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31. 发明授权

US08358288B2 Touch-sensor-provided liquid crystal display device 有权
标题翻译：触摸传感器提供的液晶显示装置
公开(公告)号：US08358288B2
公开(公告)日：2013-01-22
申请号：US12866995
申请日：2008-11-28
申请人： Takashi Kurihara , Yasuhiro Kume , Takaaki Okamoto , Tomoko Nango
发明人： Takashi Kurihara , Yasuhiro Kume , Takaaki Okamoto , Tomoko Nango
IPC分类号： G06F3/042 , G09G5/00 , G02B27/14
CPC分类号： G02F1/13338 , G02F1/133512 , G02F1/133602 , G02F2001/13312 , G06F3/0412 , G06F3/0421
摘要： The present invention relates to a touch-sensor-provided liquid crystal display device (10), the touch-sensor-provided liquid crystal display device (10) including a liquid crystal display panel (20) which includes a plurality of photo sensors (40) for detecting a touched position, and a backlight unit (90) provided on a backside of the liquid crystal display panel (20). The backlight unit (90) emits light at least part of which serves as light (L10) dedicated to sensing which is used for position detection by the plurality of photo sensors (40), and the light (L10) dedicated to sensing travels in a direction (D2) which is different from a direction (D1) toward a main viewer (V) of the liquid crystal display panel (20).
摘要翻译：本发明涉及一种提供触摸传感器的液晶显示装置（10），该触控传感器提供的液晶显示装置（10）包括一液晶显示面板（20），该液晶显示面板包括多个光传感器）和设置在液晶显示面板（20）的背面的背光单元（90）。背光单元（90）发光，其至少一部分用作用于由多个光传感器（40）进行位置检测的专用于感测的光（L10），专用于感测的光（L10）以方向（D2）与液晶显示面板（20）的主观察者（V）的方向（D1）不同。

32. 发明授权

US08232639B2 Semiconductor-device mounted board and method of manufacturing the same 有权
标题翻译：半导体装置安装板及其制造方法
公开(公告)号：US08232639B2
公开(公告)日：2012-07-31
申请号：US12952452
申请日：2010-11-23
申请人： Toshio Kobayashi , Takaharu Yamano , Takashi Kurihara
发明人： Toshio Kobayashi , Takaharu Yamano , Takashi Kurihara
IPC分类号： H01L23/48
CPC分类号： H01L23/5389 , H01L21/6835 , H01L23/49816 , H01L24/19 , H01L24/96 , H01L24/97 , H01L2224/02333 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/13022 , H01L2224/20 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/1815 , H01L2924/18162 , H01L2224/82
摘要： In a method of manufacturing a semiconductor-device mounted board, connection terminals are formed on electrode pads on a semiconductor integrated circuit respectively. A first insulating layer is formed to cover the connection terminals. A plate-like medium having a rough surface is disposed on the first insulating layer. The rough surface of the plate-like medium is pressed onto the first insulating layer so that a part of each of the connection terminals is exposed. A semiconductor device is produced by removing the plate-like medium. A second insulating layer is formed to cover side surfaces of the semiconductor device. A wiring pattern is formed to cover surfaces of the first and second insulating layers, the wiring pattern being electrically connected to the exposed connection terminal parts.
摘要翻译：在制造半导体器件安装板的方法中，分别在半导体集成电路上的电极焊盘上形成连接端子。形成第一绝缘层以覆盖连接端子。具有粗糙表面的板状介质设置在第一绝缘层上。板状介质的粗糙表面被压在第一绝缘层上，使每个连接端子的一部分露出。通过去除板状介质来制造半导体器件。形成第二绝缘层以覆盖半导体器件的侧表面。形成布线图案以覆盖第一和第二绝缘层的表面，布线图案电连接到暴露的连接端子部分。

