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    • 31. 发明申请
    • GAS SENSOR
    • 气体传感器
    • US20090071231A1
    • 2009-03-19
    • US12208473
    • 2008-09-11
    • Yoshiyasu FujiiHisaharu NishioTakayoshi AtsumiNaoki Yamada
    • Yoshiyasu FujiiHisaharu NishioTakayoshi AtsumiNaoki Yamada
    • G01N7/00
    • G01N27/4077
    • A gas sensor has a sensor element, extending axially, that detects a particular gas component in a gas under measurement, a metal housing causing the end of the sensor element to protrude farther than the end thereof to expose it to the gas under measurement and that surrounds the periphery of the sensor element and an outer tube disposed at the rear end inside the metal housing and a seal member that is disposed farther to the rear than the detection element and also inside the rear end of the outer tube, and that has formed therein a atmosphere-introduction hole passing therethrough in the axial direction, the gas sensor further having a crimped part, formed in the outer tube, for the purpose of holding the seal member a hollow-cylindrical member in contact with the inner peripheral surface of the atmosphere-introduction hole so as to oppose the crimped part, and a metal filter that joins to the hollow-cylindrical member at the rear end of the hollow-cylindrical member and also farther to the rear than the crimped part.
    • 气体传感器具有轴向延伸的传感器元件,其检测待测气体中的特定气体成分,金属壳体,使得传感器元件的端部比其末端更远地露出,以将其暴露于被测气体,并且 围绕传感器元件的周边和设置在金属壳体内的后端的外管和设置在比检测元件更靠后的位置并且还设置在外管的后端内的密封构件,并且形成 其中沿轴向通过的气氛导入孔,气体传感器还具有形成在外管中的压接部,用于将密封构件保持在与中空圆筒构件的内周面接触的位置 大气引入孔以与卷曲部分相对的金属过滤器,以及连接到中空圆柱形构件的后端处的中空圆柱形构件的金属过滤器,以及farth 呃到后面比卷曲部分。
    • 33. 发明申请
    • LASER PROCESSING DEVICE, LASER PROCESSING HEAD AND LASER PROCESSING METHOD
    • 激光加工装置,激光加工头和激光加工方法
    • US20080210675A1
    • 2008-09-04
    • US11933719
    • 2007-11-01
    • Yoshinari SasakiKosei AsoHidehisa MuraseNaoki Yamada
    • Yoshinari SasakiKosei AsoHidehisa MuraseNaoki Yamada
    • B23K26/00
    • B23K26/16B23K26/142B23K26/1476
    • Disclosed is a laser processing device. The laser processing device includes a laser beam source irradiating a laser beam, and a laser processing head. The laser processing head includes a transmitting window through which the laser beam passes, an aperture formed in a bottom of the laser head and allowing the laser beam to pass through via the transmitting window, an introducing hole introducing a gas into the laser processing head, and an exhausting hole discharging a gas in the laser processing head to outside. The laser processing head further includes a air hole introducing the gas to the periphery of the laser irradiating area, an air hole allowing to discharge the ambient gas of the laser irradiating area, and a masking shield having an opening placed between the transmitting window and the aperture, and an aerating portion communicated with the introducing hole and exhausting hole.
