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31. 发明授权

US07673386B2 Flip-chip component production method 有权
标题翻译：倒装芯片组件生产方法
公开(公告)号：US07673386B2
公开(公告)日：2010-03-09
申请号：US12277927
申请日：2008-11-25
申请人： Alois Stelzl , Christian Bauer , Hans Krueger , Robert Hammedinger
发明人： Alois Stelzl , Christian Bauer , Hans Krueger , Robert Hammedinger
IPC分类号： H05K3/34 , H01L23/02
CPC分类号： H01L23/3192 , H01L23/3164 , H01L23/3185 , H01L24/10 , H01L24/81 , H01L24/97 , H01L2224/10165 , H01L2224/16057 , H01L2224/81136 , H01L2224/8114 , H01L2224/81193 , H01L2224/8121 , H01L2224/81815 , H01L2224/9202 , H01L2224/97 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01063 , H01L2924/01068 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12041 , H01L2924/1461 , H01L2924/3025 , H01L2924/351 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , H01L2224/81 , H01L2224/13099 , H01L2924/00
摘要： The electrical and mechanical connection between a component chip and a carrier substrate having electrical wiring is realized by means of bumps. A support frame that is adapted in its height to the height of the bumps is arranged between the carrier substrate and the component chip and has a planar or planarized surface, so that it contacts closely to the bottom side of the component chip. Different covers are proposed for the additional encapsulation.
摘要翻译：组件芯片和具有电线的载体基板之间的电气和机械连接通过凸块实现。在承载基板和部件芯片之间布置有高度相对于凸块的高度的支撑框架，并且具有平面或平面化的表面，使得其紧密接触到部件芯片的底侧。提出了不同的封装用于附加封装。

32. 发明授权

US07548060B2 Magnetic sensor system 失效
标题翻译：磁传感器系统
公开(公告)号：US07548060B2
公开(公告)日：2009-06-16
申请号：US10564245
申请日：2005-01-07
申请人： Ingo Herrmann , Paul Farber , Ulrich May , Christian Bauer , Birgit Vogelgesang
发明人： Ingo Herrmann , Paul Farber , Ulrich May , Christian Bauer , Birgit Vogelgesang
IPC分类号： G01R33/02 , G01R33/09
CPC分类号： G01R33/022 , G01D5/147 , G01P3/487
摘要： A magnetic sensor system (1) is provided that contains sensor elements (5, 6) that are sensitive to magnetic fields, the electrical properties of said sensor elements being modifiable according to a magnetic field that can be influenced by a mobile, passive transmitter element (8). The magnetic sensor system (1) includes two sensor elements (5, 6) in a gradiometer system, each of which is assigned to one of two permanent magnets (2, 3) having a predetermined separation. In terms of their dimensions, separation and position relative to the sensor elements (5, 6), the permanent magnets (2, 3) are located such that the offset of the output signal of the sensor elements (5, 6) is minimized in the gradiometer system.
摘要翻译：提供了一种磁传感器系统（1），其包含对磁场敏感的传感器元件（5,6），所述传感器元件的电性能可根据可被移动的被动发射器元件（8）。磁传感器系统（1）包括在梯度计系统中的两个传感器元件（5,6），每个传感器元件分配给具有预定间隔的两个永磁体（2,3）中的一个。在它们的尺寸，相对于传感器元件（5,6）的分离和位置方面，定位永磁体（2,3），使得传感器元件（5,6）的输出信号的偏移被最小化梯度计系统。

