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31. 发明申请

US20060245315A1 Optical pickup lens and optical pickup apparatus 有权
标题翻译：光学拾取镜头和光学拾取装置
公开(公告)号：US20060245315A1
公开(公告)日：2006-11-02
申请号：US11405436
申请日：2006-04-18
申请人： Koichiro Wakabayashi , Mitsuhiro Miyauchi , Yasuyuki Sugi , Yutaka Makino
发明人： Koichiro Wakabayashi , Mitsuhiro Miyauchi , Yasuyuki Sugi , Yutaka Makino
IPC分类号： G11B7/00
CPC分类号： G11B7/1374 , G11B7/13922 , G11B2007/0006
摘要： An optical pickup lens focuses laser beams having different wavelengths λ1, λ2 and λ3 on at least three kinds of optical discs. At least one side of the optical pickup lens has a concentric loop zonal structure for compensating wavefront aberration occurring when recording or reproducing an optical disc having a substrate thickness t1 by the laser beam having the wavelength λ1 and wavefront aberration occurring when recording or reproducing an optical disc having a substrate thickness t2 by the laser beam having the wavelength λ2. When recording or reproducing an optical disc having a substrate thickness t3 by the laser beam having the wavelength λ3, a phase difference given to the laser beam having the wavelength λ3 due to the concentric loop zonal structure is about 0.15 λ or smaller.
摘要翻译：光学拾取透镜将具有不同波长λ1，λ2和λ3的激光束聚焦在至少三种光盘上。光学拾取透镜的至少一侧具有同心环状区域结构，用于补偿当记录或再现具有波长λ1的激光束和在记录或再现光学时产生的波前像差而记录或再现具有基板厚度t1的光盘时发生的波前像差通过具有波长λ2的激光束具有基板厚度t2的光盘。当通过具有波长λ3的激光束记录或再现具有基板厚度t3的光盘时，由于同心环带状结构而赋予具有波长λ3的激光束的相位差为约0.15λ或更小。

32. 发明授权

US06462415B1 Semiconductor device as an object of thickness reduction 失效
标题翻译：半导体器件作为减薄的对象
公开(公告)号：US06462415B1
公开(公告)日：2002-10-08
申请号：US09594155
申请日：2000-06-15
申请人： Masahiko Ishiguri , Eiji Watanabe , Yutaka Makino , Koichi Murata
发明人： Masahiko Ishiguri , Eiji Watanabe , Yutaka Makino , Koichi Murata
IPC分类号： H01L2348
CPC分类号： H01L24/11 , H01L2224/05001 , H01L2224/05022 , H01L2224/05027 , H01L2224/05572 , H01L2224/05573 , H01L2224/0558 , H01L2224/13099 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/3025 , H01L2224/05655 , H01L2924/00014 , H01L2224/05166
摘要： There is provided a semiconductor device which comprises electrode pads formed on an insulating film on a semiconductor substrate, an insulating cover film formed on the insulating film to have openings that expose the electrode pads, and a masking tape having a base material layer and a resist layer coated on the base material layer, and for covering an upper surface of the cover film and inner surfaces of the openings in a situation that the resist layer is directed toward a semiconductor substrate side. Accordingly, it is possible to improve a throughput in a series of steps of grinding/polishing the semiconductor substrate and forming the bump electrodes which are required to thin the substrate of the semiconductor device.
摘要翻译：提供了一种半导体器件，其包括形成在半导体衬底上的绝缘膜上的电极焊盘，形成在绝缘膜上以具有露出电极焊盘的开口的绝缘覆盖膜，以及具有基材层和抗蚀剂层，涂覆在基材层上，并且用于在抗蚀剂层朝向半导体衬底侧的情况下覆盖覆盖膜的上表面和开口的内表面。因此，可以提高半导体衬底的研磨/抛光和形成半导体器件的衬底所需的凸块电极的一系列步骤中的通过量。

