专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

31. 发明授权

US06442307B1 Solder-packaged optical MEMs device and method for making the same 有权
标题翻译：焊料封装的光学MEM器件及其制造方法
公开(公告)号：US06442307B1
公开(公告)日：2002-08-27
申请号：US09705350
申请日：2000-11-03
申请人： Dustin W. Carr , Dennis S. Greywall , Sungho Jin , Flavio Pardo , Hyongsok Soh
发明人： Dustin W. Carr , Dennis S. Greywall , Sungho Jin , Flavio Pardo , Hyongsok Soh
IPC分类号： G02B626
CPC分类号： G02B6/3584 , B81B2201/042 , B81C3/002 , B81C2203/035 , G02B6/266 , G02B6/3518 , G02B6/3556 , G02B6/356 , G02B6/357 , G02B6/3594 , G02B26/0841 , G02B2006/12104
摘要： In accordance with the invention, a MEMs mirror device comprises a mirror layer including a frame structure and at least one mirror movably coupled to the frame and an actuator layer including at least one conductive path and at least one electrode for moving the mirror. The mirror layer and the actuator layer are provided with metallization pads and are bonded together in lateral alignment and with predetermined vertical gap spacing by solder bonds between the pads. The device has utility in optical cross connection, variable attenuation and power gain equalization.
摘要翻译：根据本发明，MEM镜反射镜装置包括镜面层，该镜层包括框架结构和至少一个可移动地联接到框架的镜子，以及包括至少一个导电路径和至少一个用于移动镜子的电极的致动器层。镜层和致动器层设置有金属化焊盘，并且通过焊盘之间的焊接接合以横向对准并且具有预定的垂直间隙间隔结合在一起。该器件具有光交叉连接，可变衰减和功率增益均衡功能。

32. 发明授权

US07916373B2 Tapered reinforcing struts for micromachined structures 有权
标题翻译：锥形加强支柱用于微加工结构
公开(公告)号：US07916373B2
公开(公告)日：2011-03-29
申请号：US11836540
申请日：2007-08-09
申请人： Fred P. Klemens , Flavio Pardo
发明人： Fred P. Klemens , Flavio Pardo
IPC分类号： G02B26/08 , G02B26/10 , G02B26/12
CPC分类号： B81B3/007 , B81B2201/042 , G02B26/0841
摘要： According to one embodiment, a reinforcing strut of the invention is a polyhedron attached to a plate and having at least two slanted facets, with each of the slanted facets oriented with respect to the plane of the plate at an angle different from about 90 degrees. Two slanted facets intersect to form an edge that causes the strut to have a tapered profile along the longitudinal axis of the strut.
摘要翻译：根据一个实施例，本发明的加强支柱是连接到板上并具有至少两个倾斜小平面的多面体，其中每个倾斜小面以不同于约90度的角度相对于板的平面定向。两个倾斜小平面相交以形成一个边缘，该边缘使支柱沿着支柱的纵向轴线具有锥形轮廓。

33. 发明授权

US07141450B2 Flip-chip alignment method 有权
公开(公告)号：US07141450B2
公开(公告)日：2006-11-28
申请号：US10118177
申请日：2002-04-08
申请人： Flavio Pardo
发明人： Flavio Pardo
IPC分类号： H01L21/50
CPC分类号： G01B11/27 , Y10S438/975
摘要： Flip-chips are aligned by making a fiducial in the “top” chip that is translucent/transparent to light of a wavelength shorter than infrared, and at least one corresponding fiducial in the “bottom” chip. The top-chip fiducial may be made of a transparent or translucent material, its shape may be outlined by an opaque material, or it may be formed by etching through the top chip. The bottom-chip fiducial may be reflective of the light which is transparent/translucent to the fiducial in the top chip, in which case alignment can be achieved by employing at least one video camera which is located above the top chip. Alternatively, the fiducial in the bottom chip may also be transparent/translucent to the light, in which case alignment can be achieved by having the video camera located below the bottom chip. The chips are aligned by aligning the fiducials as seen by the video camera.

34. 发明授权

US08828520B2 Micro-posts having improved uniformity and a method of manufacture thereof 有权
标题翻译：具有改进的均匀性的微柱和其制造方法
公开(公告)号：US08828520B2
公开(公告)日：2014-09-09
申请号：US12165880
申请日：2008-07-01
申请人： Cristian A. Bolle , Flavio Pardo
发明人： Cristian A. Bolle , Flavio Pardo
IPC分类号： B32B3/00 , B81C1/00
CPC分类号： H01L21/30604 , B81B2201/047 , B81B2203/0118 , B81B2203/0307 , B81B2203/0361 , B81B2203/0384 , B81B2207/056 , B81C1/00015 , B81C1/00039 , B81C1/00531 , B81C1/00539 , H01L21/3065 , Y10T428/24479
摘要： As discussed herein, there is presented an apparatus comprising micro-posts. The apparatus includes a substrate having a planar surface, a plurality of micro-posts located on the planar surface, wherein each micro-post has a base portion on the planar surface and a post portion located on a top surface of the corresponding base portion, and wherein side surfaces of the base portions intersect the planar surface at oblique angles.
摘要翻译：如本文所讨论的，提供了一种包括微柱的装置。该装置包括具有平坦表面的基底，位于平坦表面上的多个微柱，其中每个微柱在平坦表面上具有基部，并且位于相应基部的顶表面上的柱部分，并且其中所述基部的侧表面以倾斜角与所述平坦表面相交。

