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31. 发明申请

US20060121256A1 Method of fabricating printed circuit board having thin core layer 失效
标题翻译：制造具有薄芯层的印刷电路板的方法
公开(公告)号：US20060121256A1
公开(公告)日：2006-06-08
申请号：US11086642
申请日：2005-03-22
申请人： Chong Kim , Dong Kim , Hyo Lee , Young Shin
发明人： Chong Kim , Dong Kim , Hyo Lee , Young Shin
IPC分类号： B32B3/00 , B32B37/00
CPC分类号： H05K3/4682 , H05K3/0097 , H05K3/205 , H05K3/28 , H05K2201/0355 , H05K2203/054 , H05K2203/1536 , Y10T29/49126 , Y10T29/49156 , Y10T29/49163 , Y10T29/49165 , Y10T428/24917 , Y10T428/24926
摘要： Disclosed is a printed circuit board (PCB) having a thin core layer and a method of fabricating the same. In the method, a substrate, where a copper foil is formed on a release film and a prepreg, is employed as a base substrate and a core insulating layer is removed after the fabrication of the PCB, thereby reducing the thickness of the final product.
摘要翻译：公开了具有薄芯层的印刷电路板（PCB）及其制造方法。在该方法中，在剥离膜和预浸料坯上形成铜箔的基板被用作基底基板，并且在PCB的制造之后去除芯绝缘层，从而减小最终产品的厚度。

32. 发明申请

US20050174166A1 Method for tuning a corner frequency of a low pass filter 有权
公开(公告)号：US20050174166A1
公开(公告)日：2005-08-11
申请号：US11104496
申请日：2005-04-13
申请人： Ralph Duncan , Chun-Ying Chen , Young Shin
发明人： Ralph Duncan , Chun-Ying Chen , Young Shin
IPC分类号： H04H20/00 , H03D3/00 , H03D7/14 , H03H11/04 , H03B1/00
CPC分类号： H03H11/04 , H03D3/008 , H03D7/1441 , H03D7/1458 , H03D7/1483 , H03D7/165 , H03D2200/0025 , H03D2200/0043 , H03D2200/0047 , H04B1/30
摘要： An integrated circuit formed on a semiconductor chip, comprising a low pass filter circuit having a first resistor of a first resistance value and a capacitor of a first capacitance value, wherein the first resistance value and the first capacitance value determine a corner frequency of the filter; and a tuning circuit having a second resistor of a second resistance value, a switched-capacitor of a third resistance value and a comparator that compares two voltage signals to produce a control signal, wherein the control signal adjusts the first and second resistance values as a function of the third resistance value. The corner frequency of the filter can be adjusted by varying one or more reference voltage signals. In combination, the corner frequency of the filter is adjusted by changing the frequency of a clock that controls the switched-capacitor to decrease the circuit sensitivity.

33. 发明授权

US09614575B2 Direct coupled radio frequency (RF) transceiver front end 有权
公开(公告)号：US09614575B2
公开(公告)日：2017-04-04
申请号：US12385915
申请日：2009-04-23
申请人： Ramon Gomez , Giuseppe Cusmai , Jianhong Xiao , Takayuki Hayashi , Young Shin
发明人： Ramon Gomez , Giuseppe Cusmai , Jianhong Xiao , Takayuki Hayashi , Young Shin
IPC分类号： H04B1/58 , H03F1/02 , H03F3/195 , H03F3/21 , H03F3/24 , H03F3/45 , H03F3/72
CPC分类号： H04B1/58 , H03F1/0277 , H03F3/195 , H03F3/211 , H03F3/245 , H03F3/4508 , H03F3/45085 , H03F3/45475 , H03F3/72 , H03F2200/09 , H03F2200/222 , H03F2200/27 , H03F2200/387 , H03F2200/411 , H03F2200/423 , H03F2200/451 , H03F2200/541 , H03F2203/21106 , H03F2203/21142 , H03F2203/21191 , H03F2203/21196 , H03F2203/45136 , H03F2203/45138 , H03F2203/45352 , H03F2203/45702 , H03F2203/7203 , H03F2203/7206 , H03F2203/7236
摘要： A method and apparatus is disclosed to couple a transmission amplifier and a reception amplifier to a shared medium. An output of the transmission amplifier is directly coupled to an input of the reception amplifier to form a common connection. The transmission amplifier and the reception amplifier may receive a first amplifier bias via the common connection. In response to the first amplifier bias, the transmission amplifier provides a first communication signal to the shared medium and the reception amplifier does not provide a second communication signal from the shared medium. Alternatively, the transmission amplifier and the reception may receive a second amplifier bias via the common connection. In response to the second amplifier bias, the reception amplifier provides the second communication signal from the shared medium and the transmission amplifier does not provide the first communication signal to the shared medium.

