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    • 35. 发明申请
    • SURFACE EMITTING LASER, SURFACE EMITTING LASER ARRAY, AND IMAGE FORMATION APPARATUS
    • 表面发射激光,表面发射激光阵列和图像形成装置
    • US20110002353A1
    • 2011-01-06
    • US12829253
    • 2010-07-01
    • Yoshinobu Sekiguchi
    • Yoshinobu Sekiguchi
    • H01S5/00
    • H01S5/18311B82Y20/00H01S5/0655H01S5/2009H01S5/34313
    • To provide a surface emitting laser having a structure that can suppress the oscillation of a high-order transverse mode. In the surface emitting laser, a plurality of semiconductor layers including a lower DBR, an upper DBR, an active layer interposed therebetween, and a current confinement layer for confining a current injected to the active layer are stacked on a substrate, and a barrier structure limits the migration of a majority carrier, that has passed through a current unconfining portion, in an electric field application direction; the barrier structure is provided between the current confinement layer and the active layer so that an oscillation of a high-order transverse mode is suppressed by the barrier structure promoting the diffusion of the majority carrier in an in-plane direction of the barrier structure.
    • 提供具有可以抑制高阶横模的振荡的结构的表面发射激光器。 在表面发射激光器中,将包括下DBR,上DBR,插入其间的有源层的多个半导体层和用于限制注入有源层的电流的电流限制层堆叠在基板上,并且阻挡结构 限制在电场应用方向上通过当前无约束部分的多数载波的迁移; 阻挡结构设置在电流限制层和有源层之间,从而通过促进多数载流子在屏障结构的面内方向的扩散的阻挡结构来抑制高阶横模的振荡。
    • 38. 发明申请
    • LIGHT-EMITTING ELEMENT ARRAY AND IMAGE FORMING APPARATUS
    • 发光元件阵列和图像形成装置
    • US20090057693A1
    • 2009-03-05
    • US12259420
    • 2008-10-28
    • Tetsuya TakeuchiMakoto KotoKenji YamagataYoshinobu SekiguchiTakao Yonehara
    • Tetsuya TakeuchiMakoto KotoKenji YamagataYoshinobu SekiguchiTakao Yonehara
    • H01L33/00
    • H01L27/153B41J2/45
    • A light-emitting element array can be manufactured without the separation of a metal reflection layer. The light-emitting element array includes a plurality of light-emitting element portions provided on a substrate, at least one space of the spaces between adjacent light-emitting element portions being electrically separated from each other, wherein the metal reflection layer is provided on the substrate and under the plurality of light-emitting element portions, and a resistive layer for electrical separation between the light-emitting element portions is provided between the plurality of light-emitting element portions and the metal reflection layer. The plurality of light-emitting element portions are divided into a plurality of blocks. Each of the blocks includes a plurality of light-emitting portions. The electrical separation between the light-emitting portions can be made as electrical separation between adjacent light-emitting element portions in adjacent and different blocks.
    • 可以在不分离金属反射层的情况下制造发光元件阵列。 发光元件阵列包括设置在基板上的多个发光元件部,相邻的发光元件部之间的空间的至少一个空间彼此电分离,其中金属反射层设置在 基板和多个发光元件部分之下,并且在多个发光元件部分和金属反射层之间设置用于在发光元件部分之间进行电气分离的电阻层。 多个发光元件部分被分成多个块。 每个块包括多个发光部分。 发光部之间的电气分离可以在相邻的和不同的块之间的相邻的发光元件部分之间进行电分离。
    • 39. 发明授权
    • Light-emitting element array and image forming apparatus
    • 发光元件阵列和图像形成装置
    • US07491976B2
    • 2009-02-17
    • US11782935
    • 2007-07-25
    • Tetsuya TakeuchiMakoto KotoKenji YamagataYoshinobu SekiguchiTakao Yonehara
    • Tetsuya TakeuchiMakoto KotoKenji YamagataYoshinobu SekiguchiTakao Yonehara
    • H01L33/00
    • B21D43/09B21D43/021B41J2/45B65H23/1884H01L27/153Y10T83/0481Y10T83/148Y10T83/159
    • A light-emitting element array can be manufactured without the separation of a metal reflection layer. The light-emitting element array includes a plurality of light-emitting element portions provided on a substrate, at least one space of the spaces between adjacent light-emitting element portions being electrically separated from each other, wherein the metal reflection layer is provided on the substrate and under the plurality of light-emitting element portions, and a resistive layer for electrical separation between the light-emitting element portions is provided between the plurality of light-emitting element portions and the metal reflection layer. The plurality of light-emitting element portions are divided into a plurality of blocks. Each of the blocks includes a plurality of light-emitting portions. The electrical separation between the light-emitting portions can be made as electrical separation between adjacent light-emitting element portions in adjacent and different blocks.
    • 可以在不分离金属反射层的情况下制造发光元件阵列。 发光元件阵列包括设置在基板上的多个发光元件部,相邻的发光元件部之间的空间的至少一个空间彼此电分离,其中金属反射层设置在 基板和多个发光元件部分之下,并且在多个发光元件部分和金属反射层之间设置用于在发光元件部分之间进行电气分离的电阻层。 多个发光元件部分被分成多个块。 每个块包括多个发光部分。 发光部之间的电气分离可以在相邻的和不同的块之间的相邻的发光元件部分之间进行电分离。
    • 40. 发明申请
    • SEMICONDUCTOR LIGHT EMITTING DEVICE ARRAY CHIP AND EXPOSURE LIGHT SOURCE APPARATUS
    • 半导体发光装置阵列芯片和曝光光源装置
    • US20080198592A1
    • 2008-08-21
    • US12031087
    • 2008-02-14
    • Yoshinobu Sekiguchi
    • Yoshinobu Sekiguchi
    • F21K7/00
    • B41J2/45H01L2224/48091H01L2224/48227H01L2224/49175H01L2924/00014
    • A light emitting device array chip comprises a light emitting device array having a plurality of light emitting devices arranged two-dimensionally on a substrate. The profile of the light emitting device array chip is a parallelogram with two long sides and two short sides forming an acute or obtuse angle. The light emitting device array has a plurality of blocks arranged along the long sides, and each block has a plurality of segments arranged along the long sides. In each segment, a plurality of light emitting devices are arranged in a plurality of rows along the long sides and also in a plurality of rows along the short sides, and they are connected to a common electrode. At least a single wire is provided for electrically connecting a plurality of light emitting devices selected from different segments, and an electrode pad for wire bonding is formed on the at least single wire. The electrode pad is arranged at the side of the long side of a corner of the acute angles on the array chip.
    • 发光器件阵列芯片包括具有在基板上二维布置的多个发光器件的发光器件阵列。 发光器件阵列芯片的轮廓是具有两个长边和两个短边形成锐角或钝角的平行四边形。 发光器件阵列具有沿着长边布置的多个块,并且每个块具有沿着长边布置的多个段。 在每个段中,多个发光器件沿着长边排列成多行,并且沿着短边排列成多行,并且它们连接到公共电极。 至少提供一根电线用于电连接多个选自不同段的发光器件,并且用于引线接合的电极焊盘形成在至少单根电线上。 电极垫布置在阵列芯片上的锐角的角部的长边的侧面。