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    • 40. 发明专利
    • A method of manufacturing a semiconductor laser device
    • GB2358281A
    • 2001-07-18
    • GB0000519
    • 2000-01-12
    • SHARP KK
    • HEFFERNAN JONATHAN
    • H01S5/16H01S5/34
    • The method comprises growing a cap layer 20 containing a high concentration of crystallographic vacancies over a semiconductor wafer. The wafer is a semiconductor layer structure 14 that contains an active region 17 for laser oscillation. A material 15 for promoting quantum well intermixing such as SiO 2 is then deposited over selected portions of the wafer. The wafer is annealed to promote quantum well intermixing in selected portions of the active region, and is then cleaved so that the intermixed regions form non-absorbing minor facets of laser devices. The facet regions will have a greater band gap than the rest of the active region, and this will allow a higher power output before catastrophic optical damage occurs. Growing the cap layer with a high concentration of vacancies improves the efficiency of the intermixing process, and means that the annealing process can be shortened or carried out at a reduced temperature. A high concentration of vacancies in the cap layer 20 can be obtained by growing the cap layer under non-stoichiometric growth conditions.