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31. 发明授权

US5523776A Photovoltaic array for computer display 失效
标题翻译：用于计算机显示的光伏阵列
公开(公告)号：US5523776A
公开(公告)日：1996-06-04
申请号：US370938
申请日：1995-01-10
申请人： Gareth G. Hougham , Alfred Viehbeck
发明人： Gareth G. Hougham , Alfred Viehbeck
IPC分类号： G06F1/16 , G06F1/26 , G09G3/20 , H02N6/00 , G09G5/00 , H01L31/04
CPC分类号： G09G3/20 , G06F1/1601 , G06F1/26 , H02S99/00 , G06F2200/1612 , Y10S136/291
摘要： A display is constructed having a flat screen consisting of pixels which may be individually excited to create an image. The pixels are excitable between a light reflective and a transparent state in which they are visible in the reflective state and dark in the transparent state. A solar panel is mounted behind the flat screen to receive light transmitted by the transparent pixels. The solar panel converts the light to electric power to supplement the battery operation of the device.
摘要翻译：构建了具有由像素组成的平面屏幕的显示器，该像素可被单独激发以产生图像。像素在光反射和透明状态之间是可激发的，其中它们在反射状态下是可见的，在透明状态下是暗的。太阳能电池板安装在平面屏幕后面，以接收由透明像素传输的光。太阳能电池板将光转换成电力，以补充设备的电池操作。

32. 发明授权

US06379865B1 Photoimageable, aqueous acid soluble polyimide polymers 失效
标题翻译：可光成像，含水酸溶性聚酰亚胺聚合物
公开(公告)号：US06379865B1
公开(公告)日：2002-04-30
申请号：US09547390
申请日：2000-04-11
申请人： Guoping Mao , Hany B. Eitouni , Alphonsus V. Pocius , John B. Scheibner , Nanayakkara L. D. Somasiri , Nicholas A. Stacey , Alfred Viehbeck
发明人： Guoping Mao , Hany B. Eitouni , Alphonsus V. Pocius , John B. Scheibner , Nanayakkara L. D. Somasiri , Nicholas A. Stacey , Alfred Viehbeck
IPC分类号： G03F709
CPC分类号： C08G73/1007 , C08G73/1025 , G03F7/0387 , G03F7/164 , H05K3/287 , H05K2203/135 , Y10S430/136
摘要： A photoimageable, aqueous acid soluble polyimide polymer comprising an anhydride, including a substituted benzophenone nucleus, a diamine reacted with the anhydride to form a photosensitive polymer intermediate, and at least 60 Mole % of solubilizing amine reacted with the photosensitive polymer intermediate to form the photoimageable, aqueous acid soluble polyimide polymer. An emulsion for electrophoretic deposition of a coating of a photoimageable, aqueous acid soluble polyimide polymer comprises a dispersed phase, including the photoimageable aqueous acid soluble polyimide polymer, dissolved in an organic solvent and a dispersion phase including a coalescence promoter and water. The emulsion may be applied, by electrophoretic deposition, to a conductive structure to provide a photoimageable coating on the conductive structure. After exposing the coating to a pattern of radiation for photocrosslinking exposed parts of the photoimageable aqueous acid soluble polyimide polymer, an aqueous acid developer solution removes unexposed photoimageable aqueous acid soluble polyimide polymer to reveal a crosslinked polyimide polymer image of the radiation pattern.
摘要翻译：包含酸酐的可光成像的含水酸性聚酰亚胺聚合物，包括取代的二苯甲酮核，与酸酐反应形成光敏聚合物中间体的二胺和至少60摩尔的增溶胺与感光性聚合物中间体反应形成可光成像，水溶性聚酰亚胺聚合物水溶液。用于电泳沉积可光成像的含水酸性聚酰亚胺聚合物涂层的乳液包括溶解在有机溶剂中的分散相，包括可光成像的含水溶性聚酰亚胺聚合物，以及包含聚结促进剂和水的分散相。可以通过电泳沉积将乳液施加到导电结构上，以在导电结构上提供可光成像的涂层。在将涂层暴露于辐照图案之后，将可光成像的含水溶性聚酰亚胺聚合物的曝光部分光致交联，酸性显影剂水溶液除去未曝光的可光成像的酸性水溶性聚酰亚胺聚合物，以露出辐射图案的交联聚酰亚胺聚合物图像。

