会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 32. 发明授权
    • Bottom lighting module
    • 底部照明模块
    • US07036956B1
    • 2006-05-02
    • US11258050
    • 2005-10-26
    • Shen-Hong Chou
    • Shen-Hong Chou
    • F21V5/00
    • G02F1/133603
    • A bottom lighting module comprises a substrate, a nut, a first diffusion sheet, a support, a second diffusion sheet and at least one light-emitting diode (LED). The nut is set on the substrate. The first diffusion sheet is disposed on the nut. The support comprises a body and a screw. The body further comprises a top end and a bottom face. The screw extends from the bottom face and passes through the first diffusion sheet to joint with the nut. The second diffusion sheet is disposed on the top end of the body. The LED is disposed below the first diffusion sheet.
    • 底部照明模块包括基板,螺母,第一扩散片,支撑件,第二扩散片和至少一个发光二极管(LED)。 螺母固定在基板上。 第一扩散片设置在螺母上。 支撑件包括主体和螺钉。 身体还包括顶端和底面。 螺钉从底面延伸并穿过第一扩散片与螺母接合。 第二漫射片设置在身体的顶端。 LED设置在第一扩散片下方。
    • 33. 发明申请
    • Backlight device for display system
    • 背光装置用于显示系统
    • US20050174318A1
    • 2005-08-11
    • US10758364
    • 2004-01-15
    • Shen-Hong ChouYi-Chun Lin
    • Shen-Hong ChouYi-Chun Lin
    • G02F1/13357F21S2/00F21S8/04F21V8/00F21Y101/02G02F1/133G02F1/1335G09G3/36
    • G02F1/133611Y10S362/80
    • The present application describes a backlight device for providing enhanced peripheral illumination of light modulators in display systems. In one embodiment, a display system includes a light modulator, a light diffusing plate, and a backlight device. The backlight device includes light sources that are distributed over an area that is at least equal to or greater than an image display area of the light modulator. In another embodiment, an edge-lit type backlight device is described. The edge-lit type backlight device includes a light guide plate for directing light towards the light modulator. The edge-lit type backlight device further includes light sources that are distributed along a side edge of the light guide plate. The light sources are distributed along a length that is at least equal to or greater than a corresponding length of an image display area of the light modulator.
    • 本申请描述了用于在显示系统中提供光调制器的增强的外围照明的背光装置。 在一个实施例中,显示系统包括光调制器,光漫射板和背光装置。 背光装置包括分布在至少等于或大于光调制器的图像显示区域的区域上的光源。 在另一实施例中,描述了边缘型背光装置。 边缘型背光装置包括用于将光引向光调制器的导光板。 边缘型背光装置还包括沿着导光板的侧边缘分布的光源。 光源沿着至少等于或大于光调制器的图像显示区域的相应长度的长度分布。
    • 35. 发明授权
    • Package structure for light emitting diode and applications of the same
    • 发光二极管的封装结构及其应用
    • US07547115B2
    • 2009-06-16
    • US11439155
    • 2006-05-23
    • Shen-Hong Chou
    • Shen-Hong Chou
    • F21V3/02F21V5/00H01L33/00
    • F21K9/00F21K9/69H01L33/54H01L2924/0002H01L2924/00
    • A light emitting diode (LED) package structure. In one embodiment, the LED package structure includes at least three lenses, each lens having a body portion with at least a first surface, a second surface, a third surface and a fourth surface, and at least three LED chips, each LED chip being capable of emitting light in a unique color and having a first conductive lead and a second conductive lead and embedded in the body portion of a corresponding lens such that the first conductive lead and the second conductive lead extend out of the body portion from one of the third surface and the fourth surface of the corresponding lens. The at least three lenses and the at least three LED chips are assembled such that the first surface of a lens is in contact with the second surface of one of the rest of the at least three lenses and the at least three LED chips are positioned substantially proximate to each other.
    • 一种发光二极管(LED)封装结构。 在一个实施例中,LED封装结构包括至少三个透镜,每个透镜具有至少第一表面,第二表面,第三表面和第四表面的主体部分,以及至少三个LED芯片,每个LED芯片是 能够以独特的颜色发光,并具有第一导电引线和第二导电引线,并且嵌入相应透镜的主体部分中,使得第一导电引线和第二导电引线从主体部分之一延伸出 第三表面和相应透镜的第四表面。 组装至少三个透镜和至少三个LED芯片,使得透镜的第一表面与至少三个透镜的其余部分中的一个的第二表面接触,并且至少三个LED芯片基本上被定位 彼此接近。
    • 40. 发明申请
    • Package structure for light emitting diode and applications of the same
    • 发光二极管的封装结构及其应用
    • US20070274069A1
    • 2007-11-29
    • US11439155
    • 2006-05-23
    • Shen-Hong Chou
    • Shen-Hong Chou
    • F21V5/00
    • F21K9/00F21K9/69H01L33/54H01L2924/0002H01L2924/00
    • A light emitting diode (LED) package structure. In one embodiment, the LED package structure includes at least three lenses, each lens having a body portion with at least a first surface, a second surface, a third surface and a fourth surface, and at least three LED chips, each LED chip being capable of emitting light in a unique color and having a first conductive lead and a second conductive lead and embedded in the body portion of a corresponding lens such that the first conductive lead and the second conductive lead extend out of the body portion from one of the third surface and the fourth surface of the corresponding lens. The at least three lenses and the at least three LED chips are assembled such that the first surface of a lens is in contact with the second surface of one of the rest of the at least three lenses and the at least three LED chips are positioned substantially proximate to each other.
    • 一种发光二极管(LED)封装结构。 在一个实施例中,LED封装结构包括至少三个透镜,每个透镜具有至少第一表面,第二表面,第三表面和第四表面的主体部分,以及至少三个LED芯片,每个LED芯片是 能够以独特的颜色发光,并具有第一导电引线和第二导电引线,并且嵌入相应透镜的主体部分中,使得第一导电引线和第二导电引线从主体部分之一延伸出 第三表面和相应透镜的第四表面。 组装至少三个透镜和至少三个LED芯片,使得透镜的第一表面与至少三个透镜的其余部分中的一个的第二表面接触,并且至少三个LED芯片基本上被定位 彼此接近。