semiconductor device using H2 remote plasma treatment 有权
标题翻译：使用H2远程等离子体处理形成用于半导体器件的接触插塞的方法
公开(公告)号：US08288275B2
公开(公告)日：2012-10-16
申请号：US12271220
申请日：2008-11-14
申请人： Jin-ho Park , Gil-heyun Choi , Sang-woo Lee , Jun-ho Park , Ho-ki Lee
发明人： Jin-ho Park , Gil-heyun Choi , Sang-woo Lee , Jun-ho Park , Ho-ki Lee
IPC分类号： H01L21/44
CPC分类号： H01L21/76843 , H01L21/7684 , H01L21/76862
摘要： Provided are methods of forming a contact plug of a semiconductor device. Methods of forming a contact plug of a semiconductor device may include forming an interlayer insulating layer on a semiconductor substrate on which a lower structure is formed, forming a contact hole in the interlayer insulating layer, the contact hole exposing the lower structure, and forming a W layer and then a WN layer to form a W/WN barrier layer in the contact hole. Methods may include H2 remote plasma treating the W/WN barrier layer, forming a W-plug on the H2 remote plasma treated W/WN barrier layer to fill the contact hole, and chemical mechanical polishing (CMP) the W-plug and then the W/WN barrier layer in order to expose the interlayer insulating layer.
摘要翻译：提供了形成半导体器件的接触插塞的方法。形成半导体器件的接触插塞的方法可以包括在其上形成下部结构的半导体衬底上形成层间绝缘层，在层间绝缘层中形成接触孔，暴露下部结构的接触孔，并形成 W层，然后形成WN层，以在接触孔中形成W / WN阻挡层。方法可以包括H2远程等离子体处理W / WN阻挡层，在H2远程等离子体处理的W / WN阻挡层上形成W-塞以填充接触孔，以及化学机械抛光（CMP）W-塞，然后 W / WN阻挡层，以露出层间绝缘层。

38. 发明授权

US07998810B2 Methods of forming integrated circuit devices having stacked gate electrodes 有权
标题翻译：形成具有层叠栅电极的集成电路器件的方法
公开(公告)号：US07998810B2
公开(公告)日：2011-08-16
申请号：US12424922
申请日：2009-04-16
申请人： Byung-hee Kim , Gil-heyun Choi , Sang-woo Lee , Chang-won Lee , Jin-ho Park , Eun-ji Jung , Jeong-gil Lee
发明人： Byung-hee Kim , Gil-heyun Choi , Sang-woo Lee , Chang-won Lee , Jin-ho Park , Eun-ji Jung , Jeong-gil Lee
IPC分类号： H01L21/336
CPC分类号： H01L27/11521 , H01L21/28273 , H01L29/66545
摘要： A method of forming a gate electrode of a semiconductor device is provided, the method including: forming a plurality of stacked structures each comprising a tunnel dielectric layer, a first silicon layer for floating gates, an intergate dielectric layer, a second silicon layer for control gates, and a mask pattern, on a semiconductor substrate in the stated order; forming a first interlayer dielectric layer between the plurality of stacked structures so that a top surface of the mask pattern is exposed; selectively removing the mask pattern of which the top surface is exposed; forming a third silicon layer in an area from which the hard disk layer was removed, and forming a silicon layer comprising the third silicon layer and the second silicon layer; recessing the first interlayer dielectric layer so that an upper portion of the silicon layer protrudes over the he first interlayer dielectric layer; and forming a metal silicide layer on the upper portion of the silicon layer.
摘要翻译：提供一种形成半导体器件的栅电极的方法，所述方法包括：形成多个堆叠结构，每个堆叠结构包括隧道介电层，用于浮置栅极的第一硅层，栅极间介电层，用于控制的第二硅层栅极和掩模图案，以所述顺序在半导体衬底上; 在所述多个堆叠结构之间形成第一层间电介质层，使得所述掩模图案的顶表面露出; 选择性地去除其顶表面暴露的掩模图案; 在去除所述硬盘层的区域中形成第三硅层，以及形成包含所述第三硅层和所述第二硅层的硅层; 使第一层间电介质层凹陷，使得硅层的上部突出在第一层间介电层上; 以及在所述硅层的上部形成金属硅化物层。

39. 发明授权

US07968410B2 Method of fabricating a semiconductor device using a full silicidation process 有权
标题翻译：使用全硅化工艺制造半导体器件的方法
公开(公告)号：US07968410B2
公开(公告)日：2011-06-28
申请号：US12460945
申请日：2009-07-27
申请人： Eun-ji Jung , Sang-woo Lee , Jeong-gil Lee , Gil-heyun Choi , Chang-won Lee , Byung-hee Kim , Jin-ho Park
发明人： Eun-ji Jung , Sang-woo Lee , Jeong-gil Lee , Gil-heyun Choi , Chang-won Lee , Byung-hee Kim , Jin-ho Park
IPC分类号： H01L21/336
CPC分类号： H01L27/11573 , H01L21/28123 , H01L21/28282
摘要： A method of fabricating a semiconductor device includes: forming a first polysilicon layer having a first thickness in a peripheral circuit region formed on a substrate; forming a stack structure comprising a first tunneling insulating layer, a charge trap layer, and a blocking insulating layer in a memory cell region formed on the substrate; forming a second polysilicon layer having a second thickness that is less than the first thickness on the blocking insulating layer; and forming gate electrodes by siliciding the first and second polysilicon layers.
摘要翻译：一种制造半导体器件的方法包括：在形成在衬底上的外围电路区域中形成具有第一厚度的第一多晶硅层; 在形成在所述基板上的存储单元区域中形成包括第一隧道绝缘层，电荷陷阱层和阻挡绝缘层的堆叠结构; 在所述阻挡绝缘层上形成具有小于所述第一厚度的第二厚度的第二多晶硅层; 以及通过硅化第一和第二多晶硅层来形成栅电极。

40. 发明授权

US07521357B2 Methods of forming metal wiring in semiconductor devices using etch stop layers 有权
标题翻译：使用蚀刻停止层在半导体器件中形成金属布线的方法
公开(公告)号：US07521357B2
公开(公告)日：2009-04-21
申请号：US11063936
申请日：2005-02-23
申请人： Sang-woo Lee , Gil-heyun Choi , Sang-bom Kang , Jong-myeong Lee , Jin-ho Park
发明人： Sang-woo Lee , Gil-heyun Choi , Sang-bom Kang , Jong-myeong Lee , Jin-ho Park
IPC分类号： H01L21/4763
CPC分类号： H01L21/76846 , H01L21/76841 , H01L21/76856 , H01L21/76877
摘要： A method of forming a metal wiring in a semiconductor device can include forming an etch stop layer outside a contact hole formed in an insulation layer and avoiding forming the etch stop layer inside the contact hole. A conductive layer can be formed on the etch stop layer outside the contact hole and on an exposed conductive pattern inside the contact hole and on a sidewall of the contact hole and a metal layer can be formed on the conductive layer to fill the contact hole.
摘要翻译：在半导体器件中形成金属布线的方法可以包括在形成在绝缘层中的接触孔之外形成蚀刻停止层，并避免在接触孔内形成蚀刻停止层。可以在接触孔外部的蚀刻停止层上形成导电层，并且在接触孔内部和接触孔的侧壁上的暴露的导电图案上形成导电层，并且可以在导电层上形成金属层以填充接触孔。

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