专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

31. 发明授权

US07296727B2 Apparatus and method for mounting electronic components 失效
标题翻译：用于安装电子部件的装置和方法
公开(公告)号：US07296727B2
公开(公告)日：2007-11-20
申请号：US10324001
申请日：2002-12-20
申请人： Shunji Onobori , Shuichi Hirata , Masakazu Yamano , Kazuya Yamamoto , Satoshi Shida , Takaharu Mae , Makoto Akita , Shozo Minamitani
发明人： Shunji Onobori , Shuichi Hirata , Masakazu Yamano , Kazuya Yamamoto , Satoshi Shida , Takaharu Mae , Makoto Akita , Shozo Minamitani
IPC分类号： B23K31/02 , B23K37/04
CPC分类号： H01L24/81 , B23K1/0016 , B23K2101/40 , H01L21/563 , H01L24/75 , H01L2224/05571 , H01L2224/05573 , H01L2224/13144 , H01L2224/16 , H01L2224/73204 , H01L2224/75 , H01L2224/751 , H01L2224/7515 , H01L2224/75301 , H01L2224/755 , H01L2224/75502 , H01L2224/758 , H01L2224/7598 , H01L2224/81801 , H01L2224/83192 , H01L2224/92125 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01043 , H01L2924/01052 , H01L2924/01065 , H01L2924/01073 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H05K3/3436 , H05K3/3494 , H05K2201/10151 , H05K2203/0195 , H05K2203/082 , Y02P70/613 , H01L2224/05599
摘要： After detection of contact between respective solder bumps of an electronic component, sucked and held by a suction nozzle of a head tool, and respective solder portions of a circuit board, the solder bumps and the solder portions are melted by heating. Releasing of the electronic component from suction and holding by the suction nozzle of the head tool is performed, not at a time during solder melting, but at a time after the solder is melted, cooled and solidified. Thus, an electronic component mounting method and apparatus capable of mounting high-end electronic components having narrow-pitched bumps are provided.
摘要翻译：在检测到由头工具的吸嘴吸引并保持的电子部件的各个焊料凸块之间的接触以及电路板的各个焊接部分之后，焊料凸块和焊料部分通过加热而熔化。执行电子部件从头部工具的吸嘴吸引和保持的释放，而不是在焊料熔化期间，而是在焊料熔化，冷却和固化之后的时间。因此，提供了能够安装具有窄凸起的高端电子部件的电子部件安装方法和装置。

32. 发明授权

US07290331B2 Component mounting apparatus and component mounting method 有权
标题翻译：组件安装装置和部件安装方法
公开(公告)号：US07290331B2
公开(公告)日：2007-11-06
申请号：US11426719
申请日：2006-06-27
申请人： Shunji Onobori , Shozo Minamitani , Shuichi Hirata , Tomoaki Nakanishi
发明人： Shunji Onobori , Shozo Minamitani , Shuichi Hirata , Tomoaki Nakanishi
IPC分类号： H05K3/30
CPC分类号： H05K13/0465 , H01L2224/75 , H01L2224/75745 , H01L2224/758 , H01L2924/01087 , H01L2924/07811 , Y10T29/49117 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/53174 , H01L2924/00
摘要： In a component mounting apparatus in which integrated components having a chip-on-chip structure are formed by mounting upper chips on lower chips. The lower chips picked up from a component carrying-in unit by a component carrying-in head are placed on a mounting stage, and the upper chips picked up from a second component tray by a component transporting head are vertically flipped around a rotation axis and transferred to a mounting head at a component transferring position, then the upper chips held by the mounting head are descended and mounted by solder bonding on the lower chips held by the mounting stage at a component mounting position. Integrated components formed by mounting are carried out of the mounting stage by the component transporting head and stored in a first component tray in a component storing unit.
摘要翻译：在具有片上芯片结构的集成部件通过将上部芯片安装在下部芯片上而形成的部件安装装置中。通过部件承载头从部件承载单元拾取的下部芯片被放置在安装台上，并且通过部件传送头从第二部件托盘拾取的上部芯片围绕旋转轴线垂直翻转，在组件传送位置传送到安装头，则由安装头保持的上部芯片通过焊接粘合下降并通过安装台保持的下部芯片在部件安装位置安装。通过安装形成的集成部件通过部件传送头从安装台进行，并被存储在部件存储单元中的第一部件托盘中。