33. 发明授权

US5153707A Film material for manufacturing film carriers having outer lead portions with inner and outer metallic layers 失效
标题翻译：用于制造具有内部和外部金属层的外部引线部分的薄膜载体的薄膜材料
公开(公告)号：US5153707A
公开(公告)日：1992-10-06
申请号：US610046
申请日：1990-11-06
申请人： Yutaka Makino , Kazumi Ishimoto , Yasuo Izumi , Yuji Uesugi
发明人： Yutaka Makino , Kazumi Ishimoto , Yasuo Izumi , Yuji Uesugi
IPC分类号： H01L23/495 , H01L23/498 , H01L23/544 , H05K1/09 , H05K3/02
CPC分类号： H01L23/49572 , H01L23/4985 , H01L23/544 , H05K3/027 , H01L2223/5442 , H01L2223/54473 , H01L2224/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L24/48 , H01L2924/00014 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/1532 , H01L2924/181 , H05K1/09
摘要： A film material for manufacturing film carriers and its manufacturing method wherein the film material common in all may be applied with respect to the various semiconductor chips which are different in the electrode layout, because the inner lead portions for bump connection use which are required to be changed each time the electrode layout of the semiconductor chip changes are not pattern formed, and are kept as the inner lead forming portion with the whole remaining covered with the conductive metallic layer, and, the manufacturing apparatus for etching mask and model and so on have only to be one in type.
摘要翻译：用于制造薄膜载体的薄膜材料及其制造方法，其中可以相对于电极布局不同的各种半导体芯片，可以应用共同的薄膜材料，因为需要使用凸块连接用的内部引线部分半导体芯片的电极布局每次改变都不会形成图案，并且保持为内部引线形成部分，整个仍然被导电金属层覆盖，并且用于蚀刻掩模和模型等的制造装置具有只有一个在类型。

34. 发明授权

US5118556A Film material for film carrier manufacture and a method for manufacturing film carrier 失效
标题翻译：薄膜载体制造用薄膜材料及薄膜载体的制造方法
公开(公告)号：US5118556A
公开(公告)日：1992-06-02
申请号：US593020
申请日：1990-10-03
申请人： Yutaka Makino , Kazumi Ishimoto , Koichi Kumagai , Yasuo Izumi
发明人： Yutaka Makino , Kazumi Ishimoto , Koichi Kumagai , Yasuo Izumi
IPC分类号： H01L23/50 , H01L21/00 , H01L21/60 , H01L23/495 , H01L23/498 , H05K3/02
CPC分类号： H01L21/67132 , H01L23/49572 , H01L23/4985 , H05K3/027 , H01L2224/16225 , H01L2224/16245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01079 , H01L2924/12042 , H01L2924/1532 , H01L2924/181 , Y10S428/901 , Y10T428/24917
摘要： A film material for the manufacture of a film carrier has a lead pattern including an outer lead portion formed independent of the electrode arrangement of a semiconductor chip to be mounted on the film carrier, and an inner lead formation portion a part of which is selectively removable in accordance with the electrode arrangement of the semiconductor chip to be mounted thereon, the inner lead formation portion being contiguous and connected to respective leads of the outer lead portion. A method for manufacturing the film carrier includes the steps of forming a conductive layer of material on a film; forming the lead pattern by etching part of the layer formed on the film into an outer lead portion having a pattern independent of the electrode arrangement of each semiconductor chip to be mounted thereon, and by leaving another part of the layer as it is to form an inner lead formation portion having a pattern which is changeable according to the electrode arrangement of the semiconductor chip to be mounted thereon; and selectively removing part of the inner lead formation portion by laser processing in accordance with the electrode arrangement of the semiconductor chip to be mounted thereon.
摘要翻译：用于制造薄膜载体的薄膜材料具有引线图案，其包括独立于要安装在薄膜载体上的半导体芯片的电极布置而形成的外部引线部分，以及内部引线形成部分，其一部分可选择性地移除根据要安装在其上的半导体芯片的电极布置，内引线形成部分邻接并连接到外引线部分的相应引线。制造薄膜载体的方法包括以下步骤：在薄膜上形成材料的导电层; 通过将形成在膜上的层的一部分蚀刻到具有独立于要安装在其上的每个半导体芯片的电极布置的图案的外引线部分中，并且通过使层的另一部分原样形成来形成引线图案内引线形成部，其具有根据要安装在其上的半导体芯片的电极布置而可改变的图案; 并且根据要安装在其上的半导体芯片的电极布置，通过激光加工选择性地去除内部引线形成部分的一部分。

