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    • 33. 发明授权
    • Metal thin film for interconnection of semiconductor device
    • 用于半导体器件互连的金属薄膜
    • US07928573B2
    • 2011-04-19
    • US11465626
    • 2006-08-18
    • Takashi OnishiMasao MizunoMikako Takeda
    • Takashi OnishiMasao MizunoMikako Takeda
    • H01L23/48
    • H01L23/53233H01L21/2855H01L21/76882H01L23/5226H01L2924/0002H01L2924/00
    • A metal thin film used in fabricating a damascene interconnection of a semiconductor device which exhibits excellent high temperature fluidity during high pressure annealing, and which can fabricate an interconnection for a semiconductor device which has a low electric resistance and stable high quality is provided. Also provided is an interconnection for a semiconductor device. More specifically, a metal thin film for use as an interconnection of a semiconductor device comprising a Cu alloy containing N at a content of not less than 0.4 at % to not more than 2.0 at %; and an interconnection for a semiconductor device fabricated by forming the metal thin film on an insulator film which is formed on a semiconductor substrate and which has grooves formed therein, and filling the metal thin film in the interior of the grooves by a high pressure annealing process are provided.
    • 提供了用于制造半导体器件的镶嵌互连的金属薄膜,其在高压退火期间表现出优异的高温流动性,并且可以制造具有低电阻和稳定高质量的半导体器件的互连。 还提供了用于半导体器件的互连。 更具体地说,一种用作半导体器件的互连的金属薄膜,其包含含有不小于0.4原子%至不大于2.0原子%的含有N的Cu合金; 以及通过在形成在半导体衬底上并形成有凹槽的绝缘体膜上形成金属薄膜而制造的半导体器件的互连,并且通过高压退火工艺在槽内填充金属薄膜 被提供。
    • 35. 发明申请
    • Insoluble Electrode
    • 不溶性电极
    • US20090272646A1
    • 2009-11-05
    • US11794625
    • 2006-01-06
    • Ryuichi OtogawaKumiko OharaTakashi Onishi
    • Ryuichi OtogawaKumiko OharaTakashi Onishi
    • C25B11/03C25B11/08
    • C25D17/10C25B11/041C25B11/0484H01M8/0232
    • Provided is an economical long-life insoluble anode capable of maintaining an anode function stably for a long time even if it is used in a part where severe consumption occurs to generate a cathodizing phenomenon, and also capable of reducing the amount of an electrocatalyst used as much as possible. To realize this, on the surface of a metal substrate 10 composed of a titanium plate, a porous layer 20 including a sintered body of a spherical titanium powder is formed as a base layer. An electrocatalyst layer 30 is formed from the surface of the porous layer 20 to its inside. A part of the electrocatalyst penetrates into the porous layer 20, which provides an incomparably stronger anchor effect than the case of a blast treatment. Even when parts exposed from the porous layer 20 are peeled off and dropped off, the anode function is maintained by the electrocatalyst left in the porous layer 20.
    • 本发明提供一种经济的长寿命不溶性阳极,其能够长时间稳定地保持阳极功能,即使将其用于发生剧烈消耗的部分以产生阴极现象,并且还能够减少用作电催化剂的量 尽可能的 为了实现这一点,在由钛板构成的金属基板10的表面上形成包括球形钛粉末的烧结体的多孔层20作为基底层。 从多孔层20的表面到其内部形成电催化剂层30。 电催化剂的一部分渗透到多孔层20中,与喷砂处理的情况相比,其提供了无与伦比的锚效应。 即使从多孔层20露出的部分被剥离掉,也可以通过留在多孔层20中的电极保持阳极的功能。