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    • 33. 发明授权
    • Photoresist compositions and methods for shrinking a photoresist critical dimension
    • 用于收缩光刻胶临界尺寸的光刻胶组合物和方法
    • US08394573B2
    • 2013-03-12
    • US12883442
    • 2010-09-16
    • Wu-Song HuangKuang-Jung ChenWai-Kin LiSen Liu
    • Wu-Song HuangKuang-Jung ChenWai-Kin LiSen Liu
    • G03F7/00G03F7/004G03F7/40
    • G03F7/40G03F7/0045G03F7/0397G03F7/405
    • A method for reducing a photoresist critical dimension, the method comprising depositing a photoresist film on a substrate, wherein the photoresist film includes a thermal base generator; patterning the photoresist film to form a first patterned film possessing a first critical dimension; depositing a crosslinkable film over the first patterned film; heat-activating the first patterned film, either before or after depositing the crosslinkable film, to release a base in the first patterned film and cause crosslinking in the crosslinkable film in contact with the first patterned film; and developing the crosslinkable film to remove non-crosslinked soluble portions therein to form a second patterned film possessing a reduced critical dimension compared to the first critical dimension.
    • 一种降低光致抗蚀剂临界尺寸的方法,所述方法包括在基底上沉积光致抗蚀剂膜,其中光致抗蚀剂膜包括热碱发生器; 图案化光致抗蚀剂膜以形成具有第一临界尺寸的第一图案化膜; 在第一图案化膜上沉积可交联膜; 在沉积可交联膜之前或之后热激活第一图案化膜,以释放第一图案化膜中的碱,并引起与第一图案化膜接触的可交联膜的交联; 并且显影所述可交联膜以除去其中的非交联的可溶部分以形成与第一临界尺寸相比具有降低的临界尺寸的第二图案化膜。
    • 34. 发明申请
    • PHOTORESIST COMPOSITIONS AND PROCESS FOR MULTIPLE EXPOSURES WITH MULTIPLE LAYER PHOTORESIST SYSTEMS
    • 多层次光电子系统的多光照组合物和工艺
    • US20090130590A1
    • 2009-05-21
    • US11942062
    • 2007-11-19
    • Kuang-Jung ChenWu-Song HuangWai-Kin LiPushkara R. Varanasi
    • Kuang-Jung ChenWu-Song HuangWai-Kin LiPushkara R. Varanasi
    • G03C1/73G03F7/26
    • G03F7/0048G03F7/0035G03F7/0397G03F7/40
    • A photoresist composition and methods using the photoresist composition in multiple exposure/multiple layer processes. The photoresist composition includes a polymer comprising repeat units having a hydroxyl moiety; a photoacid generator; and a solvent. The polymer when formed on a substrate is substantially insoluble to the solvent after heating to a temperature of about 150° C. or greater. One method includes forming a first photoresist layer on a substrate, patternwise exposing the first photoresist layer, forming a second non photoresist layer on the substrate and patterned first photoresist layer. Another method includes forming a first photoresist layer on a substrate, patternwise exposing the first photoresist layer, forming a second photoresist layer on the substrate and patterned first photoresist layer and patternwise exposing the second photoresist layer.
    • 光致抗蚀剂组合物和在多次曝光/多层工艺中使用光致抗蚀剂组合物的方法。 光致抗蚀剂组合物包括包含具有羟基部分的重复单元的聚合物; 光致酸发生器; 和溶剂。 形成在基材上的聚合物在加热至约150℃或更高的温度之后基本上不溶于溶剂。 一种方法包括在衬底上形成第一光致抗蚀剂层,图案地暴露第一光致抗蚀剂层,在衬底上形成第二非光致抗蚀剂层并且形成图案化的第一光致抗蚀剂层。 另一种方法包括在衬底上形成第一光致抗蚀剂层,以图形方式暴露第一光致抗蚀剂层,在衬底上形成第二光致抗蚀剂层并图案化的第一光致抗蚀剂层和图案地曝光第二光致抗蚀剂层。
    • 37. 发明授权
    • Method for reducing side lobe printing using a barrier layer
    • 使用阻挡层减少旁瓣印刷的方法
    • US08268542B2
    • 2012-09-18
    • US11949190
    • 2007-12-03
    • Kuang-Jung ChenWu-Song HuangWai-kin Li
    • Kuang-Jung ChenWu-Song HuangWai-kin Li
    • G03F7/26
    • G03F7/095
    • A method suitable for reducing side lobe printing in a photolithography process is enabled by the use of a barrier layer on top of a photoresist on a substrate. The barrier layer is absorbing at the imaging wavelength of the underlying photoresist and thus blocks the light from reaching the photoresist. A first exposure followed by a development in an aqueous base solution selectively removes a portion of the barrier layer to reveal a section of the underlying photoresist layer. At least a portion of the revealed section of the photoresist layer is then exposed and developed to form a patterned structure in the photoresist layer. The barrier layer can also be bleachable upon exposure and bake in the present invention.
    • 通过在基板上的光致抗蚀剂的顶部上使用阻挡层,能够实现在光刻工艺中减少旁瓣印刷的方法。 阻挡层在下面的光致抗蚀剂的成像波长处吸收,从而阻挡光到达光致抗蚀剂。 第一曝光随后在碱性水溶液中显影,选择性地除去阻挡层的一部分以露出下面的光致抗蚀剂层的一部分。 然后将光致抗蚀剂层的显露部分的至少一部分曝光和显影以在光致抗蚀剂层中形成图案化结构。 在本发明中曝光和烘烤时,阻挡层也可以是可漂白的。