33. 发明申请

US20050098610A1 Apparatus and method for mounting electronic components 失效
标题翻译：用于安装电子部件的装置和方法
公开(公告)号：US20050098610A1
公开(公告)日：2005-05-12
申请号：US10324001
申请日：2002-12-20
申请人： Shunji Onobori , Shuichi Hirata , Masakazu Yamano , Kazuya Yamamoto , Satoshi Shida , Takaharu Mae , Makoto Akita , Shozo Minamitani
发明人： Shunji Onobori , Shuichi Hirata , Masakazu Yamano , Kazuya Yamamoto , Satoshi Shida , Takaharu Mae , Makoto Akita , Shozo Minamitani
IPC分类号： B23K1/00 , H01L21/56 , H01L21/60 , H05K3/34 , B23K31/02
CPC分类号： H01L24/81 , B23K1/0016 , B23K2101/40 , H01L21/563 , H01L24/75 , H01L2224/05571 , H01L2224/05573 , H01L2224/13144 , H01L2224/16 , H01L2224/73204 , H01L2224/75 , H01L2224/751 , H01L2224/7515 , H01L2224/75301 , H01L2224/755 , H01L2224/75502 , H01L2224/758 , H01L2224/7598 , H01L2224/81801 , H01L2224/83192 , H01L2224/92125 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01043 , H01L2924/01052 , H01L2924/01065 , H01L2924/01073 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H05K3/3436 , H05K3/3494 , H05K2201/10151 , H05K2203/0195 , H05K2203/082 , Y02P70/613 , H01L2224/05599
摘要： After detection of contact between respective solder bumps of an electronic component, sucked and held by a suction nozzle of a head tool, and respective solder portions of a circuit board, the solder bumps and the solder portions are melted by heating. Releasing of the electronic component from suction and holding by the suction nozzle of the head tool is performed, not at a time during solder melting, but at a time after the solder is melted, cooled and solidified. Thus, an electronic component mounting method and apparatus capable of mounting high-end electronic components having narrow-pitched bumps are provided.
摘要翻译：在检测到由头工具的吸嘴吸引并保持的电子部件的各个焊料凸块之间的接触以及电路板的各个焊接部分之后，焊料凸块和焊料部分通过加热而熔化。执行电子部件从头部工具的吸嘴吸引和保持的释放，而不是在焊料熔化期间，而是在焊料熔化，冷却和固化之后的时间。因此，提供了能够安装具有窄凸起的高端电子部件的电子部件安装方法和装置。

34. 发明授权

US10096424B2 Method of manufacturing reactor 有权
公开(公告)号：US10096424B2
公开(公告)日：2018-10-09
申请号：US14976579
申请日：2015-12-21
申请人： Hiroyuki Miyauchi , Shuichi Hirata , Takeshi Okada , Satoshi Ito , Kengo Hara
发明人： Hiroyuki Miyauchi , Shuichi Hirata , Takeshi Okada , Satoshi Ito , Kengo Hara
IPC分类号： H01F41/00 , H01F27/02 , H01F27/30 , H01F27/32 , H01F37/00
摘要： Breakage of a ring core or a bobbin upon injection molding of molten resin is to be prevented in a method of manufacturing a reactor including the ring core. A reactor includes a ring core, a bobbin, a pair of coils, and a plastic cover. The bobbin includes a pair of cylinder portions, and flanges connecting ends of the cylinder portions. The reactor is manufactured by following processes. First protrusions that make contact with an inner circumferential surface of the ring core are provided on outer sides of the flanges along a cylinder axis direction. Second protrusions are provided at positions facing the corresponding first protrusions across the ring core are provided on a cavity surface of a mold that forms the plastic cover by injection molding. The plastic cover is formed by injecting molten resin into the mold while clamping the ring core by the first and second protrusions.