33. 发明申请

US20090071710A1 Flip-Chip Component and Method for its Production 有权
标题翻译：倒装芯片组件及其生产方法
公开(公告)号：US20090071710A1
公开(公告)日：2009-03-19
申请号：US12277927
申请日：2008-11-25
申请人： Alois Stelzl , Christian Bauer , Hans Krueger , Robert Hammedinger
发明人： Alois Stelzl , Christian Bauer , Hans Krueger , Robert Hammedinger
IPC分类号： H05K5/06 , H01L21/50
CPC分类号： H01L23/3192 , H01L23/3164 , H01L23/3185 , H01L24/10 , H01L24/81 , H01L24/97 , H01L2224/10165 , H01L2224/16057 , H01L2224/81136 , H01L2224/8114 , H01L2224/81193 , H01L2224/8121 , H01L2224/81815 , H01L2224/9202 , H01L2224/97 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01063 , H01L2924/01068 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12041 , H01L2924/1461 , H01L2924/3025 , H01L2924/351 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , H01L2224/81 , H01L2224/13099 , H01L2924/00
摘要： The electrical and mechanical connection between a component chip and a carrier substrate having electrical wiring is realized by means of bumps. A support frame that is adapted in its height to the height of the bumps is arranged between the carrier substrate and the component chip and has a planar or planarized surface, so that it contacts closely to the bottom side of the component chip. Different covers are proposed for the additional encapsulation.
摘要翻译：组件芯片和具有电线的载体基板之间的电气和机械连接通过凸块实现。在承载基板和部件芯片之间布置有高度相对于凸块的高度的支撑框架，并且具有平面或平面化的表面，使得其紧密接触到部件芯片的底侧。提出了不同的封装用于附加封装。

34. 发明申请

US20080116884A1 Magnet Sensor Arrangement 失效
标题翻译：磁体传感器布置
公开(公告)号：US20080116884A1
公开(公告)日：2008-05-22
申请号：US10588678
申请日：2005-01-18
申请人： Rasmus Rettig , Christian Bauer , Birgit Vogelgesang
发明人： Rasmus Rettig , Christian Bauer , Birgit Vogelgesang
IPC分类号： G01B7/14
CPC分类号： G01D5/147
摘要： A magnetic sensor arrangement (1), having magnetically sensitive sensor elements (7, 8) whose electrical properties are changeable as a function of a magnetic field that a moving, passive transmitter element (11) is able to influence. The magnetic sensor arrangement (1) has two sensor elements (7, 8) in a gradiometer arrangement that are each respectively associated with one of two magnetic regions (4, 5) of a permanent magnet embodied in the form of a gap magnet (2; 20; 23), which regions are spaced apart from each other by a predetermined distance (sa). The regions (4, 5) and the gap magnet (2; 20; 23)—in terms of the for example wedge-shaped embodiment, the dimensions (h, b, t), the gap width (sa), the gap depth (st), and their positions in relation to the sensor elements (7, 8)—are situated so as to minimize the offset of the output signal of the sensor elements (7, 8) in the gradiometer arrangement.
摘要翻译：一种磁传感器装置（1），其具有磁敏感传感器元件（7,8），其电性能可随着移动的无源发射器元件（11）能够影响的磁场而变化。磁传感器装置（1）具有梯度计装置中的两个传感器元件（7,8），每个传感器元件分别与以间隙磁体（2）形式实现的永磁体的两个磁区（4,5）中的一个相关联 ; 20; 23），哪些区域彼此隔开预定距离（sa）。根据例如楔形实施例的区域（4,5）和间隙磁体（2; 20; 23）的尺寸（h，b，t），间隙宽度（sa），间隙深度（st），并且它们相对于传感器元件（7,8）的位置设置为使得在梯度计装置中的传感器元件（7,8）的输出信号的偏移最小化。

35. 发明申请

US20070290678A1 Magnetic Sensor System 失效
标题翻译：磁传感器系统
公开(公告)号：US20070290678A1
公开(公告)日：2007-12-20
申请号：US10564245
申请日：2005-01-07
申请人： Ingo Herrmann , Paul Farber , Ulrich May , Christian Bauer , Birgit Vogelgesang
发明人： Ingo Herrmann , Paul Farber , Ulrich May , Christian Bauer , Birgit Vogelgesang
IPC分类号： G01B7/30 , G01R33/022 , G01R33/09
CPC分类号： G01R33/022 , G01D5/147 , G01P3/487
摘要： A magnetic sensor system (1) is provided that contains sensor elements (5, 6) that are sensitive to magnetic fields, the electrical properties of said sensor elements being modifiable according to a magnetic field that can be influenced by a mobile, passive transmitter element (8). The magnetic sensor system (1) includes two sensor elements (5, 6) in a gradiometer system, each of which is assigned to one of two permanent magnets (2, 3) having a predetermined separation. In terms of their dimensions, separation and position relative to the sensor elements (5, 6), the permanent magnets (2, 3) are located such that the offset of the output signal of the sensor elements (5, 6) is minimized in the gradiometer system.
摘要翻译：提供了一种磁传感器系统（1），其包含对磁场敏感的传感器元件（5,6），所述传感器元件的电性能可根据可被移动的被动发射器元件（8）。磁传感器系统（1）包括在梯度计系统中的两个传感器元件（5,6），每个传感器元件分配给具有预定间隔的两个永磁体（2,3）中的一个。在它们的尺寸，相对于传感器元件（5,6）的分离和位置方面，定位永磁体（2,3），使得传感器元件（5,6）的输出信号的偏移被最小化梯度计系统。

