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31. 发明授权

US4424241A Electroless palladium process 失效
标题翻译：无电镀钯工艺
公开(公告)号：US4424241A
公开(公告)日：1984-01-03
申请号：US424150
申请日：1982-09-27
申请人： Joseph A. Abys
发明人： Joseph A. Abys
IPC分类号： C23C18/44 , C23C3/02
CPC分类号： C23C18/44
摘要： A process is described for electrolessly plating palladium metal on a variety of surfaces including palladium surfaces. The process involves use of a special electroless plating bath which is sufficiently stable for practical commercial use and yields excellent plating results. The plating bath contains a palladium salt and organic ligand. A narrow class of reducing agents is used including formaldehyde. The bath is made acid generally by the addition of nitric acid or hydrochloric acid. The process yields plating rates of about 6 microinches per minute and plating thicknesses in excess of 1 micrometer.
摘要翻译：描述了一种在包括钯表面的各种表面上无电镀钯金属的方法。该方法涉及使用特别的化学镀浴，其对于实际的商业用途是足够稳定的并且产生优异的电镀结果。镀浴含有钯盐和有机配体。使用一类窄的还原剂，包括甲醛。通常通过加入硝酸或盐酸将浴制成酸。该方法产生约6微英寸/分钟的电镀速率和超过1微米的电镀厚度。

32. 发明授权

US09338896B2 Adhesion promotion in printed circuit boards 有权
标题翻译：印刷电路板中的粘附促进
公开(公告)号：US09338896B2
公开(公告)日：2016-05-10
申请号：US13558019
申请日：2012-07-25
申请人： Abayomi I. Owei , Joseph A. Abys , Theodore Antonellis , Eric Walch
发明人： Abayomi I. Owei , Joseph A. Abys , Theodore Antonellis , Eric Walch
IPC分类号： B05D5/10 , H05K3/38 , C23C22/52 , C23C22/63 , C23C22/73 , C23C22/78 , B05D3/10 , C23F1/18 , C23G1/20
CPC分类号： H05K3/385 , B05D3/10 , B05D5/10 , C23C22/52 , C23C22/63 , C23C22/73 , C23C22/78 , C23F1/18 , C23G1/20 , H05K3/383
摘要： Compositions and methods for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. Conditioning compositions contain a functional organic compound and preferably a transition metal ion. The functional organic compound, e.g., a purine derivative, is capable of forming a self-assembled monolayer. Adhesion promoting compositions contain an acid, preferably an inorganic acid, and an oxidant. The latter compositions may also contain a corrosion inhibitor and/or a transition metal ion selected from among Zn, Ni, Co, Cu, Ag, Au, Pd or another Pt group metal. The corrosion inhibitor may comprise a nitrogen-containing aromatic heterocyclic compound.
摘要翻译：用于在制造印刷电路板期间增强铜导电层和电介质材料之间的粘附性的组合物和方法。调理组合物含有功能性有机化合物，优选过渡金属离子。功能性有机化合物，例如嘌呤衍生物，能够形成自组装单层。粘合促进组合物含有酸，优选无机酸和氧化剂。后一种组合物还可以含有选自Zn，Ni，Co，Cu，Ag，Au，Pd或其它Pt族金属中的腐蚀抑制剂和/或过渡金属离子。腐蚀抑制剂可以包含含氮芳族杂环化合物。