33. 发明申请

US20120074578A1 SEMICONDUCTOR ELEMENT, SEMICONDUCTOR ELEMENT MOUNTED BOARD, AND METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT 有权
标题翻译：半导体元件，半导体元件安装板及制造半导体元件的方法
公开(公告)号：US20120074578A1
公开(公告)日：2012-03-29
申请号：US13223531
申请日：2011-09-01
申请人： Kazutaka KOBAYASHI , Tadashi Arai , Takashi Kurihara
发明人： Kazutaka KOBAYASHI , Tadashi Arai , Takashi Kurihara
IPC分类号： H01L23/48 , H01L21/28
CPC分类号： H01L24/11 , H01L24/13 , H01L24/16 , H01L2224/1147 , H01L2224/11825 , H01L2224/11831 , H01L2224/1184 , H01L2224/11906 , H01L2224/13012 , H01L2224/13014 , H01L2224/13017 , H01L2224/13019 , H01L2224/13111 , H01L2224/13147 , H01L2224/13564 , H01L2224/1357 , H01L2224/13582 , H01L2224/13583 , H01L2224/13611 , H01L2224/13639 , H01L2224/13644 , H01L2224/13655 , H01L2224/13664 , H01L2224/16225 , H01L2224/81193 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/3841 , H01L2924/00014 , H01L2924/0103 , H01L2924/01083 , H01L2924/00 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00012
摘要： A semiconductor element includes connection terminals. The connection terminals are each shaped in such a manner that the transverse cross-sectional area in a portion near the leading end thereof decreases toward the leading end. Specifically, the shape of each of the connection terminals is columnar except for the portion near the leading end, and the side surface in the portion near the leading end of the connection terminal is shaped in a tapered form. Furthermore, a metal layer for improving a solder wettability may be formed at least on the side surface shaped in the tapered form, of the connection terminal.
摘要翻译：半导体元件包括连接端子。连接端子各自的形状使得其前端附近的部分的横截面积朝向前端减小。具体而言，连接端子的形状除了前端附近的部分为柱状，连接端子的前端部附近的侧面成形为锥形。此外，可以在连接端子的至少在锥形形状的侧表面上形成用于提高焊料润湿性的金属层。

34. 发明申请

US20110279023A1 METHOD FOR MANUFACTURING DISPLAY PANEL AND DISPLAY DEVICE SUBSTRATE 审中-公开
标题翻译：制造显示面板和显示设备基板的方法
公开(公告)号：US20110279023A1
公开(公告)日：2011-11-17
申请号：US13146132
申请日：2010-01-19
申请人： Yukiya Nishioka , Takashi Kurihara , Masaru Kajitani
发明人： Yukiya Nishioka , Takashi Kurihara , Masaru Kajitani
IPC分类号： H05B33/02 , H05B33/10
CPC分类号： H01L27/3253 , H01L27/322
摘要： A method for manufacturing a display panel comprises the steps of: forming a display device substrate 60 by providing on a first substrate 20, which is equipped with a color filter 30 on which a plurality of filter elements are arranged, a plurality of organic electroluminescent elements 40, which have the same structure as each other and which is individually equipped with a connection electrode formed with a connection terminal 46a, so that each of organic electroluminescent elements is overlapped with each of the filter elements; preparing a driving substrate 50, which comprises a driving circuit for driving the plurality of and a connection portion 52a that establishes electrical connection to the driving circuit; arranging a laminating material 74X on a surface of the display device substrate or the driving substrate so as to enclose the plurality of organic electroluminescent elements when the display device substrate and the driving substrate are laminated; and laminating the display device substrate and the driving substrate so that the connection terminal and the connection portion come into contact each other.
摘要翻译：一种制造显示面板的方法包括以下步骤：通过在第一基板20上设置显示装置基板60，第一基板20配备有多个滤色器元件布置在其上的滤色器30，多个有机电致发光元件 40，它们具有彼此相同的结构，并且分别配备有形成有连接端子46a的连接电极，使得每个有机电致发光元件与每个过滤元件重叠; 制备驱动基板50，其包括用于驱动多个的驱动电路和与驱动电路建立电连接的连接部分52a; 在显示装置基板和驱动基板层叠时，在显示装置基板或驱动基板的表面上配置层叠材料74X，以封闭多个有机电致发光元件; 并且将所述显示装置基板和所述驱动基板层叠，使得所述连接端子和所述连接部彼此接触。