35. 发明申请

US20120251968A1 PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE AND APPARATUS THEREFOR 审中-公开
标题翻译：用于生产半导体器件的方法及其设备
公开(公告)号：US20120251968A1
公开(公告)日：2012-10-04
申请号：US13523007
申请日：2012-06-14
申请人： Hiroyuki MATSUI , Yutaka Makino , Yoshito Akutagawa
发明人： Hiroyuki MATSUI , Yutaka Makino , Yoshito Akutagawa
IPC分类号： F27D1/00
CPC分类号： H01L21/67098 , H01L21/67115 , H01L24/11 , H01L24/742 , H01L24/81 , H01L2224/05571 , H01L2224/05573 , H01L2224/1146 , H01L2224/1147 , H01L2224/1181 , H01L2224/11849 , H01L2224/13099 , H01L2224/131 , H01L2224/13111 , H01L2224/16 , H01L2224/81012 , H01L2924/00014 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01057 , H01L2924/01078 , H01L2924/014 , H01L2924/19043 , H01L2924/01082 , H01L2924/01047 , H01L2924/01029 , H01L2224/05599
摘要： A process for producing a semiconductor device, includes: first melting by heating only a superior portion of a bump formed on an electrode on one principle surface of a semiconductor substrate; and second melting the entire bump by also heating an inferior portion of the bump.
摘要翻译：一种制造半导体器件的方法，包括：首先通过仅加热形成在半导体衬底的一个主表面上的电极上的凸起的上部来进行熔融; 并且还通过加热凸块的下部来熔化整个凸块。

36. 发明授权

US08093148B2 Method for manufacturing semiconductor device having electrode for external connection 有权
标题翻译：具有用于外部连接的电极的半导体器件的制造方法
公开(公告)号：US08093148B2
公开(公告)日：2012-01-10
申请号：US12570459
申请日：2009-09-30
申请人： Yutaka Makino , Masamitsu Ikumo , Hiroyuki Yoda
发明人： Yutaka Makino , Masamitsu Ikumo , Hiroyuki Yoda
IPC分类号： H01L21/44
CPC分类号： H01L24/11 , H01L24/03 , H01L24/05 , H01L24/13 , H01L2224/03462 , H01L2224/0347 , H01L2224/0361 , H01L2224/03902 , H01L2224/03912 , H01L2224/03914 , H01L2224/0401 , H01L2224/05027 , H01L2224/05124 , H01L2224/05147 , H01L2224/05166 , H01L2224/05572 , H01L2224/05647 , H01L2224/05655 , H01L2224/11009 , H01L2224/11462 , H01L2224/1147 , H01L2224/1181 , H01L2224/11849 , H01L2224/13006 , H01L2224/13076 , H01L2224/13082 , H01L2224/13111 , H01L2224/13116 , H01L2224/13155 , H01L2224/13566 , H01L2224/13687 , H01L2924/00013 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/13091 , H01L2924/19041 , H01L2924/00014 , H01L2924/0105 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00 , H01L2224/05552
摘要： A method for manufacturing semiconductor device which includes forming a first metal film over an electrode pad disposed on a substrate, forming a second metal film on the first metal film, forming a first oxide film on a surface of the first metal film and a second oxide film on a surface of the second metal film by oxidizing the surfaces of the first metal film and the second metal film, removing the first oxide film, and melting the second metal film after removing the first oxide film.
摘要翻译：一种半导体器件的制造方法，其特征在于，在设置在基板上的电极焊盘上形成第一金属膜，在所述第一金属膜上形成第二金属膜，在所述第一金属膜的表面上形成第一氧化膜，通过氧化第一金属膜和第二金属膜的表面，去除第一氧化物膜，以及在除去第一氧化物膜之后熔化第二金属膜，在第二金属膜的表面上形成膜。

