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    • 32. 发明申请
    • Multilevel Variable Resistance Memory Cell Utilizing Crystalline Programming States
    • 使用结晶编程国家的多电平可变电阻记忆单元
    • US20100027328A1
    • 2010-02-04
    • US12578638
    • 2009-10-14
    • Wolodymyr CzubatyjTyler LowreyCharles DennisonCarl Schell
    • Wolodymyr CzubatyjTyler LowreyCharles DennisonCarl Schell
    • G11C11/00G11C7/00
    • G11C11/56G11C11/5678G11C13/0004G11C13/0069G11C2013/0092
    • A method of programming an electrical variable resistance memory device. When applied to variable resistance memory devices that incorporate a phase-change material as the active material, the method utilizes a plurality of crystalline programming states. The crystalline programming states are distinguishable on the basis of resistance, where the resistance values of the different states are stable with time and exhibit little or no drift. As a result, the programming scheme is particularly suited to multilevel memory applications. The crystalline programming states may be achieved by stabilizing crystalline phases that adopt different crystallographic structures or by stabilizing crystalline phases that include mixtures of two or more distinct crystallographic structures that vary in the relative proportions of the different crystallographic structures. The programming scheme incorporates at least two crystalline programming states and further includes at least a third programming state that may be a crystalline, amorphous or mixed crystalline-amorphous state.
    • 一种编程电可变电阻存储器件的方法。 当应用于包含相变材料作为活性材料的可变电阻存储器件时,该方法利用多个晶体编程状态。 结晶编程状态可以根据电阻进行区分,其中不同状态的电阻值随时间稳定并且表现出很小的或没有漂移。 因此,编程方案特别适用于多层存储器应用。 晶体编程状态可以通过稳定采用不同晶体结构的结晶相或通过稳定结晶相来实现,所述结晶相包括两种或更多种不同结晶学结构的混合物,其在不同结晶学结构的相对比例中变化。 编程方案包含至少两个晶体编程状态,并且还包括至少第三编程状态,其可以是晶体,无定形或混合晶体 - 非晶状态。
    • 35. 发明申请
    • Memory device and method of making same
    • 存储器件及其制作方法
    • US20070063181A1
    • 2007-03-22
    • US11602923
    • 2006-11-21
    • Wolodymyr CzubatyjTyler LowreyIsamu Asano
    • Wolodymyr CzubatyjTyler LowreyIsamu Asano
    • H01L47/00
    • H01L45/06H01L45/122H01L45/143H01L45/144H01L45/148
    • A radial memory device includes a phase-change material, a first electrode in electrical communication with the phase-change material, the first electrode having a first area of electrical communication with the phase-change material. A second electrode in electrical communication with the phase-change material, the second electrode having a second area of electrical communication with the phase-change material, and the second area being laterally spacedly disposed from the first area. Additionally, the radial memory device includes a dielectric layer disposed between the first electrode and the second electrode, the dielectric layer having an opening therethrough, the phase-change material being disposed in the opening, wherein the phase-change material is disposed at least partially above the second electrode. Further, a method of making a memory device is disclosed.
    • 径向存储器件包括相变材料,与相变材料电连通的第一电极,第一电极具有与相变材料电连通的第一区域。 与所述相变材料电连通的第二电极,所述第二电极具有与所述相变材料电连通的第二区域,并且所述第二区域与所述第一区域横向间隔设置。 此外,径向存储器件包括设置在第一电极和第二电极之间的电介质层,电介质层具有穿过其中的开口,相变材料设置在开口中,其中相变材料至少部分地设置 在第二电极之上。 此外,公开了一种制造存储器件的方法。
    • 36. 发明申请
    • Memory device and method of making same
    • 存储器件及其制作方法
    • US20070048945A1
    • 2007-03-01
    • US11495927
    • 2006-07-28
    • Wolodymyr CzubatyjTyler LowreySergey Kostylev
    • Wolodymyr CzubatyjTyler LowreySergey Kostylev
    • H01L21/336
    • G11C11/5678G11C11/56G11C13/0004H01L45/06H01L45/122H01L45/143H01L45/144H01L45/148
    • A radial memory device includes a phase-change material, a first electrode in electrical communication with the phase-change material, the first electrode having a substantially planar first area of electrical communication with the phase-change material. The radial memory device also includes a second electrode in electrical communication with the phase-change material, the second electrode having a second area of electrical communication with the phase-change material, the second area being laterally spacedly disposed from the first area and substantially circumscribing the first area. Further, a method of making a memory device is disclosed. The steps include depositing a first electrode, depositing a first insulator, configuring the first insulator to define a first opening. The first opening provides for a generally planar first contact of the first electrode. The method further including the steps of depositing a phase-change material, depositing a second insulator, configuring the second insulator, depositing a second electrode having a second contact laterally displaced from said first contact, and configuring said second electrode.