35. 发明申请

US20110102311A1 BACKLIGHT UNIT AND LIQUID CRYSTAL DISPLAY DEVICE 审中-公开
标题翻译：背光单元和液晶显示装置
公开(公告)号：US20110102311A1
公开(公告)日：2011-05-05
申请号：US12867593
申请日：2008-12-12
申请人： Tomoko Nango , Takashi Kurihara , Yasuhiro Kuma , Masayuki Hata , Takaaki Okamoto , Kazuhito Matsumoto , Koji Yabuta , Hideki Fujimoto , Norikazu Hohshi , Masakazu Wada , Tomohisa Matsushita
发明人： Tomoko Nango , Takashi Kurihara , Yasuhiro Kuma , Masayuki Hata , Takaaki Okamoto , Kazuhito Matsumoto , Koji Yabuta , Hideki Fujimoto , Norikazu Hohshi , Masakazu Wada , Tomohisa Matsushita
IPC分类号： G09G3/36
CPC分类号： G02F1/133606 , G02B6/0051 , G02B6/0053 , G02B6/0056 , G02F2001/133607
摘要： A backlight unit (60) includes: a light guiding plate (64); and a diffusing sheet (70), the backlight unit (60) causing light exiting through a light exit plane (80) thereof to backlight a liquid crystal display element (20), the light exiting through the light exit plane (80), having a half width of not more than 44°.
摘要翻译：背光单元（60）包括：导光板（64）; 和扩散片（70），所述背光单元（60）使通过其光出射面（80）射出的光使液晶显示元件（20）背光，从所述光出射面（80）射出的光具有半宽度不超过44°。

36. 发明授权

US07750484B2 Semiconductor device with flip-chip connection that uses gallium or indium as bonding material 有权
标题翻译：具有使用镓或铟作为接合材料的倒装芯片连接的半导体器件
公开(公告)号：US07750484B2
公开(公告)日：2010-07-06
申请号：US12146003
申请日：2008-06-25
申请人： Shigeru Mizuno , Takashi Kurihara
发明人： Shigeru Mizuno , Takashi Kurihara
IPC分类号： H01L23/498
CPC分类号： H01L24/81 , H01L2224/1134 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/73204 , H01L2224/81193 , H01L2224/81203 , H01L2224/81405 , H01L2224/81825 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/3511 , H01L2924/00 , H01L2924/00014
摘要： A method of manufacturing a semiconductor device in which a semiconductor element 10 is mounted on a substrate 20 through a flip-chip connection, includes the steps of cladding gallium as a bonding material 30 to a connecting pad 22 formed on a surface of the substrate 20, diffusing copper from the connecting pad 22 formed of the copper into the bonding material 30 through heating under vacuum, thereby bringing a state of a solid solution of the gallium and the copper, and aligning a connecting bump 12 formed on the semiconductor element 10 with the connecting pad 22 and bonding the connecting bump 12 to the connecting pad 22 through the bonding material 30 in a state of a solid solution under heating.
摘要翻译：通过倒装芯片连接将半导体元件10安装在基板20上的半导体器件的制造方法包括以下步骤：将形成在基板20的表面上的连接焊盘22作为接合材料30包覆镓通过在真空下加热将铜从铜连接焊盘22扩散到接合材料30中，从而使镓和铜的固溶状态，并使形成在半导体元件10上的连接凸块12与形成在半导体元件10上的连接凸块12与连接焊盘22，并且在加热下处于固溶状态下，通过接合材料30将连接凸块12接合到连接焊盘22。