33. 发明授权

US6020580A Microwave applicator having a mechanical means for tuning 失效
标题翻译：微波施加器具有用于调谐的机械装置
公开(公告)号：US6020580A
公开(公告)日：2000-02-01
申请号：US3016
申请日：1998-01-05
申请人： David Andrew Lewis , Stanley Joseph Whitehair , Alfred Viehbeck , Martin Yonnone , William V. Corso , Bernard Krieger
发明人： David Andrew Lewis , Stanley Joseph Whitehair , Alfred Viehbeck , Martin Yonnone , William V. Corso , Bernard Krieger
IPC分类号： B01J19/12 , G01N22/00 , H05B6/68 , H05B6/70 , H05B6/74 , H05B6/80
CPC分类号： H05B6/6402 , B01J19/126 , G01N22/00 , H05B6/70 , H05B6/705 , B01J2219/00191
摘要： A microwave applicator includes an elongated chamber, preferably having a cylindrical shape, for processing materials therein. A waveguide, connected to the elongated chamber, couples microwave power into the elongated chamber. The cross-sectional area of the elongated chamber can be mechanically adjusted to control and maintain the microwave field uniformity and resonant mode, preferably the length independent mode TM.sub.010, during the processing of the material. The applicator can thus provide microwave energy having a substantially uniform field distribution over a large area for processing materials, for example, a web or sheet like product, plywood and pre-impregnated cloth, in a continuous manner.
摘要翻译：微波施加器包括优选具有圆柱形形状的细长室，用于在其中处理材料。连接到细长室的波导将微波功率耦合到细长室中。在材料加工过程中，细长室的横截面面积可以机械调节，以控制和维持微波场均匀性和谐振模式，优选长度独立模式TM010。因此，施加器可以提供在大面积上具有基本均匀的场分布的微波能量，用于以连续的方式处理材料，例如幅材或片状产品，胶合板和预浸布。

34. 发明授权

US5863447A Method for providing a selective reference layer isolation technique for the production of printed circuit boards 失效
标题翻译：提供用于生产印刷电路板的选择性参考层隔离技术的方法
公开(公告)号：US5863447A
公开(公告)日：1999-01-26
申请号：US833612
申请日：1997-04-08
申请人： Paul William Coteus , Stephen Leo Tisdale , Alfred Viehbeck
发明人： Paul William Coteus , Stephen Leo Tisdale , Alfred Viehbeck
IPC分类号： H05K3/07 , H05K3/42 , H05K3/44 , B44C1/22
CPC分类号： H05K3/445 , H05K3/429 , H05K2201/09581 , H05K2201/09718 , H05K2201/09881 , H05K2203/0323 , H05K2203/1184 , H05K2203/135 , H05K2203/1438 , H05K3/07 , Y10T428/24917
摘要： This invention describes a new process for the selective isolation of through holes in the production of a multi-layer printed circuit card which allows for substantially smaller holes through reference layers to be built, leading to substantially better electrical isolation of signal traces on adjacent wiring layers, and for substantially improved current carrying capacity in the reference layers. This invention also describes a process to allow reference layers of different thickness from adjacent signal layers, even if they are part of the same `core`. Several different process flows are disclosed, leading to substantially the same structure but with varying degrees of complexity and quality of the finished product.
摘要翻译：本发明描述了一种用于在制造多层印刷电路卡中选择性隔离通孔的新方法，其允许构建通过参考层的基本上较小的孔，从而导致相邻布线层上的信号迹线的显着更好的电绝缘并且用于基准层中的大大改善的载流能力。本发明还描述了允许来自相邻信号层的不同厚度的参考层的方法，即使它们是相同“核心”的一部分。公开了几种不同的工艺流程，导致基本上相同的结构，但是具有不同程度的成品的复杂性和质量。