36. 发明授权

US07231303B2 Vibration sensor and method for monitoring the condition of rotating components and bearings 有权
标题翻译：振动传感器和方法，用于监测旋转部件和轴承的状态
公开(公告)号：US07231303B2
公开(公告)日：2007-06-12
申请号：US10511032
申请日：2003-04-14
申请人： Erich Griessler , Peter Herberholz , Benno Kathan , Thomas May , Christian Bauer , Michael Danitschek
发明人： Erich Griessler , Peter Herberholz , Benno Kathan , Thomas May , Christian Bauer , Michael Danitschek
IPC分类号： G06F11/30 , G06F19/00
CPC分类号： G01M13/045
摘要： A vibration sensor (1) for monitoring the state of rotating components or bearings, includes a housing (2), a sensor element (3), evaluation electronics (4), and at least one interface (5, 6). With the vibration sensor (1), reliable monitoring of the state of rotating components and bearings can be done easily and economically, and in addition the vibration sensor can be easily operated. The evaluation electronics (4) has an analog-to-digital converter (7), and a signal conditioning device (8) having a plurality of signals, which have been acquired by the sensor element (3), and which are converted into a state value using signal analysis and a diagnosis algorithm.
摘要翻译：用于监测旋转部件或轴承的状态的振动传感器（1）包括壳体（2），传感器元件（3），评估电子部件（4）和至少一个接口（5,6）。利用振动传感器（1），可以方便，经济地对旋转部件和轴承的状态进行可靠的监控，另外还可以方便地进行振动传感器的操作。评估电子装置（4）具有模拟数字转换器（7）和信号调节装置（8），其具有由传感器元件（3）获取的多个信号，并被转换为状态值使用信号分析和诊断算法。

37. 发明授权

US09382110B2 Component and method for producing a component 有权
标题翻译：用于制造组件的组件和方法
公开(公告)号：US09382110B2
公开(公告)日：2016-07-05
申请号：US13818916
申请日：2011-07-29
申请人： Christian Bauer , Hans Krueger , Juergen Portmann , Alois Stelzl
发明人： Christian Bauer , Hans Krueger , Juergen Portmann , Alois Stelzl
IPC分类号： H01L21/00 , B81B7/00 , B81C1/00
CPC分类号： B81B7/0077 , B81B2207/093 , B81C1/00269 , B81C1/00333 , B81C2203/0109 , B81C2203/0118 , H01L2224/16225 , H01L2224/8114 , H01L2924/1461 , H01L2924/00
摘要： A component includes a substrate, a chip and a frame. The frame is bonded to the substrate and the chip rests on the frame. A sealing layer on parts of the frame and the chip is designed to hermetically seal a volume enclosed by the substrate, the chip and the metal frame.
摘要翻译：部件包括基板，芯片和框架。框架结合到基板，芯片搁置在框架上。框架和芯片的部件上的密封层被设计成密封由衬底，芯片和金属框架包围的体积。

