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    • 38. 发明专利
    • VACUUM TREATING EQUIPMENT
    • JPS63111938A
    • 1988-05-17
    • JP25463986
    • 1986-10-28
    • ULVAC CORP
    • HAYASHI CHIKARA
    • B01J3/02B01J3/03
    • PURPOSE:To prevent the infiltration of the harmful atmosphere into a vacuum treating chamber by providing an universal joint-type communicating mechanism capable of introducing purge gas into the vacuum treating chamber only when the vacuum treating chamber communicates with a equipment for delivering and discharging the material to be treated. CONSTITUTION:A vacuum valve 3 is closed, the adjustable joint-type communicating mechanism 13 is blocked, the inside of the vacuum treating chamber 1 is evacuated to a desired vacuum by an exhauster 2, and then the material is treated in the vacuum treating chamber 1. After the material is treated, the gas is again introduced through the universal joint-type communicating mechanism 13 to turn off the vacuum in the vacuum treating chamber 1, the vacuum valve 3 is opened, and the transport equipment 8 is lifted up and down and rotated to transport the material to be treated into the purging container 4 from the vacuum treating chamber 1. During the transportation of the material to be treated, the gas is introduced by the purge gas supply equipment 9 to prevent the infiltration of the atmosphere into the purging container 4.
    • 39. 发明专利
    • PHOTOMASK NEGATIVE HAVING PROTECTIVE FILM ON REAR FACE
    • JPS6258250A
    • 1987-03-13
    • JP19728686
    • 1986-08-25
    • ULVAC CORP
    • HAYASHI CHIKARAYANA KIMITACHI
    • G03F1/00G03F1/48G03F1/72H01L21/027
    • PURPOSE:To prevent the generation of mold during preservation in the atm. by providing a film consisting of a material which is normally used for an antireflection film of a photomask original on said original and having a mold- proof protective film consisting of silicon dioxide on said film. CONSTITUTION:The film consisting of the material commonly used for the antireflection film of the photomask original is provided on the other surface of a glass substrate of the photomask original having a light shielding layer on one surface of the glass substrate and further the mold-proof protective film consisting of silicon dioxide is provided on such film. The film directly provided on the rear face (glass substrate surface on the side opposite from the surface having the light shielding layer) of the photomask original is preferably made of the material normally used to constitute the antireflection film to be formed on the surface of the light shielding layer of the photomask original, for example, MgF2, TiO2, CeO2, ZnS, LiS, etc. The generation of mold is thus pervented and the effect of improving the optical characteristic of the mask and preventing static electricity, etc. is obtd.