37. 发明申请

US20110169588A1 BRANCHING FILTER, AND WIRELESS COMMUNICATION MODULE AND WIRELESS COMMUNICATION DEVICE USING SAME 有权
标题翻译：分支过滤器，无线通信模块和无线通信设备
公开(公告)号：US20110169588A1
公开(公告)日：2011-07-14
申请号：US13121071
申请日：2009-08-31
申请人： Yutaka Makino
发明人： Yutaka Makino
IPC分类号： H03H7/46
CPC分类号： H01P1/20345 , H01P1/2135 , H03H2001/0085
摘要： Provided are a branching filter capable of well branching two electrical signals having a wide frequency band, and a wireless communication module and wireless communication device using same. The branching filter is provided with an input terminal (11), a first output terminal (12a), a second output terminal (12b), a first line conductor (14a) which is electromagnetically coupled to a resonator (13a) of an input stage so as to interconnect the input terminal (11) and the first output terminal (12a), a capacitor (15a) which interconnects the first line conductor (14a) and ground, and a second line conductor (14b) which is electromagnetically coupled to a resonator (13b) of an output stage and is connected to the second output terminal (12b), wherein a low pass filter is configured from the first line conductor (14a) and the capacitor (15a), and a band pass filter is configured from the first line conductor (14a), the second line conductor (14b), and a plurality of resonators. The branching filter eliminates the need for a phase circuit and thus is capable of well branching two signals having a wide frequency band.
摘要翻译：提供了能够良好地分支具有宽频带的两个电信号的分波器滤波器，以及使用它的无线通信模块和无线通信装置。分路滤波器设置有输入端子（11），第一输出端子（12a），第二输出端子（12b），电磁耦合到输入级的谐振器（13a）的第一线路导体（14a）以将互连第一线路导体（14a）和地线的电容器（15a）和与第一线路导体（14a）电连接的第二线路导体（14b）互连，以便互连输入端子（11）和第一输出端子谐振器（13b）并连接到第二输出端子（12b），其中低通滤波器由第一线路导体（14a）和电容器（15a）构成，带通滤波器由第一线路导体（14a），第二线路导体（14b）和多个谐振器。分路滤波器消除了对相位电路的需要，因此能够良好地分支具有宽频带的两个信号。

38. 发明授权

US07723847B2 Semiconductor device having an electrode pad, a bump provided above the electrode pad and a bump foundation layer therebetween 有权
标题翻译：具有电极焊盘，设置在电极焊盘上方的突起的半导体器件和其间的凸块基础层
公开(公告)号：US07723847B2
公开(公告)日：2010-05-25
申请号：US11703153
申请日：2007-02-07
申请人： Yutaka Makino , Tadahiro Okamoto , Takaki Kurita
发明人： Yutaka Makino , Tadahiro Okamoto , Takaki Kurita
IPC分类号： H01L23/498 , H01L21/60
CPC分类号： H01L24/12 , H01L24/03 , H01L24/05 , H01L24/11 , H01L2224/03464 , H01L2224/0401 , H01L2224/05138 , H01L2224/05624 , H01L2224/1147 , H01L2224/11849 , H01L2224/119 , H01L2224/13099 , H01L2224/131 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/05042 , H01L2924/13091 , H01L2924/19041 , H01L2924/00014 , H01L2924/00
摘要： When a nickel (Ni) layer is formed on an electrode pad made of aluminum-silicon (Al—Si) by an electroless plating method, prior to the precipitation of zinc (Zn) which becomes a catalyst, copper (Cu) is formed in the form of discontinuous spots or islands on the surface of the electrode pad, thereby providing a copper (Cu) thin layer.
摘要翻译：当通过化学镀法在由铝 - 硅（Al-Si）制成的电极焊盘上形成镍（Ni）层时，在沉淀出成为催化剂的锌（Zn）之前，形成铜（Cu）在电极焊盘的表面上形成不连续的点或岛，由此提供铜（Cu）薄层。