33. 发明授权

US08703243B2 Anti-tarnish coatings 有权
标题翻译：防晦暗涂料
公开(公告)号：US08703243B2
公开(公告)日：2014-04-22
申请号：US13176411
申请日：2011-07-05
申请人： Joseph A. Abys , Shenliang Sun , Theodore Antonellis
发明人： Joseph A. Abys , Shenliang Sun , Theodore Antonellis
IPC分类号： B05D3/10
CPC分类号： H05K3/282 , C08K5/17 , C08K5/37 , C09D5/086 , C09D7/63 , C23C18/54 , C23F11/10 , C23F11/149 , C23F11/161 , H05K3/244 , H05K2203/122 , H05K2203/124
摘要： A method is disclosed for enhancing the corrosion resistance of a surface of a copper or copper alloy substrate. The method comprises depositing a metallic surface layer comprising a precious metal on a surface of the copper or copper alloy substrate by immersion displacement plating and exposing the electronic device to an aqueous composition comprising a first organic molecule comprising at least one functional group that interacts with and protects precious metal surfaces and a second organic molecule comprising at least one functional group that interacts with and protects copper surfaces.
摘要翻译：公开了一种提高铜或铜合金基板的表面的耐腐蚀性的方法。该方法包括通过浸渍移置电镀将包含贵金属的金属表面层沉积在铜或铜合金基底的表面上，并将电子器件暴露于水性组合物，该含水组合物包含至少一个与保护贵金属表面和包含与铜表面相互作用并保护铜表面的至少一个官能团的第二有机分子。

34. 发明申请

US20120276409A1 SELF ASSEMBLED MOLECULES ON IMMERSION SILVER COATINGS 有权
标题翻译：沉淀银涂层自组装分子
公开(公告)号：US20120276409A1
公开(公告)日：2012-11-01
申请号：US13545030
申请日：2012-07-10
申请人： Joseph A. Abys , Shenliang Sun , Theodore Antonellis
发明人： Joseph A. Abys , Shenliang Sun , Theodore Antonellis
IPC分类号： C09K15/28 , B32B15/04 , C09K15/30
CPC分类号： C23C22/02 , C23F11/08 , C23F11/10 , C23F11/149 , H05K3/244 , H05K3/282 , H05K2203/122 , H05K2203/124 , Y10T428/12556
摘要： A method for enhancing the corrosion resistance of an article comprising a silver coating deposited on a solderable copper substrate is provided. The method comprises exposing the copper substrate having the immersion-plated silver coating thereon to an anti-corrosion composition comprising: a) a multi-functional molecule comprising at least one organic functional group that interacts with and protects copper surfaces and at least one organic functional group that interacts with and protects silver surfaces; b) an alcohol; and c) a surfactant.
摘要翻译：提供了一种提高包含沉积在可焊铜衬底上的银涂层的制品的耐腐蚀性的方法。该方法包括将其上具有浸镀银色涂层的铜基底暴露于防腐蚀组合物，其包含：a）多功能分子，其包含与铜表面相互作用并保护铜表面的至少一种有机官能团和至少一种有机官能团与银表面相互作用并保护银色表面的组; b）酒精; 和c）表面活性剂。

35. 发明授权

US08226807B2 Composite coatings for whisker reduction 有权
标题翻译：用于晶须还原的复合涂层
公开(公告)号：US08226807B2
公开(公告)日：2012-07-24
申请号：US12254207
申请日：2008-10-20
申请人： Joseph A. Abys , Jingye Li , Edward J. Kudrak, Jr. , Chen Xu
发明人： Joseph A. Abys , Jingye Li , Edward J. Kudrak, Jr. , Chen Xu
IPC分类号： C25D15/00 , C25D15/02
CPC分类号： C25D15/02 , C25D3/30 , H01R13/03
摘要： There is provided a method and composition for applying a wear resistant composite coating onto a metal surface of an electrical component. The method comprises contacting the metal surface with an electrolytic plating composition comprising (a) a source of tin ions and (b) non-metallic particles, and applying an external source of electrons to the electrolytic plating composition to thereby electrolytically deposit the composite coating onto the metal surface, wherein the composite coating comprises tin metal and the non-metallic particles.
摘要翻译：提供了一种将耐磨复合涂层施加到电气部件的金属表面上的方法和组合物。该方法包括使金属表面与包含（a）锡离子源和（b）非金属颗粒的电解电镀组合物接触，并将外部电子源施加到电解镀覆组合物，从而将复合涂层电解沉积到金属表面，其中复合涂层包括锡金属和非金属颗粒。

