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    • 32. 发明申请
    • Protocol Method Apparatus and System for the Interconnection of Electronic Systems
    • 电子系统互连的协议方法装置和系统
    • US20090327543A1
    • 2009-12-31
    • US12146474
    • 2008-06-26
    • Ross E. TeggatzWayne T. Chen
    • Ross E. TeggatzWayne T. Chen
    • G06F13/42
    • G06F13/385
    • Disclosed are methods, apparatus, and systems for the interconnection of electronic system apparatus having one or more different communication protocols. A preferred embodiment is disclosed in which a single physical interface and a single protocol are used for providing an efficient and scalable interconnection between a host and operably coupled subsystem apparatus connected to the MMC. In a disclosed method, a bus is provided for coupling a system host to a plurality of system components and a Multi-Management Protocol (MMP) is employed. The Multi-Management Protocol includes a plurality of subclasses, each further including component identity information and function data. The subclasses are grouped by functionality into at least two groups comprising a standard group and an extension group. In a multi-component electronic system according to the invention, an electronic protocol packet structure includes a starting frame delimiter, a length field, a target address field, a subclass identifier, an operation identifier, a data field, and a frame check field. Disclosed preferred embodiments also include protocol conversion apparatus having a Multi-Management Controller (MMC) using a host bus for transmitting and receiving data between a host and the MMC based on a Multi-Management Protocol (MMP).
    • 公开了用于具有一个或多个不同通信协议的电子系统装置的互连的方法,装置和系统。 公开了一种优选实施例,其中使用单个物理接口和单个协议来在连接到MMC的主机和可操作地耦合的子系统装置之间提供有效和可缩放的互连。 在公开的方法中,提供总线用于​​将系统主机耦合到多个系统组件,并且采用多管理协议(MMP)。 多管理协议包括多个子类,每个子类还包括组件身份信息和功能数据。 子类按功能分组成包括标准组和扩展组的至少两个组。 在根据本发明的多组分电子系统中,电子协议分组结构包括起始帧定界符,长度字段,目标地址字段,子类标识符,操作标识符,数据字段和帧校验字段。 公开的优选实施例还包括具有使用主机总线的多管理控制器(MMC)的协议转换装置,用于基于多管理协议(MMP)在主机和MMC之间发送和接收数据。
    • 39. 发明授权
    • Asymmetrical, bidirectional triggering ESD structure
    • 不对称,双向触发ESD结构
    • US5780905A
    • 1998-07-14
    • US768358
    • 1996-12-17
    • Wayne T. ChenRoss E. TeggatzJulian Z. Chen
    • Wayne T. ChenRoss E. TeggatzJulian Z. Chen
    • H01L27/02H01L23/62
    • H01L27/0262
    • An ESD protection structure which includes, preferably a single semiconductor chip, a forward SCR for coupling across a source of potential and a reverse SCR for coupling across the same source of potential which is non-symmetrical to the forward SCR. The breakdown voltage of the forward SCR is different from the breakdown voltage of the reverse SCR. Each of the SCRs has a separate triggering mechanism. None of the anode, cathode and triggering elements of the forward SCR are common to the reverse SCR. A unidirectional device, preferably a Schottky diode, is disposed in the body of semiconductor material between the forward and reverse SCRs to prevent conduction from the body of semiconductor material when the source of potential across the SCRs is reversed.
    • 一种ESD保护结构,其优选地包括单个半导体芯片,用于跨越电位源耦合的正向SCR和用于跨过与正向SCR非对称的相同电位源耦合的反向SCR。 正向SCR的击穿电压不同于反向SCR的击穿电压。 每个SCR具有单独的触发机制。 正向SCR的阳极,阴极和触发元件都不是反向SCR共有的。 单向器件(优选肖特基二极管)设置在正向和反向SCR之间的半导体材料体内,以防止当跨越SCR的电位源反向时,半导体材料的主体导电。