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    • 32. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08159023B2
    • 2012-04-17
    • US12692527
    • 2010-01-22
    • Syotaro OnoWataru SaitoNana HatanoHiroshi OhtaMiho Watanabe
    • Syotaro OnoWataru SaitoNana HatanoHiroshi OhtaMiho Watanabe
    • H01L29/00
    • H01L29/7802H01L29/0634H01L29/1095H01L29/66712H01L29/7397
    • A semiconductor device includes a semiconductor substrate of a first conductivity type, a first semiconductor region of the first conductivity type on the semiconductor substrate, and a plurality of second semiconductor regions of a second conductivity type disposed separately in the first semiconductor region. A difference between a charge quantity expressed by an integral value of a net activated doping concentration in the second semiconductor regions in the surface direction of the semiconductor substrate and a charge quantity expressed by an integral value of a net activated doping concentration in the first semiconductor region in the surface direction of the semiconductor substrate is always a positive quantity and becomes larger from the depth of the first junction plane to a depth of a second junction plane on an opposite side from the first junction plane.
    • 半导体器件包括第一导电类型的半导体衬底,半导体衬底上的第一导电类型的第一半导体区域和分开设置在第一半导体区域中的多个第二导电类型的第二半导体区域。 由半导体衬底的表面方向上的第二半导体区域中的净活化掺杂浓度的积分值表示的电荷量与由第一半导体区域中的净活化掺杂浓度的积分值表示的电荷量之间的差异 在半导体基板的表面方向总是为正量,并且从第一接合面的深度到与第一接合面相反的一侧的第二接合面的深度变得更大。
    • 35. 发明授权
    • Semiconductor device
    • 半导体器件
    • US07755138B2
    • 2010-07-13
    • US12537219
    • 2009-08-06
    • Wataru SaitoSyotaro OnoNana HatanoHiroshi OhtaMiho Watanabe
    • Wataru SaitoSyotaro OnoNana HatanoHiroshi OhtaMiho Watanabe
    • H01L29/78
    • H01L29/7813H01L29/0619H01L29/0634H01L29/0696H01L29/1095H01L29/407H01L29/41766H01L29/7806
    • A semiconductor device of the invention includes: a super junction structure of an n-type pillar layer and a p-type pillar layer; a base layer provided on the p-type pillar layer; a source layer selectively provided on a surface of the base layer; a gate insulating film provided on a portion being in contact with the base layer, a portion being in contact with the source layer and a portion being in contact with the n-type pillar layer on a portion of a junction between the n-type pillar layer and the p-type pillar layer; a control electrode provided opposed to the base layer, the source layer and the n-type pillar layer through the gate insulating film; and a source electrode electrically connected to the base layer, the source layer and the n-type layer. The source electrode is contact with the surface of the n-type pillar layer located between the control electrodes to form a Schottky junction.
    • 本发明的半导体器件包括:n型柱层和p型柱层的超结结构; 设置在p型支柱层上的基底层; 源层选择性地设置在基层的表面上; 设置在与所述基底层接触的部分上的栅极绝缘膜,与所述源极层接触的部分和在所述n型支柱的接合部的一部分上与所述n型支柱层接触的部分 层和p型支柱层; 控制电极,其通过所述栅极绝缘膜与所述基极层,所述源极层和所述n型支柱层相对设置; 以及与基极层,源极层和n型层电连接的源电极。 源电极与位于控制电极之间的n型支柱层的表面接触以形成肖特基结。
    • 36. 发明授权
    • Power semiconductor device and method of manufacturing the same
    • 功率半导体器件及其制造方法
    • US08643056B2
    • 2014-02-04
    • US13229203
    • 2011-09-09
    • Kiyoshi KimuraYasuto SumiHiroshi OhtaHiroyuki Irifune
    • Kiyoshi KimuraYasuto SumiHiroshi OhtaHiroyuki Irifune
    • H01L29/66
    • H01L29/0634H01L29/0638H01L29/0696H01L29/0878H01L29/1095H01L29/402H01L29/66712H01L29/7395H01L29/7802H01L29/7811H01L29/872
    • A power semiconductor device includes a first semiconductor layer of a first conductivity type, a first drift layer, and a second drift layer. The first drift layer includes a first epitaxial layer of the first conductivity type, a plurality of first first-conductivity-type pillar layers, and a plurality of first second-conductivity-type pillar layers. The second drift layer is formed on the first drift layer and includes a second epitaxial layer of the first conductivity type, a plurality of second second-conductivity-type pillar layers, a plurality of second first-conductivity-type pillar layers, a plurality of third second-conductivity-type pillar layers, and a plurality of third first-conductivity-type pillar layers. The plurality of second second-conductivity-type pillar layers are connected to the first second-conductivity-type pillar layers. The plurality of second first-conductivity-type pillar layers are connected to the first first-conductivity-type pillar layers. The plurality of third second-conductivity-type pillar layers are arranged on the first epitaxial layer.