36. 发明申请

US20090121192A1 SELF ASSEMBLED MOLECULES ON IMMERSION SILVER COATINGS 有权
标题翻译：沉淀银涂层自组装分子
公开(公告)号：US20090121192A1
公开(公告)日：2009-05-14
申请号：US12268144
申请日：2008-11-10
申请人： Joseph A. Abys , Shenliang Sun , Theodore Antonellis
发明人： Joseph A. Abys , Shenliang Sun , Theodore Antonellis
IPC分类号： C23F11/00
CPC分类号： C23C22/02 , C23F11/08 , C23F11/10 , C23F11/149 , H05K3/244 , H05K3/282 , H05K2203/122 , H05K2203/124 , Y10T428/12556
摘要： A method for enhancing the corrosion resistance of an article comprising a silver coating deposited on a solderable copper substrate is provided. The method comprises exposing the copper substrate having the immersion-plated silver coating thereon to an anti-corrosion composition comprising: a) a multi-functional molecule comprising at least one organic functional group that interacts with and protects copper surfaces and at least one organic functional group that interacts with and protects silver surfaces; b) an alcohol; and c) a surfactant.
摘要翻译：提供了一种提高包含沉积在可焊铜衬底上的银涂层的制品的耐腐蚀性的方法。该方法包括将其上具有浸镀银色涂层的铜基底暴露于防腐蚀组合物，其包含：a）多功能分子，其包含与铜表面相互作用并保护铜表面的至少一种有机官能团和至少一种有机官能团与银表面相互作用并保护银色表面的组; b）酒精; 和c）表面活性剂。

37. 发明授权

US5413692A Hydrodynamically modulated hull cell 失效
标题翻译：水动力调制船体细胞
公开(公告)号：US5413692A
公开(公告)日：1995-05-09
申请号：US40711
申请日：1993-03-31
申请人： Joseph A. Abys , Igor V. Kadija
发明人： Joseph A. Abys , Igor V. Kadija
IPC分类号： C25D21/12 , C25D5/04 , G01N27/26 , G01N27/30 , G01N27/42
CPC分类号： G01N27/42 , C25D5/04 , Y10S204/07
摘要： Electrodeposition in surface finishing as well as in electroforming can be performed in a broad range of hydrodynamic conditions. In some instances, such as barrel plating, the liquid is barely moving relative to the work piece, while in jet plating the solution moves up to several meters per second relative to the piece to be plated. In such a wide range of hydrodynamic conditions, the selection of appropriate quality control (QC) methods for each particular operation is very critical. The QC method has to resemble the manufacturing operation in terms of the hydrodynamic conditions otherwise the quality control and the functional test for the bath performance have no meaning. Available Hull Cell systems have a limited capability in varying the liquid velocity. At best a relative velocity of up to 20 or perhaps 30 cm/sec can be achieved with uneven distribution.The invention provides, in electroplating QC methods for manufacturing, better similarity and relevance between a Hull Cell QC test and a particular plating operation. The invention is a simple and yet functional instrument which can be used to identify the performance of the plating bath prior to manufacturing operation under similar hydrodynamic conditions. The instrument is a rotating cylinder with a flexible Cu test panel attached to its surface. Like a Hull Cell, a range of current density can be simultaneously applied. Unlike a Hull Cell, the rotating speed of the cylinder and hence the solution agitation is practically unlimited. The operator can identify the operating window for the particular process and apply them to the production line. The instrument has also demonstrated usefulness in developing proprietary electroplating chemistries.
摘要翻译：电沉积在表面处理以及电铸中可以在宽范围的流体动力学条件下进行。在一些情况下，例如桶形电镀，液体相对于工件几乎不移动，而在喷射电镀中，溶液相对于被镀件移动到每秒几米。在如此广泛的流体力学条件下，为每个特定操作选择适当的质量控制（QC）方法是非常关键的。 QC方法与流体动力学条件相似，不同于质量控制和浴液性能的功能试验无意义。可用的Hull Cell系统在改变液体速度方面具有有限的能力。最多可达到20或30厘米/秒的相对速度，不均匀分布。本发明在电镀QC制造方法中提供了Hull Cell QC测试和特定电镀操作之间更好的相似性和相关性。本发明是一种简单且功能齐全的仪器，可用于在类似的流体动力学条件下制造操作之前识别电镀液的性能。仪器是一个旋转圆柱体，其表面附着有一个柔性的Cu测试面板。像Hull Cell一样，可以同时应用电流密度范围。与船体单元不同，缸体的转速以及溶液搅拌实际上是无限制的。操作人员可以识别特定过程的操作窗口并将其应用于生产线。该仪器在开发专有电镀化学物质方面也表现出有用性。