37. 发明授权

US07749722B2 Measuring method using whole blood 有权
标题翻译：使用全血的测量方法
公开(公告)号：US07749722B2
公开(公告)日：2010-07-06
申请号：US11300867
申请日：2005-12-15
申请人： Yoshikazu Okamura , Takashi Kurihara , Hiroyuki Yokoi , Junichi Ogawa
发明人： Yoshikazu Okamura , Takashi Kurihara , Hiroyuki Yokoi , Junichi Ogawa
IPC分类号： G01N33/53 , G01N1/00
CPC分类号： G01N33/581 , G01N2333/916 , Y10T436/25125 , Y10T436/25375
摘要： A method for measuring an analyte in a whole blood sample comprising the steps of (1) bringing the whole blood sample into contact with a first substance which is carried on an insoluble carrier and specifically binds to the analyte to be measured and a second substance which is labeled with an alkaline phosphatase and specifically binds to the analyte to be measured, and (2) measuring a resulting complex on the basis of an enzyme reaction of the alkaline phosphatase, the measuring step (2) being carried out in the presence of an inhibitor of endogenous alkaline phosphatases, is disclosed.
摘要翻译：一种测定全血样品中的分析物的方法，包括以下步骤：（1）使全血样品与携带在不溶性载体上的第一物质接触并且特异性结合待测量的分析物和第二物质，用碱性磷酸酶标记并且特异性地结合待测量的分析物，和（2）基于碱性磷酸酶的酶反应测量所得的复合物，测量步骤（2）在存在下进行公开了内源性碱性磷酸酶抑制剂。

38. 发明授权

US07660095B2 Surge protector 有权
标题翻译：浪涌保护器
公开(公告)号：US07660095B2
公开(公告)日：2010-02-09
申请号：US10565422
申请日：2004-07-13
申请人： Yasuhiro Shato , Tuyoshi Ogi , Miki Adachi , Sung-Gyoo Lee , Takashi Kurihara , Toshiaki Ueda
发明人： Yasuhiro Shato , Tuyoshi Ogi , Miki Adachi , Sung-Gyoo Lee , Takashi Kurihara , Toshiaki Ueda
IPC分类号： H02H1/00
CPC分类号： H01T4/12 , Y10T29/49082 , Y10T29/49107 , Y10T29/49128
摘要： A surge protector coated with an oxide layer having an excellent chemical stability at the high temperature range and excellent adherence with respect to main discharge electrodes. The surge protector includes a column-shaped ceramic member that has a conductive film divided by a discharge gap interposed therebetween; a pair of main discharge electrode members opposite to each other on both ends of the column-shaped ceramic member to come in contact with the conductive film; and a cylindrical ceramic tube which is fitted to the pair of main discharge electrode members opposite to each other to seal both the column-shaped ceramic member and sealing gas inside thereof. Oxide films are formed on main discharge surfaces of at least the protrusive supporting portions of the pair of main discharge electrode members opposite to each other, by performing an oxidation treatment, respectively.
摘要翻译：具有在高温范围内具有优异化学稳定性的氧化物层和相对于主放电电极具有优异粘附性的电涌保护器。浪涌保护器包括柱状陶瓷构件，其具有通过插入其间的放电间隙分隔的导电膜; 一对在柱状陶瓷构件的两端彼此相对的主放电电极构件，以与导电膜接触; 和一对圆筒状的陶瓷管，该圆筒形陶瓷管与一对相对的主放电电极部件嵌合，以密封柱状陶瓷部件和内部的密封气体。通过分别进行氧化处理，分别在一对主放电电极部件的至少突出支撑部的主放电面上形成氧化膜。

