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    • 33. 发明申请
    • CHIP RESISTOR
    • 芯片电阻
    • US20140361865A1
    • 2014-12-11
    • US14369599
    • 2012-09-28
    • Hiroshi TamagawaYasuhiro Kondo
    • Hiroshi TamagawaYasuhiro Kondo
    • H01C10/50
    • H01C1/16H01C1/012H01C1/14H01C10/50H01C17/006H01C17/23H01L27/016H01L27/0207H01L28/24H05K3/3442H05K2201/10212Y02P70/613
    • [Problem] There is demand for chip resistors that are compact and that have high resistivity. [Solution] A chip resistor (100) has a substrate (11), a first connection electrode (12) and a second connection electrode (13) that are formed on the substrate (11), and a resistor network that is formed on the substrate (11) and that has ends one of which is connected to the first connection electrode (12) and the other one of which is connected to the second connection electrode (13). The resistor network is provided with a resistive circuit. The resistive circuit has a resistive element film line (103) that is provided along inner wall surfaces of trenches (101). The resistive element film line (103) extending along the inner wall surfaces of the trenches (101) is long and has a high resistivity as a unit resistive element. [Effect] The resistivity of the chip resistor (100) as a whole can be increased.
    • [问题]需要紧凑且具有高电阻率的片式电阻器。 芯片电阻器(100)具有形成在基板(11)上的基板(11),第一连接电极(12)和第二连接电极(13),以及形成在基板 基板(11),其端部中的一个连接到第一连接电极(12),另一个连接到第二连接电极(13)。 电阻网络设有电阻电路。 电阻电路具有沿着沟槽(101)的内壁面设置的电阻元件膜线(103)。 沿着沟槽(101)的内壁表面延伸的电阻元件膜线(103)长并且具有高电阻率作为单位电阻元件。 [效果]芯片电阻器(100)的整体电阻率可以提高。
    • 36. 发明授权
    • Electronic device
    • 电子设备
    • US08244122B2
    • 2012-08-14
    • US12537683
    • 2009-08-07
    • Takenori ItodaYasuhiro Kondo
    • Takenori ItodaYasuhiro Kondo
    • G03B17/02
    • G03B17/00H01M2/1022
    • The electronic device according to the present invention comprises a body having an opening part defined therein, a cover member for opening and closing the opening part of the body, a pivotally supporting mechanism for pivotally supporting a base end part of the cover member at a position adjacent to the opening part of the body, and a cam mechanism provided to opposed parts of the body and the cover member. The cam mechanism comprises a slidable contact surface and a sliding part relatively sliding on the slidable contact surface along a predetermined cam curve as the cover member is opened and closed, and the predetermined cam curve is defined about a pivot of the pivotally supporting mechanism and so as to make the cover member move in either direction of two opposite directions along the pivot of the pivotally supporting mechanism in a process of closing the cover member.
    • 根据本发明的电子设备包括具有限定在其中的开口部的主体,用于打开和关闭主体的开口部的盖构件,用于将盖构件的基端部枢转地支撑在位置的位置的枢转支撑机构 邻近主体的开口部分,以及设置在主体和盖部件的相对部分上的凸轮机构。 凸轮机构包括滑动接触表面和滑动部分,当盖构件打开和关闭时,滑动部分沿着预定的凸轮曲线在滑动接触表面上相对滑动,并且预定的凸轮曲线围绕枢转支撑机构的枢轴限定,因此 为了使盖构件在关闭盖构件的过程中沿着枢转支撑机构的枢轴在两个相反方向的任一方向上移动。
    • 38. 发明申请
    • PORTABLE ELECTRONIC DEVICE
    • 便携式电子设备
    • US20090084040A1
    • 2009-04-02
    • US12237899
    • 2008-09-25
    • Yasuhiro KondoTakahiro Kitai
    • Yasuhiro KondoTakahiro Kitai
    • E05C19/00
    • H04N5/2251H01M2/1066
    • A portable electronic device includes: a casing provided therein with a battery compartment, the battery compartment being given an opening for the installation of the battery; a cover body pivotally supported on the casing to open and close the opening; a spring part for causing the battery inside the battery compartment to be spring-biased in a direction toward the opening; a lock lever provided to the casing, the lock lever being capable of moving back and forth between a locking position entering the opening and a lock releasing position retreating from the opening, while being spring-biased in a direction from the lock releasing position to the locking position; and a pressure applying part formed on the inner surface of the cover body, the pressure applying part pressing the lock lever placed in the lock releasing position toward the locking position immediately before the cover body is completely closed.