35. 发明申请

US20150076214A1 STRINGING DEVICE AND STRINGING METHOD AS WELL AS PHOTOVOLTAIC MODULE MANUFACTURING DEVICE AND MANUFACTURING METHOD 有权
标题翻译：作为光伏模块制造设备和制造方法的设备和字符串方法
公开(公告)号：US20150076214A1
公开(公告)日：2015-03-19
申请号：US14381372
申请日：2012-02-28
申请人： Seigo Kodama , Noriaki Iwaki , Shuichi Hirata , Masato Suzuki
发明人： Seigo Kodama , Noriaki Iwaki , Shuichi Hirata , Masato Suzuki
IPC分类号： H01L31/18 , H01L31/05
CPC分类号： H01L31/188 , H01L31/05 , Y02E10/50
摘要： A stringing device and stringing method usable for manufacturing photovoltaic modules efficiently with an easy configuration, and a photovoltaic module manufacturing device and manufacturing method. A stringing device for electrically connecting electrodes formed respectively in adjacent photovoltaic cells via a conductive member includes: number one joining unit which joins the photovoltaic cell supplied with its light receiving surface facing up and the conductive member to each other; and number two joining unit which joins the photovoltaic cell supplied with its light receiving surface facing down and the conductive member to each other.
摘要翻译：用于以易于构造有效地制造光伏模块的串联装置和串联方法，以及光伏模块制造装置和制造方法。用于经由导电构件电连接在相邻的光伏电池中的电极的电连接装置包括：第一连接单元，其将提供有其受光面的光伏电池与导电构件相互连接; 以及第二连接单元，其将供应有其面向下的光接收表面的光电池和导电构件彼此连接。

36. 发明申请

US20090206971A1 CORE FOR REACTOR 有权
标题翻译：核反应堆
公开(公告)号：US20090206971A1
公开(公告)日：2009-08-20
申请号：US12372939
申请日：2009-02-18
申请人： Hiroaki Yuasa , Shuichi Hirata
发明人： Hiroaki Yuasa , Shuichi Hirata
IPC分类号： H01F3/00
CPC分类号： H01F27/263 , H01F3/14 , H01F37/00
摘要： A core for a reactor includes: a plurality of core members, each of which has a convexly curved side face that serves as a bonding face; and a gap plate that is interposed between the curved side faces of the core members and that is bonded to the curved side faces. The gap plate includes a flat plate and a plurality of projections which project from each face of the plate and each of which has a tip end that contacts the curved side face. The projections are formed at positions near the outer edges of the plate, which are distant from the center of the plate at which no projection is formed, and which are at equal distances from the center of the plate.
摘要翻译：用于反应器的芯包括：多个芯构件，每个芯构件具有用作接合面的凸曲面侧面; 以及间隙板，其插入在所述芯构件的弯曲侧面之间并且接合到所述弯曲侧面。间隙板包括平板和从板的每个表面突出的多个突起，每个突起具有接触弯曲侧面的顶端。突起形成在靠近板的外边缘的位置，其远离不具有突出的板的中心，并且与板的中心距离相等。

