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31. 发明授权

US07294038B2 Process control in electrochemically assisted planarization 失效
标题翻译：电化学辅助平面化过程控制
公开(公告)号：US07294038B2
公开(公告)日：2007-11-13
申请号：US11425339
申请日：2006-06-20
申请人： Antoine P. Manens , Liang-Yuh Chen
发明人： Antoine P. Manens , Liang-Yuh Chen
IPC分类号： B23H3/00 , B24D11/02 , C23H3/00 , C25D17/00
CPC分类号： B24B37/046 , B23H5/06 , B23H5/08 , B24B37/042 , B24B37/22 , B24B49/16
摘要： In one embodiment, a pad assembly for electro-processing a substrate is provided which includes a first conductive layer having a working surface adapted to contact the substrate during a polishing process, an intermediate layer coupled to the first conductive layer, and a second conductive layer coupled to the intermediate layer. The second conductive layer may have a plurality of independently electrically biasable zones and is configured to be coupled with a power delivery arrangement. The intermediate layer may contain a polymer material support disk, a backing layer, or combinations thereof. Generally, the first conductive layer, the second conductive layer, and the intermediate layer are adhered or secured together and removable as a unitary replaceable body. In one example, the intermediate layer may contain a plurality of perforations or cannels that have a diameter within a range from about 0.5 mm to about 10 mm.
摘要翻译：在一个实施例中，提供了一种用于电处理衬底的焊盘组件，其包括第一导电层，其具有适于在抛光工艺期间接触衬底的工作表面，耦合到第一导电层的中间层和第二导电层耦合到中间层。第二导电层可以具有多个独立的电可偏置区域，并且被配置为与电力输送装置耦合。中间层可以包含聚合物材料支撑盘，背衬层或其组合。通常，第一导电层，第二导电层和中间层被粘合或固定在一起并作为整体可更换体移动。在一个示例中，中间层可以包含多个穿孔或孔，其直径在约0.5mm至约10mm的范围内。

32. 发明授权

US07186164B2 Processing pad assembly with zone control 失效
标题翻译：具有区域控制的加工垫组件
公开(公告)号：US07186164B2
公开(公告)日：2007-03-06
申请号：US10727774
申请日：2003-12-03
申请人： Antoine P. Manens
发明人： Antoine P. Manens
IPC分类号： B24B49/00
CPC分类号： C25D7/12 , B24B37/22 , B24B37/26 , C25D17/001 , C25D17/14 , C25F7/00
摘要： An electrochemical mechanical processing station having a zoned polishing pad assembly is provided. The zoned polishing pad assembly includes a conductive layer coupled to an upper layer having a non-conductive processing surface. At least two zones of different current permeability are defined across the processing surface of the upper layer. Each zone is defined by an attribute of the upper layer.
摘要翻译：提供了具有分区抛光垫组件的电化学机械加工台。分区抛光垫组件包括连接到具有非导电处理表面的上层的导电层。在上层的处理表面上限定了不同电流渗透性的至少两个区域。每个区域由上层的属性定义。

33. 发明申请

US20140083407A1 WAFER SAWING SYSTEM 审中-公开
标题翻译： WAFER SAWING系统
公开(公告)号：US20140083407A1
公开(公告)日：2014-03-27
申请号：US13657306
申请日：2012-10-22
申请人： Andreas Schmid , Antoine P. Manens , Romain Beau De Lomenie , Richard Fay , Franck Genonceau
发明人： Andreas Schmid , Antoine P. Manens , Romain Beau De Lomenie , Richard Fay , Franck Genonceau
IPC分类号： B28D5/04
CPC分类号： B28D5/045 , B23D57/0053
摘要： A wafer sawing system and a method of sawing an ingot in a wafer sawing system are described. The system includes an ingot input module, an ingot output module, two or more wire sawing chambers that each comprise: two wire guide cylinders, at least one wire disposed across both of the wire guide cylinders, a support table that is configured to receive a single ingot, and an ingot positioning system that is configured to urge the single ingot disposed on the support table against the at least one wire, and a robot that is configured to transfer the single ingot between the ingot input module, at least one of the two or more wire sawing chambers and the ingot output chamber.
摘要翻译：描述了晶片锯切系统和在晶圆锯切系统中锯锭的方法。该系统包括铸锭输入模块，铸块输出模块，两个或多个钢丝锯切槽，每个钢丝锯切槽包括：两个导丝筒，至少一个布置在两个导丝筒上的丝;支撑台，单锭和锭定位系统，其被构造成推动设置在所述支撑台上的所述单个铸锭抵靠所述至少一根钢丝;以及机器人，所述机器人被配置为在所述铸锭输入模块之间传送所述单锭，两个或更多个线锯槽和锭输出室。