34. 发明申请

US20070069360A1 Semiconductor package substrate having different thicknesses between wire bonding pad and ball pad and method for fabricating the same 有权
标题翻译：导线焊盘与球垫之间的厚度不同的半导体封装基板及其制造方法
公开(公告)号：US20070069360A1
公开(公告)日：2007-03-29
申请号：US11495649
申请日：2006-07-31
申请人： Kyoung Yoon , Young Shin , Yoon Kim , Tae Lee
发明人： Kyoung Yoon , Young Shin , Yoon Kim , Tae Lee
IPC分类号： H01L23/48
CPC分类号： H01L23/49838 , H01L21/4846 , H01L23/49816 , H01L2924/0002 , H05K1/0265 , H05K3/06 , H05K3/243 , H05K3/28 , H05K3/427 , H05K2201/0352 , H05K2201/09736 , H05K2203/0369 , H01L2924/00
摘要： Disclosed herein are a semiconductor package substrate and a method for fabricating the same. In the semiconductor package substrate, the circuit layer of the wire bonding pad side differs in thickness from that of the ball pad side to which a half etching process is applied. In addition, a connection through hole is constructed to provide an electrical connection between the plating lead lines on the wire bonding pad side and the ball pad side, thereby preventing electrical disconnection when the plating lead line of the wire bonding pad side is cut.
摘要翻译：本文公开了一种半导体封装基板及其制造方法。在半导体封装基板中，引线接合焊盘侧的电路层的厚度与施加半蚀刻工序的焊盘侧的厚度不同。此外，连接通孔被构造成在引线接合焊盘侧的电镀引线和焊盘侧之间提供电连接，从而防止当焊线焊盘侧的电镀引线被切断时的断电。

35. 发明申请

US20070060147A1 Apparatus for transmitting data packets between wireless sensor networks over internet, wireless sensor network domain name server, and data packet transmission method using the same 审中-公开
标题翻译：用于通过因特网在无线传感器网络之间传输数据分组的装置，无线传感器网络域名服务器和使用其的数据分组传输方法
公开(公告)号：US20070060147A1
公开(公告)日：2007-03-15
申请号：US11491823
申请日：2006-07-24
申请人： Young Shin , Hee Choi , Il Park , Seung Park
发明人： Young Shin , Hee Choi , Il Park , Seung Park
IPC分类号： H04Q7/20
CPC分类号： H04W4/18 , H04W24/00 , H04W74/00 , H04W92/00
摘要： Provided are an apparatus for transmitting data packets between wireless sensor networks over the Internet, a wireless sensor network domain name server, and a data packet transmission method using the same. The data packet transmission apparatus includes: a radio frequency (RF) interface; an ethernet interface; and a network processor connected between the RF interface and the ethernet interface for converting a data packet input/output between a wireless sensor network and the Internet and sending the converted data packet through a corresponding interface. By sending a desired data packet using an Internet communication tunnel over the Internet, the data packet transmission apparatus, wireless sensor network domain name server, and data packet transmission method allow a user to access a wireless sensor network over the Internet anytime and anywhere, interwork directly with the Internet rather than through another server, and perform remote monitoring and control operations.
摘要翻译：提供了一种用于通过因特网在无线传感器网络之间发送数据分组的装置，无线传感器网络域名服务器和使用该数据分组的数据分组传输方法。数据分组发送装置包括：射频（RF）接口; 以太网接口; 连接在RF接口和以太网接口之间的网络处理器，用于转换无线传感器网络和因特网之间的数据分组输入/输出，并通过对应的接口发送转换的数据分组。通过使用因特网通信隧道通过因特网发送期望的数据分组，数据分组传输装置，无线传感器网络域名服务器和数据分组传输方法允许用户随时随地通过因特网访问无线传感器网络，互通直接与互联网而不是通过其他服务器，并执行远程监控和控制操作。