38. 发明授权

US08404516B2 Method for producing a MEMS package 有权
标题翻译： MEMS封装的制造方法
公开(公告)号：US08404516B2
公开(公告)日：2013-03-26
申请号：US12627707
申请日：2009-11-30
申请人： Christian Bauer , Gregor Feiertag , Hans Krueger , Alois Stelzl
发明人： Christian Bauer , Gregor Feiertag , Hans Krueger , Alois Stelzl
IPC分类号： H01L21/00
CPC分类号： B81C1/00269 , B81B7/0058 , B81C2203/0136 , B81C2203/019 , H01L24/14 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/1461 , H01L2924/15787 , H01L2924/3025 , H01L2924/351 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A carrier substrate has a mounting location with a number of electrical connection pads on a top side and external contacts connected thereto on an underside. A metal frame encloses the connection pads of the mounting location. A MEMS chip has electrical contacts on an underside. The MEMS chip is placed on the mounting location of the carrier substrate in such a way that the MEMS chip is seated with an edge region of its underside on the metal frame. Using a flip-chip process, the electrical contacts of the MEMS chip are connected to the connection pads of the carrier substrate by means of bumps the metal frame is connected to the MEMS chip such that a closed cavity is formed between MEMS chip and carrier substrate.
摘要翻译：载体基板具有安装位置，在顶侧具有多个电连接焊盘，并且在下侧上与其连接的外部触点。金属框架包围安装位置的连接垫。 MEMS芯片在下侧具有电触点。 MEMS芯片以这样的方式被放置在载体基板的安装位置上，使得MEMS芯片在金属框架上的下侧的边缘区域被安置。使用倒装芯片工艺，MEMS芯片的电触点通过凸块连接到载体衬底的连接焊盘，金属框架连接到MEMS芯片，使得在MEMS芯片和载体衬底之间形成闭合腔。

39. 发明授权

US07927020B2 Decoupling device for mounting a shaft on a base and radial ondular washer 有权
标题翻译：用于将轴安装在基座和径向垫圈上的去耦装置
公开(公告)号：US07927020B2
公开(公告)日：2011-04-19
申请号：US12316319
申请日：2008-12-11
申请人： Hartmut Faust , Oswald Friedmann , André Linnenbrügger , Ronald Glas , Christian Bauer , Hans-Walter Wodtke
发明人： Hartmut Faust , Oswald Friedmann , André Linnenbrügger , Ronald Glas , Christian Bauer , Hans-Walter Wodtke
IPC分类号： F16C27/00 , F16C27/04
CPC分类号： F16C27/066 , F16C19/06 , F16C27/04 , F16C35/077 , F16C2361/63 , F16C2361/65
摘要： A decoupling device for the bearing arrangement of a shaft carried in a housing, in particular a shaft of a belt-driven conical-pulley transmission with a chain that functions as the belt. The decoupling device includes an outer bearing ring configured with a circularly cylindrical outer surface and within which the shaft is mounted, and an inner surface of a housing that encloses the bearing ring outer surface. At least one radial ondular washer is arranged between the bearing ring outer surface and the housing inner surface, which allows a limited relative radial movement between the housing inner surface and the bearing ring outer surface by elastic deformation of the washer.
摘要翻译：用于承载在壳体中的轴的轴承装置的去耦装置，特别是具有用作带的链条的带驱动的锥形 - 带轮传动装置的轴。解耦装置包括构造为具有圆柱形外表面并且轴安装在其中的外轴承环，以及包围轴承环外表面的壳体的内表面。在轴承环外表面和壳体内表面之间布置有至少一个径向垫圈，这允许通过垫圈的弹性变形在壳体内表面和轴承环外表面之间进行有限的相对径向运动。

40. 发明授权

US07658350B2 Retaining member 有权
标题翻译：保留成员
公开(公告)号：US07658350B2
公开(公告)日：2010-02-09
申请号：US10767745
申请日：2004-01-30
申请人： Christian Bauer
发明人： Christian Bauer
IPC分类号： F16L3/08
CPC分类号： F16L55/035 , F16L3/223 , Y10T24/44026 , Y10T24/4465
摘要： A retaining member for holding and supporting an elongated element from a support includes a base portion and a holding portion. The base portion is attachable to the support. The holding portion is connected to the base portion and has a recess for holding the elongated element therein. The recess includes a tubular portion and a plurality of spaced ribs extending radially inwardly from the tubular portion to have different radial heights.
摘要翻译：用于从支撑件保持和支撑细长元件的保持构件包括基部和保持部。基座部分可附接到支撑件。保持部分连接到基部并且具有用于将细长元件保持在其中的凹部。凹部包括管状部分和从管状部分径向向内延伸以具有不同径向高度的多个隔开的肋。

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