34. 发明申请

US20100105294A1 METHODS AND APPARATUS TO MINIMIZE THE EFFECT OF TAPE TENSION IN ELECTRONIC DEVICE POLISHING 审中-公开
标题翻译：最小化电子设备抛光中贴片张力的影响的方法和设备
公开(公告)号：US20100105294A1
公开(公告)日：2010-04-29
申请号：US12603858
申请日：2009-10-22
申请人： Gary C. Ettinger , Wendy Luo , Antoine P. Manens
发明人： Gary C. Ettinger , Wendy Luo , Antoine P. Manens
IPC分类号： B24B9/02 , B24B21/02 , B24B21/20
CPC分类号： B24B21/002 , B24B9/065 , B24B21/20
摘要： Methods and apparatus are provided for reducing tension on a polishing roller. In some aspects, a polishing head may be provided that is adapted to contact a substrate. The polishing head includes: a polishing unit having a polisher and at least one pair of tension distributors adapted to reduce tension on the polisher; and one or more pairs feed guides. Numerous other aspects are provided.
摘要翻译：提供了减少抛光辊张力的方法和装置。在一些方面，可以提供适于接触基底的抛光头。抛光头包括：具有抛光机的抛光单元和适于减小抛光机上的张力的至少一对张力分布器; 和一对或多对进给导轨。提供了许多其他方面。

35. 发明授权

US06884153B2 Apparatus for electrochemical processing 失效
标题翻译：电化学处理设备
公开(公告)号：US06884153B2
公开(公告)日：2005-04-26
申请号：US10445239
申请日：2003-05-23
申请人： Antoine P. Manens , Paul D. Butterfield
发明人： Antoine P. Manens , Paul D. Butterfield
IPC分类号： B23H5/08 , B24B37/04 , B24B53/007 , B24D13/14 , H01L21/321 , B24B1/00 , H01L21/302
CPC分类号： B23H5/08 , B24B37/046 , B24B37/24 , B24B53/017 , H01L21/32125
摘要： A method and apparatus for electrically biasing a substrate in an electrochemical processing system is generally provided. In one embodiment, an apparatus for electrochemical processing includes a polishing pad and a conductive element disposed therein. The polishing pad has an upper surface adapted to support a substrate thereon during processing. The conductive element disposed in the polishing pad is movable between a first position having at least a portion of the conductive element exposed above the upper surface and a second position below the upper surface, wherein the conductive element is magnetically biased towards the first position.
摘要翻译：通常提供用于在电化学处理系统中电偏置衬底的方法和装置。在一个实施例中，用于电化学处理的装置包括抛光垫和设置在其中的导电元件。抛光垫具有适于在加工期间支撑其上的基板的上表面。设置在抛光垫中的导电元件可以在具有暴露在上表面上方的导电元件的至少一部分的第一位置和在上表面下方的第二位置之间移动，其中导电元件被磁偏置朝向第一位置。

36. 发明授权

US08142260B2 Methods and apparatus for removal of films and flakes from the edge of both sides of a substrate using backing pads 有权
标题翻译：使用背衬从基板两侧的边缘去除薄膜和薄片的方法和装置
公开(公告)号：US08142260B2
公开(公告)日：2012-03-27
申请号：US12124142
申请日：2008-05-20
申请人： Eashwer Kollata , Shou-Sung Chang , Zhenhua Zhang , Paul D. Butterfield , Sen-Hou Ko , Antoine P. Manens , Gary C. Ettinger , Ricardo Martinez
发明人： Eashwer Kollata , Shou-Sung Chang , Zhenhua Zhang , Paul D. Butterfield , Sen-Hou Ko , Antoine P. Manens , Gary C. Ettinger , Ricardo Martinez
IPC分类号： B24B1/00
CPC分类号： B24B9/065 , H01L21/02087
摘要： Apparatus and methods are provided to polish an edge of a substrate. The invention includes a polishing head adapted to retain a backing pad having a selected contour, wherein the polishing head is adapted to press the backing pad against an edge of a substrate. Numerous other aspects are provided.
摘要翻译：提供了设备和方法来抛光衬底的边缘。本发明包括一种适于保持具有选定轮廓的背衬垫的抛光头，其中抛光头适于将衬垫压靠在衬底的边缘上。提供了许多其他方面。

37. 发明申请

US20100105299A1 METHODS AND APPARATUS FOR POLISHING AN EDGE AND/OR NOTCH OF A SUBSTRATE 审中-公开
标题翻译：用于抛光衬底和/或衬底的方法和装置
公开(公告)号：US20100105299A1
公开(公告)日：2010-04-29
申请号：US12258242
申请日：2008-10-24
申请人： Gary C. Ettinger , Paul D. Butterfield , Antoine P. Manens , Sen-Hou Ko
发明人： Gary C. Ettinger , Paul D. Butterfield , Antoine P. Manens , Sen-Hou Ko
IPC分类号： B24B21/00
CPC分类号： B24B9/065 , B24B21/002 , B24B49/16
摘要： Apparatus and methods are provided to polish a substrate. In some aspects, the invention includes a polishing head adapted to apply a polishing tape against at least one of a substrate edge and a notch in the substrate edge. The polishing head includes a polisher coupled to the polishing head, wherein the polisher has a hollow portion and is adapted to conform to a shape of at least one of the substrate edge and the notch. Numerous other aspects are provided.
摘要翻译：提供设备和方法来抛光基底。在一些方面，本发明包括一种抛光头，其适于将抛光带应用于衬底边缘中的衬底边缘和凹口中的至少一个。抛光头包括连接到抛光头的抛光机，其中抛光机具有中空部分并且适于符合基板边缘和凹口中的至少一个的形状。提供了许多其他方面。

