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31. 发明授权

US07785986B2 Method of manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US07785986B2
公开(公告)日：2010-08-31
申请号：US12400892
申请日：2009-03-10
申请人： Yoshihisa Matsubara , Hiromichi Suzuki , Wahei Kitamura , Kosho Akiyama , Seiji Kato
发明人： Yoshihisa Matsubara , Hiromichi Suzuki , Wahei Kitamura , Kosho Akiyama , Seiji Kato
IPC分类号： H01L21/30 , H01L23/34
CPC分类号： H01L21/67333 , H01L2924/0002 , H01L2924/00
摘要： To prevent semiconductor chips from adhering to the trays during transport, a method is employed which transports semiconductor chips in the following state. When trays provided with a plurality of accommodating portions having a recessed cross section for accommodating semiconductor chips on a main surface thereof are stacked in a plurality of stages, the semiconductor chips are accommodated in spaces defined by the accommodating portions formed over the main surface of the lower-stage tray and corresponding accommodating portions formed over the back surface of the upper-stage tray. Here, on bottom surfaces of the accommodating portions formed over the back surface of the upper-stage tray, isolated projections having a height which prevents the projections from coming into contact with the semiconductor chips are arranged in a scattered manner. In this way, it is possible to prevent the semiconductor chips from adhering to the back surface of the upper-stage tray.
摘要翻译：为了防止半导体芯片在运输期间粘附到托盘，采用以下状态传输半导体芯片的方法。当具有多个具有用于在其主表面上容纳半导体芯片的凹入截面的容纳部分的托盘被堆叠成多级时，半导体芯片被容纳在形成在主表面上的容纳部分所形成的空间中下级托盘和形成在上级托盘的后表面上的相应的容纳部分。这里，在形成在上层托盘的后表面上的容纳部分的底表面上，以散射方式布置具有防止突起与半导体芯片接触的高度的隔离突起。以这种方式，可以防止半导体芯片粘附到上层托盘的后表面。

32. 发明授权

US07701401B2 Antenna device having no less than two antenna elements 失效
标题翻译：具有不少于两个天线元件的天线装置
公开(公告)号：US07701401B2
公开(公告)日：2010-04-20
申请号：US11975332
申请日：2007-10-18
申请人： Hiromichi Suzuki , Satoshi Mizoguchi , Isao Ohba
发明人： Hiromichi Suzuki , Satoshi Mizoguchi , Isao Ohba
IPC分类号： H01Q1/24
CPC分类号： H01Q7/00 , H01Q1/242 , H01Q5/371 , H01Q5/40 , H01Q9/42 , H01Q21/28
摘要： An antenna device provided in a radio apparatus having a printed circuit board includes a first antenna element and a second antenna element. The first antenna element is configured to be fed and grounded at a first feed portion and at a first short-circuit portion both on the printed circuit board, respectively. The second antenna element is configured to be fed and grounded at a second feed portion and at a second short-circuit portion both on the printed circuit board, respectively. The second feed portion is located farther from the first feed portion than from the first short-circuit portion, farther than the first short-circuit portion is from the first feed portion, farther from the first short-circuit portion than from the second short-circuit portion, and farther than the second short-circuit portion is from the first short-circuit portion.
摘要翻译：设置在具有印刷电路板的无线电设备中的天线装置包括第一天线元件和第二天线元件。第一天线元件被配置为分别在印刷电路板上的第一馈电部分和第一短路部分馈电和接地。第二天线元件被配置为分别在印刷电路板上的第二馈电部分和第二短路部分馈电和接地。第二馈电部分比第一短路部分远离第一短路部分，远离第一短路部分比第一短路部分远离第一短路部分远离第一短路部分，电路部分，并且比第二短路部分更远离第一短路部分。

33. 发明授权

US07554497B2 Antenna device and wireless device 失效
标题翻译：天线设备和无线设备
公开(公告)号：US07554497B2
公开(公告)日：2009-06-30
申请号：US11900219
申请日：2007-09-11
申请人： Isao Ohba , Hiromichi Suzuki
发明人： Isao Ohba , Hiromichi Suzuki
IPC分类号： H01Q1/24 , H01Q1/38
CPC分类号： H01Q1/243 , H01Q21/28 , H01Q21/29 , H04B7/0814
摘要： According to an aspect of the invention, there is provided an antenna device housed within a wireless device, including: a first case and a second case at least partly overlapping with each other, the first and second cases electrically connected with each other and slidable to open and close the antenna device; a first board housed within the first case; a second board housed within the second case; a first unbalanced antenna element connected to a first feeding point located in a vicinity of a first edge departing from the second case among edges of the first board when the first case and the second case are slid in a direction to open the wireless device; and a second unbalanced antenna element being connected to a second feeding point located in a vicinity of a second edge substantially perpendicular to the first edge among edges of the second board.
摘要翻译：根据本发明的一个方面，提供了一种容纳在无线设备内的天线装置，包括：第一壳体和至少部分地彼此重叠的第二壳体，第一壳体和第二壳体彼此电连接并可滑动到打开和关闭天线设备; 在第一种情况下容纳的第一板; 第二个板容纳在第二个壳体内; 第一不平衡天线元件，当第一壳体和第二壳体沿打开无线装置的方向滑动时，连接到位于第一边缘附近的第一边缘附近的第一不平衡天线元件; 以及第二不平衡天线元件，其连接到位于所述第二板的边缘之间的与所述第一边缘基本垂直的第二边缘附近的第二馈电点。

