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31. 外观设计

USD744473S1 Tripod mount for electronic device 有权
标题翻译：三脚架用于电子设备
公开(公告)号：USD744473S1
公开(公告)日：2015-12-01
申请号：US29499810
申请日：2014-08-19
申请人： Kuang Yuan Tsai , Huan Wang , Wen Chun Tseng
设计人： Kuang Yuan Tsai , Huan Wang , Wen Chun Tseng

32. 发明授权

US08907464B2 Helix substrate and three-dimensional package with same 有权
标题翻译：螺旋衬底和三维包装相同
公开(公告)号：US08907464B2
公开(公告)日：2014-12-09
申请号：US13848734
申请日：2013-03-22
申请人： Huan Wang , Meiquan Huang , Hejin Liu
发明人： Huan Wang , Meiquan Huang , Hejin Liu
IPC分类号： H01L23/02 , H01L23/04 , H01L23/34 , H01L23/48 , H05K1/18 , H05K1/14 , H05K3/28
CPC分类号： H05K1/181 , H01L23/13 , H01L23/3121 , H01L25/065 , H01L2924/0002 , H05K1/0284 , H05K1/141 , H05K1/144 , H05K3/284 , H05K2201/041 , H05K2201/09027 , H05K2201/09118 , H05K2203/1316 , Y02P70/611 , H01L2924/00
摘要： A three dimensional (3D) package includes a helix substrate having a columnar part including a top surface, a bottom surface and a sidewall, and a plurality of steps arranged along the sidewall of the columnar part in the form of a helix. Semiconductor integrated circuits (dies) may be attached on supporting surfaces of the steps. The columnar part, the steps and the dies can be covered with a mold compound. I/Os are formed at either the sides of the steps and/or the top and/or bottom of the columnar part.
摘要翻译：三维（3D）封装包括具有包括顶表面，底表面和侧壁的柱状部分的螺旋衬底和沿着螺旋形式的柱状部分的侧壁布置的多个台阶。半导体集成电路（模具）可以附接在台阶的支撑表面上。柱状部分，台阶和模具可以用模具复合物覆盖。 I / O形成在台阶的两侧和/或柱状部分的顶部和/或底部。

33. 发明授权

US08878348B2 Semiconductor device and method of assembling same 有权
标题翻译：半导体装置及其组装方法
公开(公告)号：US08878348B2
公开(公告)日：2014-11-04
申请号：US13854137
申请日：2013-04-01
申请人： Meiquan Huang , Huan Wang , Jinsheng Wang , Naikuo Zhou
发明人： Meiquan Huang , Huan Wang , Jinsheng Wang , Naikuo Zhou
IPC分类号： H01L23/495 , H01L21/56 , H01L23/00 , H01L23/31 , H01L23/367
CPC分类号： H01L23/49503 , H01L21/56 , H01L21/561 , H01L23/3128 , H01L23/3677 , H01L23/49506 , H01L23/4952 , H01L23/49541 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/83 , H01L24/85 , H01L24/97 , H01L2224/05554 , H01L2224/2919 , H01L2224/32225 , H01L2224/48091 , H01L2224/48108 , H01L2224/48227 , H01L2224/48235 , H01L2224/48247 , H01L2224/49109 , H01L2224/49171 , H01L2224/49173 , H01L2224/73265 , H01L2224/8385 , H01L2224/83851 , H01L2224/85424 , H01L2224/85444 , H01L2224/85447 , H01L2224/85464 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01046 , H01L2924/01079 , H01L2924/10161 , H01L2924/15174 , H01L2924/15184 , H01L2924/181 , H01L2924/3511 , H01L2924/00 , H01L2924/0665 , H01L2224/83 , H01L2224/85 , H01L2224/45099 , H01L2924/00012
摘要： A semiconductor device has a die support and external leads formed integrally from a single sheet of electrically conductive material. A die mounting substrate is mounted on the die support, with bonding pads coupled to respective external connection pads on an external connector side of the substrate. A die is attached to the die mounting substrate with die connection pads. Bond wires selectively electrically couple the die connection pads to the external leads and the bonding pads and electrically conductive external protrusions are mounted to the external connection pads. An encapsulant covers the die and bond wires. The external protrusions are located at a central region of a surface mounting side of the package and the external leads project outwardly from locations near the die support towards peripheral edges of the package.
摘要翻译：半导体器件具有从单片导电材料一体地形成的管芯支撑件和外部引线。模具安装基板安装在模具支撑件上，其中焊盘连接到基板的外部连接器侧上的相应的外部连接焊盘。一个管芯连接到具有管芯连接焊盘的管芯安装衬底。键合线选择性地将管芯连接焊盘电连接到外部引线，并且焊盘和导电外部突出部安装到外部连接焊盘。密封剂覆盖管芯和接合线。外部突出部位于封装的表面安装侧的中心区域，并且外部引线朝向封装外围边缘的位置向外突出。

34. 发明申请

US20130172551A1 Process for Preparing Carbamolypyridone Derivatives and Intermediates 有权
标题翻译：制备羧甲基吡啶酮衍生物和中间体的方法
公开(公告)号：US20130172551A1
公开(公告)日：2013-07-04
申请号：US13636237
申请日：2011-03-22
申请人： Steven N. Goodman , Huan Wang , Douglas Matthew Mans
发明人： Steven N. Goodman , Huan Wang , Douglas Matthew Mans
IPC分类号： C07D498/14 , C07D213/80
CPC分类号： C07D498/14 , C07D213/68 , C07D213/80
摘要： The present invention relates to the preparation of carbamoylpyridone derivatives and intermediates.
摘要翻译：本发明涉及氨基甲酰吡啶酮衍生物和中间体的制备。

35. 发明申请

US20110268039A1 METHOD, APPARATUS, AND SYSTEM FOR IMPLEMENTING SERVICE ROAMING 有权
标题翻译：用于实施服务漫游的方法，装置和系统
公开(公告)号：US20110268039A1
公开(公告)日：2011-11-03
申请号：US13173580
申请日：2011-06-30
申请人： Huan Wang , Yan Li , Qifeng Ma , Xiaomin Shi , Heng Chang , Shan Chen
发明人： Huan Wang , Yan Li , Qifeng Ma , Xiaomin Shi , Heng Chang , Shan Chen
IPC分类号： H04W4/00
CPC分类号： H04W8/12 , H04L67/16
摘要： The present invention discloses a method for implementing service roaming. The method includes: receiving a roaming registration request that includes a service identifier (ID); obtaining a physical access address of a service according to the service ID, and generating and storing service registration route information that includes the service ID and the physical access address of the service; obtaining an address of a home service router or a service router to which the service belongs before the service roams, and sending a roaming notification message to the home service router or the service router to which the service belongs before the service roams. In this way, a user may access the service, thus the user experience and the universality of services created by the user are improved.
摘要翻译：本发明公开了一种实现业务漫游的方法。该方法包括：接收包括服务标识符（ID）的漫游注册请求; 根据业务ID获取业务的物理接入地址，生成并存储业务登记路由信息，包括业务ID和业务的物理接入地址; 在服务漫游之前，获得该服务所属的家庭服务路由器或服务路由器的地址，并且在该服务漫游之前向归属服务路由器或该服务所属的服务路由器发送漫游通知消息。以这种方式，用户可以访问服务，从而提高了用户体验和由用户创建的服务的普遍性。

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