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    • 33. 发明授权
    • Manufacturing method for a thermal head
    • 热头制造方法
    • US08621888B2
    • 2014-01-07
    • US12460780
    • 2009-07-24
    • Toshimitsu MorookaKeitaro KoroishiYoshinori SatoNoriyoshi ShojiNorimitsu Sanbongi
    • Toshimitsu MorookaKeitaro KoroishiYoshinori SatoNoriyoshi ShojiNorimitsu Sanbongi
    • C03B19/00H01C17/00B41J2/335
    • B41J2/33535B41J2/33585B41J2/3359
    • In manufacturing method for a thermal head, concave portions, including a reference concave portion, are formed on a surface of a substrate so that a length of each of the concave portions other than the reference concave portion increases as a distance from the reference concave portion in a length direction increases and so that a width of each of the concave portions other than the reference concave portion increases as a distance from the reference concave portion in a width direction increases. A mark identifying the reference concave portion is formed on the surface of the substrate. An insulating film is thermally fusion bonded to the surface of the substrate including the concave portions formed thereon. Heating resistors are formed on the insulating film using a photo mask by aligning the photo mask with the substrate in accordance with the reference concave portion to form the heating resistors so as to be opposed to the plurality of concave portions.
    • 在热敏头的制造方法中,在基板的表面上形成有包括基准凹部的凹部,使得除了基准凹部以外的各个凹部的长度与基准凹部的距离增加 在长度方向上的长度方向增加,使得除了基准凹部以外的各个凹部的宽度随着宽度方向的基准凹部的距离的增加而增加。 在基板的表面上形成标识基准凹部的标记。 将绝缘膜热熔接合到包括形成在其上的凹部的基板的表面。 使用光掩模在绝缘膜上形成加热电阻器,通过根据参考凹部将光掩模与衬底对准,以形成加热电阻器,以与多个凹部相对。
    • 36. 发明授权
    • Thermal head manufacturing method, thermal head, and printer
    • 热敏头制造方法,热敏打印头和打印机
    • US08189021B2
    • 2012-05-29
    • US12589593
    • 2009-10-26
    • Toshimitsu MorookaKeitaro KoroishiYoshinori SatoNoriyoshi ShojiNorimitsu Sanbongi
    • Toshimitsu MorookaKeitaro KoroishiYoshinori SatoNoriyoshi ShojiNorimitsu Sanbongi
    • B41J2/335
    • B41J2/33585B41J2/3359Y10T29/49401
    • A thermal head manufacturing method comprises a concave portion forming step of forming a concave portion on one surface of a supporting substrate, a bonding step of bonding a thin plate glass to the one surface of the supporting substrate where the concave portion has been formed in a manner that hermetically seals the concave portion and forms a hollow portion, a heating step of heating the supporting substrate and the thin plate glass which have been bonded together in the bonding step to thereby soften the thin plate glass and expand gas trapped inside the hollow portion, and a heating resistor forming step of forming a heating resistor on the thin plate glass so as to be opposed to the hollow portion. During the heating step, the thin glass plate undergoes plastic deformation, due to expansion of the gas inside the hollow portion, and rises toward an opposite side from the hollow portion, and a leveling step is carried out to level the outer surface of the plastically deformed thin glass plate.
    • 热敏打印头的制造方法包括在支撑基板的一个面上形成凹部的凹部形成工序,将薄板玻璃与形成有凹部的支撑基板的一个面接合的接合工序 密封凹部并形成中空部的方式,在接合工序中加热支撑基板和薄板玻璃的加热工序,从而使薄板玻璃软化,将中空部内的气体膨胀 以及在薄板玻璃上形成加热电阻器以与中空部分相对的加热电阻器形成步骤。 在加热步骤期间,由于中空部分内部的气体膨胀,薄玻璃板发生塑性变形,并且朝向与中空部分相反的一侧上升,并且进行调平步骤以使塑性的外表面平坦化 变形薄玻璃板。
    • 40. 发明申请
    • Thermal head manufacturing method
    • 热敏头制造方法
    • US20100140215A1
    • 2010-06-10
    • US12592866
    • 2009-12-03
    • Norimitsu SanbongiToshimitsu MorookaKeitaro KokoishiNoriyoshi ShojiYoshinori Sato
    • Norimitsu SanbongiToshimitsu MorookaKeitaro KokoishiNoriyoshi ShojiYoshinori Sato
    • C23F1/00
    • B41J2/33585B41J2/3359
    • To keep printing quality uniform and to improve productivity, while maintaining a heating efficiency and a strength against an external load, provided is a thermal head manufacturing method including: a concave portion forming step of forming a concave portion on one face of a supporting substrate; an upper substrate forming step of forming an upper substrate in which an etching layer and a non-etching layer are arranged in layers in a substrate thickness direction, the etching layer being etched at a predetermined etching rate, the non-etching layer being lower in etching rate than the etching layer; a bonding step of bonding the one face of the supporting substrate in which the concave portion has been formed in the concave portion forming step to a surface on a side of the non-etching layer of the upper substrate; a thinning step of etching the etching layer of the upper substrate which has been bonded to the supporting substrate in the bonding step; and a heating resistor forming step of forming a heating resistor across from the concave portion of the supporting substrate on the upper substrate which has been thinned in the thinning step.
    • 为了保持印刷质量均匀并提高生产率,在保持加热效率和抵抗外部载荷的强度的同时,提供一种热敏头制造方法,包括:凹部形成步骤,在支撑基板的一个面上形成凹部; 上基板形成步骤,其形成在基板厚度方向上分层设置蚀刻层和非蚀刻层的上基板,蚀刻层以预定的蚀刻速率被蚀刻,非蚀刻层的下蚀刻层 蚀刻速率比蚀刻层高; 将在凹部形成工序中形成有凹部的支撑基板的一面与上基板的非蚀刻层侧的表面接合的接合工序; 在接合步骤中蚀刻已经结合到支撑衬底的上衬底的蚀刻层的薄化步骤; 以及加热电阻体的形成工序,在所述薄化工序中已经变薄的所述上基板上从所述支撑基板的所述凹部形成加热电阻体。