34. 发明授权

US07504315B2 Method of transporting semiconductor device and method of manufacturing semiconductor device 有权
标题翻译：输送半导体器件的方法及半导体器件的制造方法
公开(公告)号：US07504315B2
公开(公告)日：2009-03-17
申请号：US11007185
申请日：2004-12-09
申请人： Yoshihisa Matsubara , Hiromichi Suzuki , Wahei Kitamura , Kosho Akiyama , Seiji Kato
发明人： Yoshihisa Matsubara , Hiromichi Suzuki , Wahei Kitamura , Kosho Akiyama , Seiji Kato
IPC分类号： H01L21/30
CPC分类号： H01L21/67333 , H01L2924/0002 , H01L2924/00
摘要： To prevent semiconductor chips from adhering to the trays during transport, a method is employed which transports semiconductor chips in the following state. When trays provided with a plurality of accommodating portions having a recessed cross section for accommodating semiconductor chips on a main surface thereof are stacked in a plurality of stages, the semiconductor chips are accommodated in spaces defined by the accommodating portions formed over the main surface of the lower-stage tray and corresponding accommodating portions formed over the back surface of the upper-stage tray. Here, on bottom surfaces of the accommodating portions formed over the back surface of the upper-stage tray, isolated projections having a height which prevents the projections from coming into contact with the semiconductor chips are arranged in a scattered manner. In this way, it is possible to prevent the semiconductor chips from adhering to the back surface of the upper-stage tray.
摘要翻译：为了防止半导体芯片在运输期间粘附到托盘，采用以下状态传输半导体芯片的方法。当具有多个具有用于在其主表面上容纳半导体芯片的凹入截面的容纳部分的托盘被堆叠成多级时，半导体芯片被容纳在形成在主表面上的容纳部分所形成的空间中下级托盘和形成在上级托盘的后表面上的相应的容纳部分。这里，在形成在上层托盘的后表面上的容纳部分的底表面上，以散射方式布置具有防止突起与半导体芯片接触的高度的隔离突起。以这种方式，可以防止半导体芯片粘附到上层托盘的后表面。

35. 发明申请

US20080211721A1 Antenna device and wireless device 失效
标题翻译：天线设备和无线设备
公开(公告)号：US20080211721A1
公开(公告)日：2008-09-04
申请号：US11900219
申请日：2007-09-11
申请人： Isao Ohba , Hiromichi Suzuki
发明人： Isao Ohba , Hiromichi Suzuki
IPC分类号： H01Q1/24
CPC分类号： H01Q1/243 , H01Q21/28 , H01Q21/29 , H04B7/0814
摘要： According to an aspect of the invention, there is provided an antenna device housed within a wireless device, including: a first case and a second case at least partly overlapping with each other, the first and second cases electrically connected with each other and slidable to open and close the antenna device; a first board housed within the first case; a second board housed within the second case; a first unbalanced antenna element connected to a first feeding point located in a vicinity of a first edge departing from the second case among edges of the first board when the first case and the second case are slid in a direction to open the wireless device; and a second unbalanced antenna element being connected to a second feeding point located in a vicinity of a second edge substantially perpendicular to the first edge among edges of the second board.
摘要翻译：根据本发明的一个方面，提供了一种容纳在无线设备内的天线装置，包括：第一壳体和至少部分地彼此重叠的第二壳体，第一壳体和第二壳体彼此电连接并可滑动到打开和关闭天线设备; 在第一种情况下容纳的第一板; 第二个板容纳在第二个壳体内; 当所述第一壳体和所述第二壳体沿着打开所述无线装置的方向滑动时，所述第一不平衡天线元件连接到位于所述第一侧边缘附近的第一边缘附近的第一馈电点; 以及第二不平衡天线元件，其连接到位于所述第二板的边缘之间的与所述第一边缘基本垂直的第二边缘附近的第二馈电点。