35. 发明授权

US08120133B2 Micro-actuator and locking switch 有权
标题翻译：微执行器和锁定开关
公开(公告)号：US08120133B2
公开(公告)日：2012-02-21
申请号：US11519142
申请日：2006-09-11
申请人： Flavio Pardo
发明人： Flavio Pardo
IPC分类号： H01L29/12
CPC分类号： H01H61/04 , B81B3/0024 , B81B2201/018 , H01H2001/0047 , H01H2061/006 , H01H2061/008
摘要： A micro-electromechanical actuator employs metal for the hot arm and silicon for at least the flexible portion of the cold arm. The cold arm made of silicon is coupled to a metal wire that moves with it and is used to carry the signal to be switched when at least two of such actuators are formed into a switch. Arrays of such switches on a first chip may be cooperatively arranged with a second chip that is flip-chip bonded to the first chip, the second chip having thereon wires routing the electrical control currents to the various hot arms for heating them as well as the signals to be switched by the various switches.
摘要翻译：微机电致动器至少将冷臂的柔性部分用于热臂和硅的金属。由硅制成的冷臂联接到与其一起移动的金属线，并且当至少两个这样的致动器形成开关时，用于承载要切换的信号。第一芯片上的这种开关的阵列可以与倒装芯片接合到第一芯片的第二芯片协同地布置，第二芯片具有将电控制电流路由到各种热臂以加热它们的电线，信号由各种开关切换。

36. 发明申请

US20110074528A1 Micromachined radio frequency circuit structures 有权
标题翻译：微加工射频电路结构
公开(公告)号：US20110074528A1
公开(公告)日：2011-03-31
申请号：US12586962
申请日：2009-09-30
申请人： Flavio Pardo , Robert F. Fullowan
发明人： Flavio Pardo , Robert F. Fullowan
IPC分类号： H01P3/12 , G03F7/20
CPC分类号： H01P11/002 , H01P3/121 , H01P3/123 , H01P7/065
摘要： A radio frequency circuit structure for transmitting radio signals includes a lower guide portion having a plurality of photocurable layers deposited on a substrate and an upper guide portion interfacing with the lower guide portion to define a guiding geometry. The upper guide portion may also include a plurality of photocurable layers deposited on a second substrate. A method for fabricating the radio frequency circuit structure includes depositing the plurality of photocurable layers on the substrate. A portion of each photocurable layer of the plurality of photocurable layers is exposed to ultraviolet light to form a latent image. The plurality of photocurable layers is developed to remove the portions not exposed to ultraviolet light to form a guide portion. The guide portion may be metalized and closed to form a guiding geometry. A lower guide portion may be closed by an upper guide portion formed in substantially the same manner as the lower guide portion.
摘要翻译：用于发送无线电信号的射频电路结构包括具有沉积在基板上的多个可光固化层的下引导部分和与下引导部分接合以限定引导几何形状的上引导部分。上引导部分还可以包括沉积在第二基底上的多个光固化层。一种用于制造射频电路结构的方法包括将多个光固化层沉积在基底上。多个光固化层的每个光固化层的一部分暴露于紫外光以形成潜像。多个光固化层被显影以除去未暴露于紫外光的部分以形成引导部分。引导部分可以被金属化和封闭以形成引导几何形状。下引导部分可以由与下引导部分基本相同的方式形成的上引导部分封闭。

37. 发明申请

US20100003460A1 Micro-Posts Having Improved Uniformity and a Method of Manufacture Thereof 有权
标题翻译：提高均匀性的微柱及其制造方法
公开(公告)号：US20100003460A1
公开(公告)日：2010-01-07
申请号：US12165880
申请日：2008-07-01
申请人： Cristian A. Bolle , Flavio Pardo
发明人： Cristian A. Bolle , Flavio Pardo
IPC分类号： B32B3/00 , B44C1/22
CPC分类号： H01L21/30604 , B81B2201/047 , B81B2203/0118 , B81B2203/0307 , B81B2203/0361 , B81B2203/0384 , B81B2207/056 , B81C1/00015 , B81C1/00039 , B81C1/00531 , B81C1/00539 , H01L21/3065 , Y10T428/24479
摘要： As discussed herein, there is presented an apparatus comprising micro-posts. The apparatus includes a substrate having a planar surface, a plurality of micro-posts located on the planar surface, wherein each micro-post has a base portion on the planar surface and a post portion located on a top surface of the corresponding base portion, and wherein side surfaces of the base portions intersect the planar surface at oblique angles.
摘要翻译：如本文所讨论的，提供了一种包括微柱的装置。该装置包括具有平坦表面的基底，位于平坦表面上的多个微柱，其中每个微柱在平坦表面上具有基部，并且位于相应基部的顶表面上的柱部分，并且其中所述基部的侧表面以倾斜角与所述平坦表面相交。