36. 发明申请

US20060145345A1 BGA package substrate and method of fabricating same 失效
标题翻译： BGA封装基板及其制造方法
公开(公告)号：US20060145345A1
公开(公告)日：2006-07-06
申请号：US11086625
申请日：2005-03-22
申请人： Jae Choi , Young Shin
发明人： Jae Choi , Young Shin
IPC分类号： H01L23/34
CPC分类号： H01L23/49827 , H01L21/4857 , H01L21/486 , H01L23/49816 , H01L23/49822 , H01L23/49833 , H01L24/48 , H01L24/73 , H01L2224/0401 , H01L2224/05644 , H01L2224/05647 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/484 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/15311 , H01L2924/19043 , H05K1/113 , H05K3/4614 , H05K3/4623 , H05K2201/0394 , H05K2201/09509 , H05K2201/09527 , H05K2201/10378 , H01L2224/45099 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： Disclosed is a ball grid array (BGA) package substrate, in which a wire bonding pad and a solder ball pad are formed on a via hole, making high freedom in design of a circuit pattern and a high density circuit pattern possible, and a method of fabricating the same.
摘要翻译：公开了一种球栅阵列（BGA）封装基板，其中引线接合焊盘和焊球焊盘形成在通孔上，使电路图案的设计和高密度电路图案具有高自由度，以及方法的制造。

37. 发明申请

US20060092102A1 Method of driving plasma display panel 失效
公开(公告)号：US20060092102A1
公开(公告)日：2006-05-04
申请号：US11266193
申请日：2005-11-04
申请人： Jae Lee , Young Shin , Eun Lee , Sung Ahn
发明人： Jae Lee , Young Shin , Eun Lee , Sung Ahn
IPC分类号： G09G3/28
CPC分类号： G09G3/2986 , G09G3/2022 , G09G3/2942 , G09G2310/0218
摘要： A method of driving a plasma display panel that is adaptive for improving brightness and efficiency. In the method, a sustaining pulse for sustaining a discharge of a cell selected in a sustaining interval is alternately applied to each of a sustaining electrode pair. A pulse signal synchronized with the sustaining pulse is applied to a data electrode to cause a discharge for inducing a long-path discharge between the sustaining electrode pair between any one of the sustaining electrode pair and the data electrode.

38. 发明申请

US20050106814A1 Method of manufacturing NAND flash device 失效
标题翻译：制造NAND闪存器件的方法
公开(公告)号：US20050106814A1
公开(公告)日：2005-05-19
申请号：US10887964
申请日：2004-07-09
申请人： Young Shin
发明人： Young Shin
IPC分类号： H01L21/8247 , H01L21/265 , H01L21/28 , H01L21/324 , H01L21/336 , H01L27/115 , H01L29/788 , H01L29/792
CPC分类号： H01L27/11517 , H01L21/28273 , H01L21/324
摘要： The present invention discloses a method of manufacturing a NAND flash device which can improve uniformity of disturb fail characteristics by performing an annealing process after an ion implantation process for forming a P well, reduce a fail bit count by performing an annealing process after an ion implantation process for controlling a threshold voltage and before a process for forming a high voltage gate oxide film, and prevent disturb fail by omitting an STI ion implantation process in a cell region.
摘要翻译：本发明公开了一种制造NAND闪存器件的方法，其可以通过在用于形成P阱的离子注入工艺之后执行退火处理来改善干扰失效特性的均匀性，通过在离子注入之后执行退火处理来减少失效比特数用于控制阈值电压的处理和用于形成高电压栅极氧化膜的处理之前，以及通过省略细胞区域中的STI离子注入工艺来防止干扰失败。

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