35. 发明授权

US5779844A Continuous lamination of electronic structures 失效
公开(公告)号：US5779844A
公开(公告)日：1998-07-14
申请号：US732648
申请日：1996-10-16
申请人： David Andrew Lewis , Alfred Viehbeck , Stanley Joseph Whitehair
发明人： David Andrew Lewis , Alfred Viehbeck , Stanley Joseph Whitehair
IPC分类号： H05B6/70 , H05B6/78 , H05K3/02 , B32B31/20
CPC分类号： H05K3/022 , B32B37/06 , H05B6/70 , H05B6/788 , B32B2309/06 , B32B2310/0862 , B32B2457/08 , Y10T156/1741
摘要： A continuous process for the fabrication of metal clad, laminated core structures, such as circuit board cores, wherein the copper layers on the laminate are used to form a waveguide which propagates microwave or RF radiation in TEM mode down the length of the structure for heating the core layers while the necessary pressure is applied. The TEM mode offers substantial advantages in the uniformity and control of processing in this environment. In particular, the system may be made tunable using the positioning or two pinch points, produced by rollers applying pressure to consolidate the layered material, which points create end chokes defining a heating and pressure region wherein the radiation is reflected. Alternatively, the metal layers may also be used as capacitor-like plates for applying RF energy across the layered material.

36. 发明授权

US5705022A Continuous lamination of electronic structures 失效
标题翻译：电子结构的连续层压
公开(公告)号：US5705022A
公开(公告)日：1998-01-06
申请号：US482209
申请日：1995-06-08
申请人： David Andrew Lewis , Alfred Viehbeck , Stanley Joseph Whitehair
发明人： David Andrew Lewis , Alfred Viehbeck , Stanley Joseph Whitehair
IPC分类号： H05B6/70 , H05B6/78 , H05K3/02 , B32B31/20
CPC分类号： H05K3/022 , B32B37/06 , H05B6/70 , H05B6/788 , B32B2309/06 , B32B2310/0862 , B32B2457/08 , Y10T156/1741
摘要： A continuous process for the fabrication of metal clad, laminated core structures, such as circuit board cores, wherein the copper layers on the laminate are used to form a waveguide which propagates microwave or RF radiation in TEM mode down the length of the structure for heating the core layers while the necessary pressure is applied. The TEM mode offers substantial advantages in the uniformity and control of processing in this environment. In particular, the system may be made tunable using the positioning or two pinch points, produced by rollers applying pressure to consolidate the layered material, which points create end chokes defining a heating and pressure region wherein the radiation is reflected. Alternatively, the metal layers may also be used as capacitor-like plates for applying RF energy across the layered material.
摘要翻译：用于制造金属包覆层压芯结构（例如电路板芯）的连续方法，其中层压体上的铜层用于形成在TEM模式下沿着加热结构的长度传播微波或RF辐射的波导核心层，同时施加必要的压力。 TEM模式在该环境中的均匀性和加工控制方面提供了显着的优点。特别地，可以使用由施加压力的辊产生的定位或两个夹点来使该系统可调谐，以固结分层材料，该点产生限定辐射被反射的加热和压力区域的端扼流圈。或者，金属层也可以用作电容器样板，用于跨层状材料施加RF能量。

37. 发明授权

US5660921A Poly (aryl ether benzimidazoles) their use capping layers in microelectronic structures 失效
标题翻译：聚（芳基醚苯并咪唑）它们在微电子结构中的使用覆盖层
公开(公告)号：US5660921A
公开(公告)日：1997-08-26
申请号：US447350
申请日：1995-05-23
申请人： Kie Yeung Ahn , James Lupton Hedrick, Jr. , Jeffrey William Labadie , Kang-Wook Lee , Robert James Twieg , Alfred Viehbeck , George Frederick Walker
发明人： Kie Yeung Ahn , James Lupton Hedrick, Jr. , Jeffrey William Labadie , Kang-Wook Lee , Robert James Twieg , Alfred Viehbeck , George Frederick Walker
IPC分类号： C08G73/18 , C08L71/00 , H01L23/29 , H01L23/31 , H01L23/498 , H01L23/532 , H05K1/00 , H05K1/03 , B32B15/00 , B32B15/08
CPC分类号： H01L23/5329 , C08G73/18 , C08L71/00 , H01L23/293 , H01L23/49894 , H01L2924/0002 , H05K1/0346 , H05K3/4676 , Y10S428/901 , Y10T29/49155 , Y10T29/49171 , Y10T428/24917 , Y10T428/31605 , Y10T428/31721
摘要： A multilevel electronic package comprising at least two levels, each level including a poly(aryl ether benzimidazole), a polymide and copper. A process of preparing this package is disclosed. Several novel poly(aryl ether benzimidazoles) useful in preparing this package are also set forth.
摘要翻译：包括至少两个级别的多级电子封装，每个级别包括聚（芳基醚苯并咪唑），聚酰亚胺和铜。公开了制备该包装的过程。还介绍了可用于制备该包装的几种新颖的聚（芳基醚苯并咪唑）。