    • 公开了一种激光加工装置。 激光加工装置包括照射激光束的激光束源和激光加工头。 激光加工头包括激光束通过的透射窗口,形成在激光头的底部中的孔,并允许激光束经由透射窗口通过,将气体引入激光加工头中的引入孔, 以及将激光加工头中的气体排出到外部的排气孔。 激光加工头还包括将气体引入激光照射区域的周边的空气孔,允许对激光照射区域的环境气体进行放电的空气孔,以及设置在发送窗口和 孔,以及与导入孔和排气孔连通的通气部。
    • 37. 发明申请
    • Process and Apparatus for Ablation
    • 消融过程和装置
    • US20080041832A1
    • 2008-02-21
    • US11628911
    • 2005-06-13
    • Neil SykesYoshinari SasakiHidehisa MuraseNaoki YamadaKousei Aso
    • Neil SykesYoshinari SasakiHidehisa MuraseNaoki YamadaKousei Aso
    • B23K26/36B23K26/16
    • B23K26/142B23K26/12B23K26/127B23K26/146
    • The invention firstly comprises a method of ablation processing including a step of ablating a region of a substrate (1) by way of a laser beam (3) characterised by a further step of removing debris ablated from the region (1) by way of a flow of a fluid (7), namely a gas or vapour, a liquid or a combination of these, wherein the flow of fluid (7) is directed to flow over the region so as to entrap debris and thereafter to remove the entrapped debris from the region by directing the flow of fluid with any entrapped debris away from region along a predetermined path (6) avoiding subsequent deposition of entrapped debris on the substrate. The invention further comprises apparatus enabling a laser to ablate a region of a substrate characterised by a partially closed debris extraction module (‘DEM’) (4) located between a focusing or imaging lens (2) for a laser beam (3) and a region of a substrate (1), the DEM (4) having input (8) and output (6) ports by way of which a flow of a fluid (namely a gas or vapour, a liquid or a combination of these) is caused to flow over the region (1) so as to entrap debris ablated from the region and thereafter to remove the entrapped debris from the region by providing for the flow of fluid with entrapped debris to pass away from region along a predetermined path to prevent subsequent deposition of entrapped debris on the substrate.
    • 本发明首先包括一种消融处理方法,其包括通过激光束(3)烧蚀衬底(1)的区域的步骤,其特征在于,通过另一步骤,通过以下步骤除去从区域(1)中烧蚀的碎片: 流体(7)的流动,即气体或蒸汽,液体或这些的组合,其中流体(7)的流动被引导以流过该区域,以便截留碎片,并且此后将包裹的碎屑从 该区域通过沿着预定路径(6)引导具有任何夹带的碎屑的流体流动区域,避免随后将包埋的碎屑沉积在基底上。 本发明还包括使得激光器能够消融基板的区域的装置,其特征在于位于用于激光束(3)的聚焦或成像透镜(2)之间的部分封闭的碎屑提取模块('DEM')(4) 基板(1)的区域,具有输入端(8)和输出端(6)的DEM(4)端口,通过该端口流动(即气体或蒸汽,液体或这些的组合) 以流过区域(1)以便捕获从区域中烧蚀的碎屑,然后通过提供具有截留碎屑的流体流动沿着预定路径离开区域从而从该区域去除夹带的碎屑,以防止随后的沉积 的残留碎片在基底上。
    • 39. 发明申请
    • LASER PROCESSING APPARATUS, LASER PROCESSING HEAD AND LASER PROCESSING METHOD
    • 激光加工设备,激光加工头和激光加工方法
    • US20070210045A1
    • 2007-09-13
    • US11467407
    • 2006-08-25
    • Kosei AsoYoshinari SasakiNaoki Yamada
    • Kosei AsoYoshinari SasakiNaoki Yamada
    • B23K26/00
    • B23K26/1476B23K26/123B23K26/1462B23K26/364
    • A laser processing apparatus is provided. The laser processing apparatus includes a laser processing head having a transmission window, an opening portion, an outlet hole, a first vent hole and a second vent hole. The transmission window transmits laser light by which a processing object is irradiated. The opening portion passes the transmitted laser light to a bottom portion of the laser processing head. The outlet hole discharges an atmosphere in the vicinity of a laser light irradiation region of the processing object to the outside. The first vent hole directs gas into the vicinity of the laser light irradiation region. The second vent hole discharges the atmosphere in the vicinity of the laser light irradiation region. Debris generated from the processing object is discharged from the outlet hole and the second vent hole that are continuous with the opening portion provided at the bottom portion of the laser processing head.
    • 提供了一种激光加工装置。 激光加工装置包括具有透光窗口,开口部分,出口孔,第一通气孔和第二通气孔的激光加工头。 传输窗口传输照射加工对象的激光。 开口部将透射的激光传递到激光加工头的底部。 出口孔将处理对象的激光照射区域附近的气氛排出到外部。 第一通气孔将气体引导到激光照射区域附近。 第二通气孔在激光照射区域附近排出大气。 从加工对象产生的碎屑从与设置在激光加工头的底部的开口部连续的出口孔和第二通气孔排出。