37. 发明申请

US20070006453A1 COMPONENT MOUNTING APPARATUS AND COMPONENT MOUNTING METHOD 有权
标题翻译：组件安装和组件安装方法
公开(公告)号：US20070006453A1
公开(公告)日：2007-01-11
申请号：US11426719
申请日：2006-06-27
申请人： Shunji Onobori , Shozo Minamitani , Shuichi Hirata , Tomoaki Nakanishi
发明人： Shunji Onobori , Shozo Minamitani , Shuichi Hirata , Tomoaki Nakanishi
IPC分类号： H05K3/30 , B23P19/00
CPC分类号： H05K13/0465 , H01L2224/75 , H01L2224/75745 , H01L2224/758 , H01L2924/01087 , H01L2924/07811 , Y10T29/49117 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/53174 , H01L2924/00
摘要： In a component mounting apparatus in which integrated components having a chip-on-chip structure are formed by mounting upper chips on lower chips. The lower chips picked up from a component carrying-in unit by a component carrying-in head are placed on a mounting stage, and the upper chips picked up from a second component tray by a component transporting head are vertically flipped around a rotation axis and transferred to a mounting head at a component transferring position, then the upper chips held by the mounting head are descended and mounted by solder bonding on the lower chips held by the mounting stage at a component mounting position. Integrated components formed by mounting are carried out of the mounting stage by the component transporting head and stored in a first component tray in a component storing unit.
摘要翻译：在具有片上芯片结构的集成部件通过将上部芯片安装在下部芯片上而形成的部件安装装置中。通过部件承载头从部件承载单元拾取的下部芯片被放置在安装台上，并且通过部件传送头从第二部件托盘拾取的上部芯片围绕旋转轴线垂直翻转，在组件传送位置传送到安装头，则由安装头保持的上部芯片通过焊接粘合下降并通过安装台保持的下部芯片在部件安装位置安装。通过安装形成的集成部件通过部件传送头从安装台进行，并被存储在部件存储单元中的第一部件托盘中。

38. 发明授权

US5766402A Apparatus for applying tape to object by applying pressure thereto 失效
标题翻译：用于通过向其施加压力来施加胶带以对象的装置
公开(公告)号：US5766402A
公开(公告)日：1998-06-16
申请号：US413437
申请日：1995-03-30
申请人： Nobuhiko Muraoka , Shinjiro Tsuji , Shuichi Hirata , Hirohisa Mozaki
发明人： Nobuhiko Muraoka , Shinjiro Tsuji , Shuichi Hirata , Hirohisa Mozaki
IPC分类号： G02F1/13 , B65H20/24 , B65H37/00 , G02F1/1345 , H01L21/52 , B32B31/08 , B65H26/02
CPC分类号： B65H37/002 , B65H20/24 , H01L24/743 , B65H2301/4491 , H01L2224/743 , Y10T156/1705 , Y10T156/1712
摘要： An apparatus, for applying a pressing tape to an object by applying pressure to the object, includes a pair of vertically movable members spaced at a certain interval. A tape-shaped material is traveled members and including a supporting tape carrying a pressing tape thereon. A pressure applying device is positioned between the movable members for pressing the tape-shaped member against an object. A tape feed-out device is provided upstream of one of the movable members for feeding out the tape-shaped material therefrom. A tape winding device is positioned downstream of the other movable member, for winding the tape-shaped material thereon. A tape feeding device is positioned between the other movable member and the winding device for feeding the tape-shaped material by a predetermined length by pulling the tape-shaped material. A first chuck is positioned on one movable member for chucking the tape-shaped material. A second chuck is positioned on the other movable member for chucking the tape-shaped material, and a third chuck device is provided for holding the tape-shaped material between the tape feeding device and the winding device.
摘要翻译：一种用于通过向物体施加压力将加压带施加到物体上的装置包括以一定间隔隔开的一对可垂直移动的构件。带状材料是行进的构件，并且包括在其上承载有压带的支撑带。压力施加装置位于可动构件之间，用于将带状构件压靠在物体上。一个可移动部件的上游设置有带式送出装置，用于从其中输出带状材料。磁带卷绕装置位于另一可移动部件的下游，用于将带状材料卷绕在其上。带进给装置位于另一可移动部件和卷绕装置之间，用于通过拉动带状材料将带状材料供给预定长度。第一卡盘位于一个可动件上，用于夹紧带状材料。第二卡盘位于另一可移动部件上用于夹紧带状材料，并且设置有用于将带状材料保持在带馈送装置和卷绕装置之间的第三卡盘装置。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式