36. 发明授权

US07413930B2 Lead frame and method of manufacturing the lead frame 失效
标题翻译：引线框架和引线框架的制造方法
公开(公告)号：US07413930B2
公开(公告)日：2008-08-19
申请号：US10569577
申请日：2003-08-29
申请人： Fujio Ito , Hiromichi Suzuki , Toshio Sasaki
发明人： Fujio Ito , Hiromichi Suzuki , Toshio Sasaki
IPC分类号： H01L21/82
CPC分类号： H01L23/49541 , H01L21/4842 , H01L23/49558 , H01L2924/0002 , H01L2924/00
摘要： A plurality of inner leads, a plurality of outer leads formed in one with each of the inner lead, a bar lead of the square ring shape arranged inside a plurality of inner leads, a corner part lead which has been arranged between the inner leads of the end portion of the inner lead groups which adjoin among four inner lead groups corresponding to each side of the bar lead, and was connected with the bar lead, and a tape member joined to the tip part of each inner lead, a bar lead, and a corner part lead are included. Since the corner part lead is formed as an object for reinforcement of a frame body between adjoining inner lead groups, the rigidity of the lead frame can be increased.
摘要翻译：多个内部引线，多个外部引线，每个外部引线与内部引线中的每一个形成一个，方形环形状的引脚布置在多个内部引线内;角部引线，其设置在内部引线之间所述内引线组的与所述棒引线的每一侧相对应的四个内引线组中相邻的所述内引线组的端部与所述引线连接，以及与所述内引线的前端接合的带部件，并包括角落部分铅。由于角部引线形成为在相邻的内引线组之间加强框架体的对象，所以可以提高引线框架的刚性。

37. 发明授权

US07397114B2 Semiconductor integrated circuit device and method of manufacturing the same 有权
标题翻译：半导体集成电路器件及其制造方法
公开(公告)号：US07397114B2
公开(公告)日：2008-07-08
申请号：US11362732
申请日：2006-02-28
申请人： Yoshinori Miyaki , Hiromichi Suzuki , Tsuyoshi Kaneda
发明人： Yoshinori Miyaki , Hiromichi Suzuki , Tsuyoshi Kaneda
IPC分类号： H01L23/495
CPC分类号： H01L24/32 , H01L21/565 , H01L23/3114 , H01L23/49582 , H01L24/27 , H01L24/29 , H01L24/743 , H01L24/83 , H01L2224/29 , H01L2224/29007 , H01L2224/29101 , H01L2224/29111 , H01L2224/2929 , H01L2224/29339 , H01L2224/29393 , H01L2224/32014 , H01L2224/32245 , H01L2224/45 , H01L2224/45015 , H01L2224/45144 , H01L2224/48 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48455 , H01L2224/48465 , H01L2224/48599 , H01L2224/48664 , H01L2224/49 , H01L2224/49171 , H01L2224/73265 , H01L2224/743 , H01L2224/78 , H01L2224/78303 , H01L2224/83464 , H01L2224/83801 , H01L2224/85 , H01L2224/85181 , H01L2224/85464 , H01L2224/92 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/078 , H01L2924/10162 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2924/20752 , H01L2924/20753 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/01026 , H01L2924/3512 , H01L2924/00012
摘要： A semiconductor integrated circuit device is provided which includes a wire having a diameter equal to or less than 30 μm, and a connected member molded by a resin. The connected member includes a metal layer including a palladium layer provided at a portion to which said wire is connected. A solder containing Pb as a main composition metal is provided at a portion outside a portion molded by the resin.
摘要翻译：提供一种半导体集成电路器件，其包括直径等于或小于30μm的线，以及由树脂模制的连接部件。连接构件包括金属层，该金属层包括设置在所述导线所连接的部分处的钯层。在由树脂成型的部分的外侧设置包含Pb作为主要成分金属的焊料。

38. 发明授权

US07374973B2 Manufacturing method of semiconductor device and manufacturing method of lead frame 失效
标题翻译：半导体器件的制造方法和引线框架的制造方法
公开(公告)号：US07374973B2
公开(公告)日：2008-05-20
申请号：US11181929
申请日：2005-07-15
申请人： Fujio Ito , Hiromichi Suzuki , Akihiko Kameoka , Junpei Kusukawa , Yoshitaka Takezawa
发明人： Fujio Ito , Hiromichi Suzuki , Akihiko Kameoka , Junpei Kusukawa , Yoshitaka Takezawa
IPC分类号： H01L21/00
CPC分类号： H01L21/56 , H01L21/4821 , H01L23/3107 , H01L23/49558 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15747 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： Improvement in the reliability of a semiconductor device is aimed at. By heating a lead frame, after preparing a lead frame with a tape, until a resin molding is performed, at the temperature 160 to 300° C. (preferably 180 to 300° C.) for a total of more than 2 minutes in the atmosphere which has oxygen, crosslinkage density becoming high in resin of adhesives, a low molecular compound volatilizes and jumps out outside, therefore as a result, since a low molecular compound does not remain in resin of adhesives, the generation of copper migration can be prevented.
摘要翻译：旨在提高半导体器件的可靠性。通过加热引线框架，在用带子制备引线框架之后，直到进行树脂模制，在160-300℃（优选180-300℃）的温度下，总共超过2分钟具有氧的气氛，粘合剂树脂中的交联密度变高，低分子化合物挥发并跳出外部，因此，由于低分子化合物不会残留在粘合剂的树脂中，所以可以防止铜迁移的产生。

