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    • 35. 发明授权
    • Semiconductor device
    • 半导体器件
    • US07528423B2
    • 2009-05-05
    • US11681408
    • 2007-03-02
    • Hiroaki UenoTetsuzo UedaYasuhiro UemotoDaisuke UedaTsuyoshi TanakaManabu YanagiharaYutaka HiroseMasahiro Hikita
    • Hiroaki UenoTetsuzo UedaYasuhiro UemotoDaisuke UedaTsuyoshi TanakaManabu YanagiharaYutaka HiroseMasahiro Hikita
    • H01L31/072H01L31/109
    • H01L29/7786H01L29/2003
    • It is an object of the present invention to provide a semiconductor device, which can simultaneously achieve a normally-off mode of HFET and an improvement in Imax, and further achieve an improvement in gm and a reduction in gate leakage current. In order to keep a thin barrier layer 13 on an operation layer 12 of a substrate 11 directly under a gate electrode for mostly contributing to achieve the normally-off mode and also implement the high Imax, it is configured in such a way that a thickness of the barrier layer 13 can be increased by the semiconductor layer 17 between gate and source regions and between gate and drain regions. It is therefore possible to achieve the normally-off mode and an improvement in Imax as compared with an FET in which a thickness of the barrier layer is designed so as to be uniform. An insulating film 18 with a dielectric constant higher than that of the barrier layer is further inserted between a gate electrode 16 and the barrier layers 13, so that an improvement in gm and a reduction in gate leakage current can be achieved.
    • 本发明的一个目的是提供一种可以同时实现HFET的常闭模式和改进Imax的半导体器件,并进一步实现gm的改善和栅极漏电流的减小。 为了在栅电极正下方的基板11的操作层12上保持薄的阻挡层13,主要用于实现常关模式并且还实现了高的Imax,它被配置成使得厚度 可以通过栅极和源极区域之间以及栅极和漏极区域之间的半导体层17来增加阻挡层13。 因此,与设置阻挡层的厚度均匀的FET相比,可以实现常闭模式和Imax的改善。 介电常数高于阻挡层的绝缘膜18进一步插入在栅电极16和阻挡层13之间,从而可以实现gm的改善和栅极漏电流的减小。
    • 39. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20070210332A1
    • 2007-09-13
    • US11681408
    • 2007-03-02
    • Hiroaki UENOTetsuzo UedaYasuhiro UemotoDaisuke UedaTsuyoshi TanakaManabu YanagiharaYutaka HiroseMasahiro Hikita
    • Hiroaki UENOTetsuzo UedaYasuhiro UemotoDaisuke UedaTsuyoshi TanakaManabu YanagiharaYutaka HiroseMasahiro Hikita
    • H01L31/00
    • H01L29/7786H01L29/2003
    • It is an object of the present invention to provide a semiconductor device, which can simultaneously achieve a normally-off mode of HFET and an improvement in Imax, and further achieve an improvement in gm and a reduction in gate leakage current. In order to keep a thin barrier layer 13 on an operation layer 12 of a substrate 11 directly under a gate electrode for mostly contributing to achieve the normally-off mode and also implement the high Imax, it is configured in such a way that a thickness of the barrier layer 13 can be increased by the semiconductor layer 17 between gate and source regions and between gate and drain regions. It is therefore possible to achieve the normally-off mode and an improvement in Imax as compared with an FET in which a thickness of the barrier layer is designed so as to be uniform. An insulating film 18 with a dielectric constant higher than that of the barrier layer is further inserted between a gate electrode 16 and the barrier layers 13, so that an improvement in gm and a reduction in gate leakage current can be achieved.
    • 本发明的一个目的是提供一种半导体器件,其可以同时实现HFET的常闭模式和改进的最大值,并进一步实现gm的改善 和栅极漏电流的减小。 为了在栅电极正下方的基板11的操作层12上保持薄势垒层13,主要用于实现常关模式并且还实现高I max, 配置成使得栅极和源极区域之间以及栅极和漏极区域之间的半导体层17可以增加阻挡层13的厚度。 因此与阻挡层的厚度被设计为均匀的FET相比,可以实现常关模式和I 的改善。 介电常数高于阻挡层的绝缘膜18进一步插入在栅电极16和阻挡层13之间,从而改善gm和栅极漏电流的减小 可以实现。
    • 40. 发明申请
    • Semiconductor device
    • 半导体器件
    • US20060157729A1
    • 2006-07-20
    • US11325340
    • 2006-01-05
    • Hiroaki UenoTetsuzo UedaYasuhiro UemotoDaisuke UedaTsuyoshi TanakaManabu YanagiharaYutaka HiroseMasahiro Hikita
    • Hiroaki UenoTetsuzo UedaYasuhiro UemotoDaisuke UedaTsuyoshi TanakaManabu YanagiharaYutaka HiroseMasahiro Hikita
    • H01L33/00
    • H01L29/7786H01L29/2003
    • It is an object of the present invention to provide a semiconductor device, which can simultaneously achieve a normally-off mode of HFET and an improvement in Imax, and further achieve an improvement in gm and a reduction in gate leakage current. In order to keep a thin barrier layer 13 on an operation layer 12 of a substrate 11 directly under a gate electrode for mostly contributing to achieve the normally-off mode and also implement the high Imax, it is configured in such a way that a thickness of the barrier layer 13 can be increased by the semiconductor layer 17 between gate and source regions and between gate and drain regions. It is therefore possible to achieve the normally-off mode and an improvement in Imax as compared with an FET in which a thickness of the barrier layer is designed so as to be uniform. An insulating film 18 with a dielectric constant higher than that of the barrier layer is further inserted between a gate electrode 16 and the barrier layers 13, so that an improvement in gm and a reduction in gate leakage current can be achieved.
    • 本发明的一个目的是提供一种半导体器件,其可以同时实现HFET的常闭模式和改进的最大值,并进一步实现gm的改善 和栅极漏电流的减小。 为了在栅电极正下方的基板11的操作层12上保持薄势垒层13,主要用于实现常关模式并且还实现高I max, 配置成使得栅极和源极区域之间以及栅极和漏极区域之间的半导体层17可以增加阻挡层13的厚度。 因此与阻挡层的厚度被设计为均匀的FET相比,可以实现常关模式和I 的改善。 介电常数高于阻挡层的绝缘膜18进一步插入在栅电极16和阻挡层13之间,从而改善gm和栅泄漏电流的降低 可以实现。