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    • 31. 发明申请
    • Optical Modulator Including Electrically Controlled Ring Resonator
    • 包括电子控制环谐振器的光学调制器
    • US20090190875A1
    • 2009-07-30
    • US12243782
    • 2008-10-01
    • Alexandre BratkovskiTheodore I. Kamins
    • Alexandre BratkovskiTheodore I. Kamins
    • G02F1/035H01L33/00
    • G02F1/025G02F2203/055G02F2203/15
    • An optical modulator and related methods are described. In accordance with one embodiment, the optical modulator comprises a waveguide for guiding an optical signal, and further comprises a ring resonator disposed in evanescent communication with the waveguide for at least one predetermined wavelength of the optical signal. The optical modulator further comprises a semiconductor pnpn junction structure that is at least partially coextensive with at least a portion of a resonant light path of the ring resonator. The optical modulator is configured such that the semiconductor pnpn junction structure receives an electrical control signal thereacross. The electrical control signal controls a free carrier population in the resonant light path where coextensive with the pnpn junction structure. A resonance condition of the ring resonator at the predetermined wavelength is thereby controlled by the electrical control signal, and the optical signal is thereby modulated according to the electrical control signal.
    • 描述了光学调制器及相关方法。 根据一个实施例,光学调制器包括用于引导光学信号的波导,并且还包括环形谐振器,该环形谐振器设置成与光波导的至少一个预定波长的与波导的渐逝通信。 光调制器还包括半导体pnpn结结构,其至少部分地与环形谐振器的谐振光路的至少一部分共同延伸。 光调制器被配置为使得半导体pnpn结结构在其上接收电控信号。 电控制信号控制共振光路中与pnpn结结构共同延伸的自由载流子。 因此,通过电气控制信号控制环形谐振器在预定波长处的谐振状态,并且由此根据电气控制信号调制光信号。
    • 35. 发明申请
    • Methods of forming through-substrate interconnects
    • 形成贯穿衬底互连的方法
    • US20080171430A1
    • 2008-07-17
    • US11654338
    • 2007-01-17
    • Theodore I. Kamins
    • Theodore I. Kamins
    • H01L21/768
    • H01L21/76898H01L24/82H01L2221/1094H01L2924/14Y10S977/89Y10S977/892H01L2924/00
    • In one embodiment of a method of forming at least one through-substrate interconnect, a semiconductor substrate having first surface and an opposing second surface is provided. At least one opening is formed in the semiconductor substrate to extend from the first surface to an intermediate depth within the semiconductor substrate. The at least one opening is partially defined by a base. At least one metal-catalyst nanoparticle is provided on the base. Conductive material is deposited within the at least one opening under conditions in which the metal-catalyst nanoparticle promotes deposition of the conductive material. Material of the semiconductor substrate may be removed from the second surface to expose a portion of the conductive material filling the at least one opening. In another embodiment, instead of using the nanoparticle, the conductive material may be selected to selectively deposit on the base partially defining the at least one opening.
    • 在形成至少一个贯穿衬底互连的方法的一个实施例中,提供了具有第一表面和相对的第二表面的半导体衬底。 在半导体衬底中形成至少一个开口,以从半导体衬底内的第一表面延伸到中间深度。 至少一个开口部分地由基座限定。 在基底上提供至少一种金属催化剂纳米颗粒。 在金属催化剂纳米颗粒促进导电材料的沉积的条件下,导电材料沉积在至少一个开口内。 可以从第二表面去除半导体衬底的材料以暴露填充至少一个开口的导电材料的一部分。 在另一个实施方案中,代替使用纳米颗粒,可以选择导电材料以选择性地沉积在部分限定至少一个开口的基部上。