    • 一种便携式电子设备包括:壳体,其中设置有电池室,电池室具有用于安装电池的开口; 枢转地支撑在所述壳体上以打开和关闭所述开口的盖体; 用于使电池室内的电池朝向开口的方向弹簧偏压的弹簧部分; 设置在所述壳体上的锁定杆,所述锁定杆能够在进入所述开口的锁定位置和从所述开口退回的锁定释放位置之间来回移动,同时沿着从所述锁定释放位置到所述锁定释放位置的方向被弹簧偏置 锁定位置 以及形成在所述盖体的内表面上的加压部,所述加压部将刚好在所述盖主体完全关闭之前的所述锁定解除位置的所述锁定杆按压。
    • 39. 发明申请
    • ZOOM LENS
    • 变焦镜头
    • US20090002843A1
    • 2009-01-01
    • US12163312
    • 2008-06-27
    • Yasuhiro Kondo
    • Yasuhiro Kondo
    • G02B15/16
    • G02B15/173
    • In the zoom lens, the second lens group includes at least one surface that is an aspheric surface, and during changing magnification, the second lens group, the third lens group, and the fourth lens group are respectively capable of moving independently, with the position of the aperture moving along a convex trajectory on the optical axis from the image side to the object side during changing magnification. Through operation in this manner, the zoom lens of the invention is inexpensive and compact, and efficiently corrects various types of aberration. Thus, at a high magnification ratio of 5× or greater, the zoom lens of the invention affords a wide field exceeding approximately 78 degrees at the wide angle end, and affords a high performance compact zoom lens whose distortion is held to 3% or less.
    • 在变焦透镜中,第二透镜组包括至少一个非球面的表面,并且在变化倍率期间,第二透镜组,第三透镜​​组和第四透镜组分别能够独立地移动,位置 在改变放大倍数期间,孔径沿着光轴从图像侧移动到物体侧的凸起轨迹。 通过这种方式的操作,本发明的变焦镜头便宜且紧凑,并有效地校正各种类型的像差。 因此,在5倍以上的高倍率下,本发明的变焦镜头在广角端提供超过大约78度的宽场,并且提供失真保持在3%以下的高性能小型变焦镜头。
    • 40. 发明申请
    • Semiconductor Optical Element and Manufacturing Method Thereof
    • 半导体光学元件及其制造方法
    • US20080137703A1
    • 2008-06-12
    • US10577626
    • 2005-05-26
    • Ryuzo IgaYasuhiro Kondo
    • Ryuzo IgaYasuhiro Kondo
    • H01S5/227H01L33/00
    • B82Y20/00H01S5/0265H01S5/12H01S5/2224H01S5/2226H01S5/227H01S5/2275H01S5/305H01S5/3072H01S5/3434
    • In order to provide excellent device characteristics and enhance fabrication yield and run-to-run reproducibility in a buried device structure using a low mesa on a p-type substrate, a cross sectional configuration before growth of a contact layer of a device, i.e., after growth of an over-cladding layer is flattened so as not to cause a problem in crystal quality of the contact layer. A mesa-stripe stacked body including at least a p-type cladding layer (2), an active layer (4) and an n-type cladding layer (6) is formed on a p-type semiconductor substrate (1), a current-blocking layer (8) is buried in both sides of the stacked body, and an n-type over-cladding layer (9) and an n-type contact layer (10) are disposed on the current-blocking layer (8) and the stacked body. The n-type over-cladding layer (9) is made of a semiconductor crystal having a property for flattening a concavo-convex shape of upper surfaces of the current-blocking layer (8) and the stacked body.
    • 为了在p型衬底上使用低台面的掩埋器件结构中提供优异的器件特性并提高制造成品率和运行时再现性,器件接触层生长之前的横截面形状即, 在上敷层的生长之后,使接合层的结晶品质不会产生问题。 在p型半导体衬底(1)上形成至少包括p型覆层(2),有源层(4)和n型覆层(6)的台面状叠层体,电流 阻挡层(8)埋设在层叠体的两侧,在电流阻挡层(8)上设置n型上敷层(9)和n型接触层(10), 堆叠的身体。 n型上敷层(9)由具有使电流阻挡层(8)和层叠体的上表面的凹凸形状变平的性质的半导体结晶体构成。