    • 功率半导体器件包括第一导电类型的第一半导体层,第一漂移层和第二漂移层。 第一漂移层包括第一导电类型的第一外延层,多个第一第一导电型柱层和多个第一第二导电型柱层。 第二漂移层形成在第一漂移层上,并且包括第一导电类型的第二外延层,多个第二第二导电型柱层,多个第二第一导电型柱层,多个第二导电型柱层 第三第二导电型柱层和多个第三第一导电型柱层。 多个第二第二导电型柱层与第一第二导电型柱层连接。 多个第二第一导电型柱层与第一第一导电型柱层连接。 多个第三第二导电型柱层布置在第一外延层上。
    • 38. 发明授权
    • Power semiconductor device
    • 功率半导体器件
    • US08680606B2
    • 2014-03-25
    • US13424344
    • 2012-03-19
    • Hiroshi OhtaYasuto SumiKiyoshi KimuraJunji SuzukiHiroyuki Irifune
    • Hiroshi OhtaYasuto SumiKiyoshi KimuraJunji SuzukiHiroyuki Irifune
    • H01L29/66
    • H01L29/7802H01L29/0634H01L29/0696H01L29/0878H01L29/1095H01L29/4238H01L29/66712
    • A power semiconductor device includes a first semiconductor layer of a first conductivity type, a second semiconductor layer provided thereon, mutually separated columnar third semiconductor layers of a second conductivity type extending within the second semiconductor layer, island-like fourth semiconductor layers of the second conductivity type provided on the third semiconductor layers, fifth semiconductor layers of the first conductivity type, sixth semiconductor layers of the second conductivity type, a gate electrode, a first electrode, and a second electrode. The fifth semiconductor layers are selectively provided on the fourth semiconductor layers. The sixth semiconductor layer electrically connects two adjacent fourth semiconductor layers. The first electrode is in electrical connection with the first semiconductor. The second electrode is in electrical connection with the fourth semiconductor layers and the fifth semiconductor layers via the openings in the gate electrode.
    • 功率半导体器件包括第一导电类型的第一半导体层,设置在其上的第二半导体层,在第二半导体层内延伸的第二导电类型的相互分离的柱状第三半导体层,第二导电类型的岛状第四半导体层 提供在第三半导体层上的第一半导体层,第一导电类型的第五半导体层,第二导电类型的第六半导体层,栅电极,第一电极和第二电极。 第五半导体层选择性地设置在第四半导体层上。 第六半导体层电连接两个相邻的第四半导体层。 第一电极与第一半导体电连接。 第二电极经由栅电极中的开口与第四半导体层和第五半导体层电连接。
    • 39. 发明授权
    • Cell, assembled battery, and battery-mounted device
    • 电池,组装电池和电池安装装置
    • US09312521B2
    • 2016-04-12
    • US14241808
    • 2011-08-29
    • Hiroshi Ohta
    • Hiroshi Ohta
    • H01M2/06H01M2/30H01M2/02H01M2/22H01M2/24H01M2/26
    • H01M2/06H01M2/02H01M2/022H01M2/024H01M2/22H01M2/24H01M2/26H01M2/30H01M2/305
    • Disclosed is a cell including: a closed-end tubular case for accommodating a power generation element; a lid for the case; a terminal electrode disposed outside of the case and used for connection with another cell; an extraction electrode passing through the lid and used to extract power of the power generation element to the outside of the case; and a stepped connection electrode disposed outside of the case, the stepped connection electrode having a first flat portion to which the terminal electrode is connected and a second flat portion which is located at a level different from the level of the first flat portion and to which the extraction electrode is connected. The first and second flat portions have regions overlapping each other as viewed in a direction orthogonal to the thickness of the first and second flat portions.
    • 公开了一种电池,包括:用于容纳发电元件的封闭端管状壳体; 一箱盖; 端子电极,设置在壳体的外部并用于与另一个电池连接; 通过所述盖并用于将所述发电元件的功率提取到所述壳体的外部的引出电极; 以及设置在所述壳体的外侧的阶梯状连接电极,所述阶梯状连接电极具有与所述端子电极连接的第一平坦部,以及位于与所述第一平坦部的高度不同的水平面的第二平坦部, 引出电极连接。 当与第一和第二平坦部分的厚度正交的方向观察时,第一和第二平坦部分具有彼此重叠的区域。