38. 发明授权

US07573723B2 Method for attaching chips in a flip-chip arrangement 有权
标题翻译：用于以倒装芯片布置附接芯片的方法
公开(公告)号：US07573723B2
公开(公告)日：2009-08-11
申请号：US10371258
申请日：2003-02-21
申请人： Victor Alexander Lifton , Victor Manuel Lubecke , Flavio Pardo
发明人： Victor Alexander Lifton , Victor Manuel Lubecke , Flavio Pardo
IPC分类号： H05K7/10 , H05K7/12
CPC分类号： H01L25/50 , H01L25/0657 , H01L2225/06517 , H01L2225/06572 , H01L2924/00013 , H01L2924/0002 , H01L2224/29099 , H01L2924/00
摘要： Polyimide is used as a spacer that also bonds together the elements that it is spacing apart. This is achieved by constructing the spacer on at least one of the wafers as is conventionally done, except that prior to performing the final curing of the polyimide precursor to form the final polyimide, the elements are aligned in a bonder and placed in contact with a pressure of 40 grams per square millimeter at a temperature slightly higher than the soft-bake temperature, as specified by the manufacturer of the polyimide precursor, for few minutes to promote tackiness. This holds the elements together, and the combined structure is then baked to fully cure the polyimide precursor into polyimide and complete the bonding.
摘要翻译：聚酰亚胺用作间隔物，其也将其间隔开的元件结合在一起。这通过如以往进行的那样在至少一个晶片上构建间隔物来实现，除了在进行聚酰亚胺前体的最终固化以形成最终聚酰亚胺之前，将元件在接合器中对准并与压力为40克/平方毫米，温度略高于软烘烤温度，如聚酰亚胺前体制造商所指定的那样，几分钟以促进粘性。这将元件保持在一起，然后烘烤组合结构以将聚酰亚胺前体完全固化成聚酰亚胺并完成粘结。

39. 发明申请

US20080278029A1 ELECTROLESS PLATING PRODUCTION OF NICKEL AND COLBALT STRUCTURES 有权
标题翻译：镍和铁素体结构的电镀生产
公开(公告)号：US20080278029A1
公开(公告)日：2008-11-13
申请号：US11747555
申请日：2007-05-11
申请人： Flavio Pardo , Maria E. Simon , Brijesh Vyas , Chen Xu
发明人： Flavio Pardo , Maria E. Simon , Brijesh Vyas , Chen Xu
IPC分类号： H02N10/00 , C25D5/00 , H01L21/00
CPC分类号： C23C18/32 , C23C18/1605 , C23C18/165 , C23C18/1651 , C23C18/1689 , C23C18/34 , C23C18/36
摘要： A method comprising forming a structural element 115 on a surface 620 of a layer 510 via an electroless plating of nickel or cobalt 130 onto the surface, the layer being rigidly fixed to an underlying substrate 110. The method also comprises etching away a portion of the layer such that a part of the structural element is able to move with respect to the substrate.
摘要翻译：一种方法包括在层510的表面620上经由镍或钴130的无电镀层在表面上形成结构元件115，所述层刚性地固定到下面的基底110上。该方法还包括蚀刻掉部分使得结构元件的一部分能够相对于基板移动。

40. 发明申请

US20080061387A1 Micro-actuator and locking switch 有权
标题翻译：微执行器和锁定开关
公开(公告)号：US20080061387A1
公开(公告)日：2008-03-13
申请号：US11519142
申请日：2006-09-11
申请人： Flavio Pardo
发明人： Flavio Pardo
IPC分类号： H01L29/82
CPC分类号： H01H61/04 , B81B3/0024 , B81B2201/018 , H01H2001/0047 , H01H2061/006 , H01H2061/008
摘要： A micro-electromechanical actuator employs metal for the hot arm and silicon for at least the flexible portion of the cold arm. The cold arm made of silicon is coupled to a metal wire that moves with it and is used to carry the signal to be switched when at least two of such actuators are formed into a switch. Arrays of such switches on a first chip may be cooperatively arranged with a second chip that is flip-chip bonded to the first chip, the second chip having thereon wires routing the electrical control currents to the various hot arms for heating them as well as the signals to be switched by the various switches.
摘要翻译：微机电致动器至少将冷臂的柔性部分用于热臂和硅的金属。由硅制成的冷臂联接到与其一起移动的金属线，并且当至少两个这样的致动器形成开关时，用于承载要切换的信号。第一芯片上的这种开关的阵列可以与倒装芯片接合到第一芯片的第二芯片协同地布置，第二芯片具有将电控制电流路由到各种热臂以加热它们的电线，信号由各种开关切换。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式