38. 发明授权

US5178745A Acidic palladium strike bath 失效
标题翻译：酸性痰盂浴
公开(公告)号：US5178745A
公开(公告)日：1993-01-12
申请号：US695159
申请日：1991-05-03
申请人： Joseph A. Abys , Heinrich K. Straschil
发明人： Joseph A. Abys , Heinrich K. Straschil
IPC分类号： C25D3/50 , C25D3/52 , C25D3/56 , C25D5/10 , C25D5/40
CPC分类号： C25D3/52
摘要： This invention is an acid palladium strike bath which improves adhesion and porosity of subsequent platings of palladium or palladium alloys on metal substrates, especially those susceptible to passivation such as nickel, chromium, bronze and steel. The acid palladium strike bath which is useful for both low-speed and high speed plating operation includes a complexing agent selected from organic diamines and has a pH ranging from 2.0 to 6.0, preferably from 3.7 to 4.1. When used on easily corrodable substrates, such as copper, the palladium strike deposit protects the parts from chemical attack in the subsequent mainplating bath and prevents its contamination.

39. 发明授权

US4486274A Palladium plating prodedure 失效
标题翻译：钯电镀
公开(公告)号：US4486274A
公开(公告)日：1984-12-04
申请号：US477588
申请日：1983-03-21
申请人： Joseph A. Abys , Harvey S. Trop
发明人： Joseph A. Abys , Harvey S. Trop
IPC分类号： C25D3/52 , C25D3/56 , C25D3/58 , C25D3/64
CPC分类号： C25D3/52
摘要： A palladium electroplating procedure is disclosed which permits rapid and efficient plating and yields ductile, adherent palladium films. The electroplating bath comprises a unique palladium complex. The procedure is also useful for electroplating a variety of palladium alloys. In addition, the bath is highly stable and does not adversely affect the base material being plated.
摘要翻译：公开了一种钯电镀方法，其允许快速且有效的电镀并产生延性，附着的钯膜。电镀浴包含独特的钯络合物。该方法对于电镀各种钯合金也是有用的。此外，浴是高度稳定的，并且不会对被镀的基材产生不利影响。

40. 发明授权

US4468296A Process for electroplating palladium 失效
标题翻译：电镀钯的方法
公开(公告)号：US4468296A
公开(公告)日：1984-08-28
申请号：US448514
申请日：1982-12-10
申请人： Joseph A. Abys , Yutaka Okinaka
发明人： Joseph A. Abys , Yutaka Okinaka
IPC分类号： C25D3/52
CPC分类号： C25D3/52
摘要： The invention is a process for electroplating palladium in which at least part of the palladium in the electroplating bath is added as a palladium ammine hydroxide. Both the solid form of and solution form of palladium ammine hydroxide are useful in supplying palladium to the palladium electroplating bath. Both solution and crystals are chemically stable and can be stored for long periods of time. Further, use of the palladium ammine hydroxide compounds permit replenishment without accumulation of undesirable ions in the bath and also neutralizes hydrogen ions formed in the plating process.
摘要翻译：本发明是用于电镀钯的方法，其中将电镀浴中的至少一部分钯作为氢氧化钯加入。钯氢氧化铵的固体形式和溶液形式都可用于向钯电镀浴提供钯。溶液和晶体都是化学稳定的，可以长时间储存。此外，使用氢氧化钯钯化合物允许补充，而不会在浴中积累不期望的离子，并且还中和镀覆过程中形成的氢离子。

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