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    • 34. 发明授权
    • Ink jet head including vibration plate and electrode substrate
    • 喷墨头包括振动板和电极基板
    • US06332669B1
    • 2001-12-25
    • US09092655
    • 1998-06-05
    • Seiichi KatoKouichi OhtakaHiromichi KomaiJunichi Azumi
    • Seiichi KatoKouichi OhtakaHiromichi KomaiJunichi Azumi
    • B41J204
    • B41J2/14314B41J2202/18
    • An ink jet head of the present invention compresses ink with an electrostatic force generated between each vibration plate and a counter electrode facing it. A glass substrate is formed with through holes in which a conductor is buried. A metal wiring pattern and conductor bumps are provided on the rear of each counter electrode. The conductor bumps and counter electrodes associated therewith are electrically connected together. Ink is fed from the rear of the glass substrate to a common ink chamber via a through hole assigned to ink feed. A metal wiring pattern on the rear of the glass substrate allows the conductor bumps to be arranged at any desired positions. The head does not need any flexible printed circuit board or any wiring substrate.
    • 本发明的喷墨头在每个振动板与面对其的对置电极之间产生静电力来压缩墨水。 玻璃基板形成有埋入导体的通孔。 金属布线图案和导体凸块设置在每个对电极的后部。 与其相关联的导体凸块和对电极电连接在一起。 油墨通过分配给油墨进给的通孔从玻璃基板的后部进给到公共油墨室。 玻璃基板背面的金属布线图案允许导体凸块布置在任何所需位置。 头不需要任何柔性印刷电路板或任何布线基板。
    • 36. 发明授权
    • Automotive radiator
    • 汽车散热器
    • US4809773A
    • 1989-03-07
    • US17075
    • 1987-02-20
    • Sumio SusaToshio NagaraSunao FukudaSeiichi KatoSatomi Muto
    • Sumio SusaToshio NagaraSunao FukudaSeiichi KatoSatomi Muto
    • B60K11/04F01P11/02
    • F01P11/0238
    • A radiator for an automotive engine has a filler neck having a coolant pass therein. The filler neck has both an inner tubular member and an outer tubular member so that the coolant pass is formed between the inner surface of the outer tubular member and the outer surface of the inner tubular member. The coolant pass is connected with a connecting pipe in order to introduce the coolant within the coolant pass toward the connecting pipe. The coolant introduced into the connecting pipe is, then, flows toward a reserve tank.Since all coolant flowing toward the connecting pipe is orientated its vector while passing through the coolant pass, the coolant can be introduced into the connecting pipe smoothly.
    • 用于汽车发动机的散热器具有其中具有冷却剂通道的填充口。 填料颈部具有内部管状构件和外部管状构件,使得冷却剂通道形成在外部管状构件的内表面和内部管状构件的外表面之间。 冷却剂通道与连接管连接,以将冷却剂通道内的冷却剂引入连接管。 然后,引入连接管的冷却剂朝向储备罐流动。 由于流过连接管的所有冷却剂在通过冷却剂通道时朝向其向量,所以可以平稳地将冷却剂引入连接管。
    • 38. 发明授权
    • Electronic apparatus including electronic component serving as heat-generating source
    • 电子设备,包括用作发热源的电子部件
    • US08681503B2
    • 2014-03-25
    • US13040806
    • 2011-03-04
    • Seiichi KatoYutaka Takase
    • Seiichi KatoYutaka Takase
    • H05K7/20
    • G03B17/55H04N5/2253H04N5/2254
    • An electronic apparatus having a heat-dissipating structure capable of efficiently releasing heat generated at electronic components to the outside, superior in work efficiency at the time of assembly, and capable of avoiding misalignment in the electronic components. The electronic apparatus comprising a substrate, an electronic component mounted thereon, a heat-dissipating member for releasing heat generated by the electronic component to the outside, a heat-conducting sheet having flexibility, a first portion thereof being in contact with a rear surface of the electronic component between the substrate and the electronic component, a second portion thereof being in contact with the heat-dissipating member, a hard member disposed between the first portion of the heat-conducting sheet and the substrate, a material of the hard member being harder than that of the heat-conducting sheet, and a pressing unit disposed between the hard member and the substrate and configured to press the heat-conducting sheet against the rear surface of the electronic component.
    • 一种具有散热结构的电子设备,其能够有效地将电子部件产生的热量释放到外部,组装时的工作效率优异,并且能够避免电子部件的不对准。 该电子设备包括基板,安装在其上的电子部件,用于将由电子部件产生的热量释放到外部的散热构件,具有柔性的导热片,其第一部分与 所述基板和所述电子部件之间的电子部件,其第二部分与所述散热部件接触,设置在所述导热片材的所述第一部分与所述基板之间的硬质部件,所述硬质部件的材料为 所述加热单元设置在所述硬质构件和所述基板之间,并且构造成将所述导热片压靠在所述电子部件的背面。