38. 发明申请

US20090314751A1 LASER SCRIBE INSPECTION METHODS AND SYSTEMS 审中-公开
标题翻译：激光扫描检测方法和系统
公开(公告)号：US20090314751A1
公开(公告)日：2009-12-24
申请号：US12422224
申请日：2009-04-10
申请人： Antoine P. Manens , Bassam Shamoun , Jeffrey S. Sullivan , John White , Michael Shirk
发明人： Antoine P. Manens , Bassam Shamoun , Jeffrey S. Sullivan , John White , Michael Shirk
IPC分类号： B23K26/00
CPC分类号： H01L31/03921 , H01L31/022425 , Y02E10/50
摘要： Methods and systems for use during laser-scribing of a workpiece are provided. Some of the methods and systems provided use an imaging device to control the formation of a laser-scribed feature so as to more closely align with a previously-formed feature. Some of the methods and systems provided use an imaging device for inspection of a laser-scribed feature and/or process control. Some of the methods and systems provided use an imaging device to detect and avoid a workpiece defect during the formation of a laser-scribed feature.
摘要翻译：提供了在工件的激光划线期间使用的方法和系统。提供的一些方法和系统使用成像装置来控制激光划线特征的形成，以便与先前形成的特征更紧密地对准。提供的一些方法和系统使用成像装置来检查激光划线特征和/或过程控制。提供的一些方法和系统使用成像装置来检测和避免在形成激光刻划特征期间的工件缺陷。

39. 发明申请

US20080293341A1 METHODS AND APPARATUS FOR USING A ROLLING BACKING PAD FOR SUBSTRATE POLISHING 审中-公开
标题翻译：用于衬底抛光的滚动支撑垫的方法和装置
公开(公告)号：US20080293341A1
公开(公告)日：2008-11-27
申请号：US12124147
申请日：2008-05-21
申请人： Eashwer Kollata , Shou-Sung Chang , Zhenhua Zhang , Paul D. Butterfield , Sen-Hou Ko , Antoine P. Manens , Gary C. Ettinger , Ricardo Martinez
发明人： Eashwer Kollata , Shou-Sung Chang , Zhenhua Zhang , Paul D. Butterfield , Sen-Hou Ko , Antoine P. Manens , Gary C. Ettinger , Ricardo Martinez
IPC分类号： B24B5/00 , B24B1/00
CPC分类号： B24B9/065 , B24B21/002
摘要： An apparatus and method are provided to polish an edge of a substrate. The invention includes a polishing head including a backing pad, wherein a width of the backing pad that contacts the substrate edge is larger than a width of a notch in the substrate edge. Numerous other aspects are provided.
摘要翻译：提供了一种用于抛光衬底边缘的装置和方法。本发明包括一个包括背衬垫的抛光头，其中背衬垫的接触衬底边缘的宽度大于衬底边缘中的凹口的宽度。提供了许多其他方面。

40. 发明申请

US20080293340A1 METHODS AND APPARATUS FOR REMOVAL OF FILMS AND FLAKES FROM THE EDGE OF BOTH SIDES OF A SUBSTRATE USING BACKING PADS 有权
标题翻译：使用背面垫片从基板两侧边缘移除薄膜和花瓣的方法和装置
公开(公告)号：US20080293340A1
公开(公告)日：2008-11-27
申请号：US12124142
申请日：2008-05-20
申请人： Eashwer Kollata , Shou-Sung Chang , Zhenhua Zhang , Paul D. Butterfield , Sen-Hou Ko , Antoine P. Manens , Gary C. Ettinger , Ricardo Martinez
发明人： Eashwer Kollata , Shou-Sung Chang , Zhenhua Zhang , Paul D. Butterfield , Sen-Hou Ko , Antoine P. Manens , Gary C. Ettinger , Ricardo Martinez
IPC分类号： B24B29/00 , H01L21/302 , B24B1/00
CPC分类号： B24B9/065 , H01L21/02087
摘要： Apparatus and methods are provided to polish an edge of a substrate. The invention includes a polishing head adapted to retain a backing pad having a selected contour, wherein the polishing head is adapted to press the backing pad against an edge of a substrate. Numerous other aspects are provided.
摘要翻译：提供了设备和方法来抛光衬底的边缘。本发明包括一种适于保持具有选定轮廓的背衬垫的抛光头，其中抛光头适于将衬垫压靠在衬底的边缘上。提供了许多其他方面。

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