    • 径向存储器件包括相变材料,与相变材料电连通的第一电极,第一电极具有与相变材料电连通的基本平坦的第一区域。 所述径向存储装置还包括与所述相变材料电连通的第二电极,所述第二电极具有与所述相变材料电连通的第二区域,所述第二区域与所述第一区域横向间隔设置并且基本上限定 第一个区域。 此外,公开了一种制造存储器件的方法。 这些步骤包括沉积第一电极,沉积第一绝缘体,构成第一绝缘体以限定第一开口。 第一开口提供第一电极的大致平面的第一接触。 该方法还包括以下步骤:沉积相变材料,沉积第二绝缘体,构成第二绝缘体,沉积具有从所述第一触点横向移位的第二触点的第二电极,以及配置所述第二电极。
    • 38. 发明授权
    • Memory device and method of making same
    • 存储器件及其制作方法
    • US08581223B2
    • 2013-11-12
    • US13039952
    • 2011-03-03
    • Wolodymyr CzubatyjTyler LowreySergey Kostylev
    • Wolodymyr CzubatyjTyler LowreySergey Kostylev
    • H01L47/00
    • G11C11/5678G11C11/56G11C13/0004H01L45/06H01L45/122H01L45/143H01L45/144H01L45/148
    • A radial memory device includes a phase-change material, a first electrode in electrical communication with the phase-change material, the first electrode having a substantially planar first area of electrical communication with the phase-change material. The radial memory device also includes a second electrode in electrical communication with the phase-change material, the second electrode having a second area of electrical communication with the phase-change material, the second area being laterally spacedly disposed from the first area and substantially circumscribing the first area.Further, a method of making a memory device is disclosed. The steps include depositing a first electrode, depositing a first insulator, configuring the first insulator to define a first opening. The first opening provides for a generally planar first contact of the first electrode. The method further including the steps of depositing a phase-change material, depositing a second insulator, configuring the second insulator, depositing a second electrode having a second contact laterally displaced from said first contact, and configuring said second electrode.
    • 径向存储器件包括相变材料,与相变材料电连通的第一电极,第一电极具有与相变材料电连通的基本平坦的第一区域。 所述径向存储装置还包括与所述相变材料电连通的第二电极,所述第二电极具有与所述相变材料电连通的第二区域,所述第二区域与所述第一区域横向间隔设置并且基本上限定 第一个区域。 此外,公开了一种制造存储器件的方法。 这些步骤包括沉积第一电极,沉积第一绝缘体,构成第一绝缘体以限定第一开口。 第一开口提供第一电极的大致平面的第一接触。 该方法还包括以下步骤:沉积相变材料,沉积第二绝缘体,构成第二绝缘体,沉积具有从所述第一触点横向移位的第二触点的第二电极,以及配置所述第二电极。
    • 39. 发明授权
    • Breakdown layer via lateral diffusion
    • 击穿层通过横向扩散
    • US08350661B2
    • 2013-01-08
    • US12471937
    • 2009-05-26
    • Wolodymyr CzubatyjTyler LowreyEdward J. Spall
    • Wolodymyr CzubatyjTyler LowreyEdward J. Spall
    • H01C7/13
    • H01C7/006G11C13/0004H01C17/08H01L45/06H01L45/12H01L45/1246H01L45/143H01L45/144H01L45/148H01L45/1658H01L45/1683Y10T29/49082
    • An electronic device including a breakdown layer having variable thickness. The device includes a variable resistance material positioned between two electrodes. A breakdown layer is interposed between the variable resistance material and one of the electrodes. The breakdown layer has a non-uniform thickness, which serves to bias the breakdown event toward the thinner portions of the breakdown layer. As a result, the placement, size, and number of ruptures in the breakdown layer are more consistent over a series or array of devices. The variable resistance material may be a phase-change material. The variable-thickness breakdown layer may be formed through a diffusion process by introducing a gas containing a resistivity-enhancing species to the environment of segmented variable resistance devices during fabrication. The resistivity-enhancing element penetrates the outer perimeter of the variable resistance material and diffuses toward the interior of the device. The resistivity-enhancing species increases the resistance of the interface between the variable resistance material and the electrode by interacting with the variable resistance material and/or electrode to form a resistive interfacial material. Based on the diffusional nature of the process, the concentration of the resistivity-enhancing species decreases toward the center of the device and as a result, the breakdown layer is thinner toward the center of the device.
    • 一种包括具有可变厚度的击穿层的电子装置。 该装置包括位于两个电极之间的可变电阻材料。 在可变电阻材料和其中一个电极之间夹有击穿层。 击穿层具有不均匀的厚度,其用于将击穿事件偏向击穿层的较薄部分。 因此,击穿层中的断裂位置,尺寸和数量在一系列或多个器件中更为一致。 可变电阻材料可以是相变材料。 可变厚度击穿层可以通过扩散工艺形成,通过在制造过程中将含有电阻率增强物质的气体引入分段可变电阻器件的环境中。 电阻率增强元件穿透可变电阻材料的外周,并向器件的内部扩散。 电阻率增强物质通过与可变电阻材料和/或电极相互作用来增加可变电阻材料和电极之间的界面的电阻,以形成电阻界面材料。 基于该工艺的扩散性质,电阻率增强物质的浓度朝向器件的中心减小,结果,击穿层朝向器件的中心较薄。