39. 发明授权

US07455901B2 Fiber-reinforced composite material, method for manufacturing the same and applications thereof 有权
标题翻译：纤维增强复合材料及其制造方法及其应用
公开(公告)号：US07455901B2
公开(公告)日：2008-11-25
申请号：US11333302
申请日：2006-01-18
申请人： Hiroyuki Yano , Junji Sugiyama , Masaya Nogi , Shin-ichiro Iwamoto , Keishin Handa , Akira Nagai , Takao Miwa , Yoshitaka Takezawa , Toshiyuki Miyadera , Takashi Kurihara , Tohru Matsuura , Nobutatsu Koshoubu , Tohru Maruno
发明人： Hiroyuki Yano , Junji Sugiyama , Masaya Nogi , Shin-ichiro Iwamoto , Keishin Handa , Akira Nagai , Takao Miwa , Yoshitaka Takezawa , Toshiyuki Miyadera , Takashi Kurihara , Tohru Matsuura , Nobutatsu Koshoubu , Tohru Maruno
IPC分类号： D04H1/00
CPC分类号： G02B6/122 , B82Y30/00 , C08J5/005 , C08J5/04 , C08L101/00 , G02B6/10 , G02B6/4214 , G02B2006/12104 , G02B2006/12107 , H05K1/0366 , H05K2201/0108 , H05K2201/0251 , Y10T428/249924 , Y10T428/249928 , Y10T428/24994 , Y10T428/2965 , Y10T428/31518 , Y10T428/31525 , C08L2666/26
摘要： There is provided a fiber-reinforced composite material containing fibers having an average fiber diameter of 4 to 200 nm and a matrix material, the composite material having a visible light transmittance of 60% or more at a wavelength of 400 to 700 nm, which is a conversion value based on a thickness of 50 μm. A fiber-reinforced composite material composed of a matrix material and a fiber aggregate impregnated therewith is provided, in which when a segment length of a bright region corresponding to a pore region of the fiber aggregate is represented by L, which is obtained by statistical analysis of a unidirectional run-length image formed from a binary image obtained by binarization of a scanning electron microscopic image of the fiber aggregate, the total length of segments that satisfy L≧4.5 μm is 30% or less of the total analyzed length. A transparent multilayered sheet, a circuit board, and an optical waveguide are provided which use a transparent substrate formed from this fiber-reinforced composite material.
摘要翻译：提供了含有平均纤维直径为4〜200nm的纤维和基体材料的纤维增强复合材料，复合材料在波长400〜700nm具有60％以上的可见光透射率，这是基于50um的厚度的转换值。提供了由基质材料和浸渍纤维集合体的纤维增强复合材料，其中当通过统计分析获得对应于纤维聚集体的孔区域的亮区域的段长度由L表示时由通过二次化纤维聚集体的扫描电子显微镜图像获得的二值图像形成的单向游程长度图像，满足L> =4.5μm的片段的总长度为总分析长度的30％以下。提供一种使用由该纤维增强复合材料形成的透明基板的透明多层片材，电路板和光波导。

40. 发明授权

US07367000B2 Method for simulating power voltage distribution of semiconductor integrated circuit and simulation program 有权
标题翻译：模拟半导体集成电路电源电压分配的方法和仿真程序
公开(公告)号：US07367000B2
公开(公告)日：2008-04-29
申请号：US11305184
申请日：2005-12-19
申请人： Takashi Kurihara , Kenji Wada , Masahiro Suzuki , Eiji Fujine
发明人： Takashi Kurihara , Kenji Wada , Masahiro Suzuki , Eiji Fujine
IPC分类号： G06F17/50
CPC分类号： G06F17/5036
摘要： The invention has an object to provide a method for simulating power voltage distribution of a semiconductor integrated circuit, by which it is possible to attempt to shorten the time required for preparing a power unit model and it is possible to carry out a highly accurate simulation with uneven distribution of a floor plan taken into account. In Step S1, design information (Core size CS, core ring width CW, block shape BS, macro shape MS, block current BI, macro current MI, etc.) is inputted into a simulator. In Step S2, information regarding a floor plan (Block position BP, macro position MP, power I/O position IOP) is inputted into the simulator by a designer. In Step S3, the power unit management table is initialized, and resistance modeling and current source modeling are also carried out. In Step S5 (FIG. 1), the static IR drop is calculated based on the power unit management table CT obtained in Step S4.
摘要翻译：本发明的目的是提供一种用于模拟半导体集成电路的电源电压分布的方法，通过该方法可以尝试缩短制备功率单元模型所需的时间，并且可以执行高精度的仿真考虑到平面布置的不均匀分布。在步骤S1中，向模拟器输入设计信息（核心尺寸CS，核心环宽度CW，块形状BS，宏形状MS，块电流BI，宏观电流MI等）。在步骤S2中，由设计者将关于平面图（块位置BP，宏位置MP，电力I / O位置IOP）的信息输入到模拟器。在步骤S3中，对功率单元管理表进行初始化，并进行电阻建模和电流源建模。在步骤S5（图1）中，基于在步骤S 4中获得的功率单元管理表CT计算静态IR下降。

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