39. 发明申请

US20080087996A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：US20080087996A1
公开(公告)日：2008-04-17
申请号：US11858880
申请日：2007-09-20
申请人： Yoshinori MIYAKI , Hiromichi Suzuki
发明人： Yoshinori MIYAKI , Hiromichi Suzuki
IPC分类号： H01L23/495 , H01L21/00
CPC分类号： H01L23/3107 , H01L21/4821 , H01L23/49503 , H01L23/49541 , H01L23/49582 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/29007 , H01L2224/29111 , H01L2224/2919 , H01L2224/32014 , H01L2224/32245 , H01L2224/43 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48664 , H01L2224/73265 , H01L2224/78301 , H01L2224/83192 , H01L2224/838 , H01L2224/85181 , H01L2224/85464 , H01L2224/92 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/01026 , H01L2924/00012 , H01L2924/3512
摘要： An object of the invention is to improve a reliability of a semiconductor device. The semiconductor device comprises a semiconductor chip, a tab having an outside dimension smaller than that of the semiconductor chip, a plurality of wires, a plurality of inner leads which extend around the semiconductor chip and have, on a wire bonding portion to which a wire is bonded, a Pd plated layer, a resin sealant, and a plurality of outer leads having a Pd plated layer formed on the surface thereof. The inner leads, outer leads and tab are each made of a Cu alloy. Inside the resin sealant, a strike plated layer having on the surface thereof a pure Cu layer has been formed to expose it from a region of each of the inner leads other than the wire bonding portion. The strike plated layer is therefore bonded to the resin sealant, making it possible to improve the adhesion between the resin and the lead, thereby improving the reliability of the semiconductor device.
摘要翻译：本发明的目的是提高半导体器件的可靠性。半导体器件包括半导体芯片，具有比半导体芯片小的外形尺寸的突片，多个引线，围绕半导体芯片延伸的多个内引线，并且在引线接合部分上具有线 Pd镀层，树脂密封剂和在其表面上形成有Pd镀层的多个外引线。内部引线，外部引线和突片均由Cu合金制成。在树脂密封剂的内部，形成有表面具有纯Cu层的冲击镀层，以从引线接合部以外的各个内部引线的区域露出。因此，冲击镀层结合到树脂密封剂上，可以提高树脂和引线之间的粘附性，从而提高半导体器件的可靠性。

40. 发明申请

US20080081657A1 Portable wireless apparatus 失效
标题翻译：便携式无线设备
公开(公告)号：US20080081657A1
公开(公告)日：2008-04-03
申请号：US11657756
申请日：2007-01-25
申请人： Hiromichi Suzuki , Hiroyuki Hotta , Takashi Amano
发明人： Hiromichi Suzuki , Hiroyuki Hotta , Takashi Amano
IPC分类号： H04M1/00 , H01Q1/24
CPC分类号： H01Q1/243 , H01Q9/42 , H01Q21/28
摘要： According to an aspect of the invention, a portable wireless apparatus comprises a first housing and a second housing. The first housing comprises a first board having a first feeding portion; and a first antenna element connected to the first feeding portion and provided on a side of a first surface of the first board. The second housing foldably connected to the first housing comprises a second board having a surface opposite to the first surface of the first board when the second hosing is unfolded with respect to the first housing. The second board comprises a second feeding portion. A second antenna element is connected to the second feeding portion and provided on a side of the surface of the second board.
摘要翻译：根据本发明的一个方面，便携式无线装置包括第一壳体和第二壳体。第一壳体包括具有第一馈送部分的第一板; 以及连接到所述第一馈送部分并设置在所述第一板的第一表面的一侧上的第一天线元件。可折叠地连接到第一壳体的第二壳体包括具有与第一板的第一表面相对的表面的第二板，当第二焊接相对于第一壳体展开时。第二板包括第二进料部分。第二天线元件连接到第二馈电部分并且设置在第二板的表面的一侧。

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