39. 发明申请

US20090257338A1 Optical pickup objective lens, optical pickup apparatus and optical disc apparatus 审中-公开
标题翻译：光拾取物镜，光拾取装置和光盘装置
公开(公告)号：US20090257338A1
公开(公告)日：2009-10-15
申请号：US12382741
申请日：2009-03-23
申请人： Naofumi Ueda , Yasuyuki Sugi , Yutaka Makino
发明人： Naofumi Ueda , Yasuyuki Sugi , Yutaka Makino
IPC分类号： G11B7/135 , G02B3/08
CPC分类号： G02B5/1895 , G11B7/1367 , G11B7/1374 , G11B7/13922
摘要： A pickup lens has a plurality of ring zones on at least one surface, and steps are formed respectively between the plurality of ring zones. The plurality of steps have step differences causing laser light to have a phase difference to reduce aberration occurring in the pickup lens due to a change in ambient temperature. Further, when a numerical aperture of the pickup lens is NA, a focal length is f (mm) and a working distance is WD (mm), the pickup lens is fabricated to satisfy NA=0.85, 1.1=f=1.8 and WD=0.3.
摘要翻译：拾取透镜在至少一个表面上具有多个环形区域，并且在多个环形区域之间分别形成台阶。多个步骤具有使得激光具有相位差以产生由于环境温度变化而在拾取透镜中发生的像差的阶差。此外，当拾取透镜的数值孔径为NA时，焦距为f（mm），工作距离为WD（mm），拾取透镜被制造成满足NA = 0.85,1.1 = f = 1.8，WD = 0.3。

40. 发明授权

US07586815B2 Pickup lens with phase compensator and optical pickup apparatus using the same 失效
标题翻译：带有相位补偿器的拾取镜头和使用其的光学拾取装置
公开(公告)号：US07586815B2
公开(公告)日：2009-09-08
申请号：US11252804
申请日：2005-10-19
申请人： Koichiro Wakabayashi , Keiko Hirao , Mitsuhiro Miyauchi , Yutaka Makino , Yasuyuki Sugi , Yoshikazu Mitsui
发明人： Koichiro Wakabayashi , Keiko Hirao , Mitsuhiro Miyauchi , Yutaka Makino , Yasuyuki Sugi , Yoshikazu Mitsui
IPC分类号： G11B7/00
CPC分类号： G11B7/1369 , G11B7/13925 , G11B2007/0006
摘要： A pickup lens with a phase compensator is composed of a condenser lens and a phase compensator. At least one surface of the condenser lens has a step-like annular zone structure to compensate wavefront aberration generated when recording and reproducing data on an information recording medium having a substrate thickness of t1 with a laser beam having a wavelength λ1 and wavefront aberration generated when recording and reproducing data on an information recording medium having a substrate thickness of t2 with a laser beam having a wavelength λ2. The phase compensator compensates wavefront aberration generated when recording and reproducing data on an information recording medium having a substrate thickness of t3 with a laser beam having a wavelength λ3.
摘要翻译：具有相位补偿器的拾取镜头由聚光透镜和相位补偿器组成。聚光透镜的至少一个表面具有阶梯状环形区域结构，用于补偿当在具有基板厚度t1的信息记录介质上记录和再现数据时产生的波前像差，其中激光束具有波长λ1的激光束和当在具有波长λ2的激光束的基板厚度为t2的信息记录介质上记录和再现数据。相位补偿器补偿在具有波长λ3的激光束的基板厚度为t3的信息记录介质上记录和再现数据时产生的波前像差。

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