38. 发明授权

US5569739A Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier 失效
标题翻译：多层包装中的粘合层和有机材料作为金属扩散屏障
公开(公告)号：US5569739A
公开(公告)日：1996-10-29
申请号：US197941
申请日：1994-02-17
申请人： Eleftherios Adamopoulos , Kang-Wook Lee , Terrence R. O'Toole , Sampath Purushothaman , Jane M. Shaw , Alfred Viehbeck , George F. Walker
发明人： Eleftherios Adamopoulos , Kang-Wook Lee , Terrence R. O'Toole , Sampath Purushothaman , Jane M. Shaw , Alfred Viehbeck , George F. Walker
IPC分类号： B32B7/10 , B32B15/08 , B32B15/088 , B32B27/00 , C08G73/00 , C08G73/10 , H01B3/30 , H01L21/52 , H05K1/03 , H05K3/46 , C08F8/34
CPC分类号： C08G73/1089 , C08G73/1003 , C08G73/1007 , C08G73/101 , H01B3/306 , Y10S428/901 , Y10T428/24917 , Y10T428/31721
摘要： The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. the bonding operation.A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines. The novel polyimide may also contain unsaturated heterocyclic groups in the polymer backbone or chain, either as a partial or complete replacement for the aromatic diamines used in synthesizing the polyimide. This novel adhesive polyimide in this invention acts as an adhesive layer for the polymer-substrate (copper, polymer, glass ceramic) interface as well as a copper diffusion barrier layer for the polymer copper interface.
摘要翻译：本公开描述了一种多层制品，其包括粘附到其上的末端不饱和粘合聚酰亚胺的基底，其中与基底相对的粘合剂的表面粘附到聚酰亚胺上，该制品进一步的特征在于具有一组或多个交替层的末端不饱和粘合聚酰亚胺和聚酰亚胺。接合操作。还描述了一种新型粘合聚酰亚胺，其是粘合聚酰亚胺，例如用不饱和杂环单胺如氮杂腺嘌呤，氨基苯并三唑，氨基嘌呤或氨基吡唑并嘧啶和任选的酸酐，氨基乙炔，乙烯胺或氨基膦封端的ODPA-APB。新型聚酰亚胺还可以在聚合物主链或链中含有不饱和杂环基团，作为用于合成聚酰亚胺的芳族二胺的部分或完全替代物。本发明中的这种新型粘合聚酰亚胺作为聚合物基材（铜，聚合物，玻璃陶瓷）界面的粘合剂层以及用于聚合物铜界面的铜扩散阻挡层。

39. 发明授权

US5548034A Modified dicyanate ester resins having enhanced fracture toughness 失效
$Modified dicyanate ester resins having enhanced fracture toughness$
标题翻译：具有增强的断裂韧性的改性的二氰酸酯树脂
公开(公告)号：US5548034A
公开(公告)日：1996-08-20
申请号：US923723
申请日：1992-07-31
申请人： Ali Afzali-Ardakani , Jeffrey T. Gotro , Jeffrey C. Hedrick , Konstantinos Papathomas , Niranjan M. Patel , Jane M. Shaw , Alfred Viehbeck
发明人： Ali Afzali-Ardakani , Jeffrey T. Gotro , Jeffrey C. Hedrick , Konstantinos Papathomas , Niranjan M. Patel , Jane M. Shaw , Alfred Viehbeck
IPC分类号： B32B27/06 , C08G65/40 , C08G73/06 , C08G75/00 , C08G75/20 , C08G79/02 , C08G79/04 , C08J5/24 , C08L79/04 , C08L101/00 , C08L101/02 , C08L101/04 , H05K1/03 , C08G65/48
CPC分类号： C08L79/04 , H05K1/0373 , Y10S428/901 , Y10T428/24917 , Y10T442/2902 , Y10T442/2992 , Y10T442/3423 , Y10T442/3431 , Y10T442/3569 , Y10T442/656 , Y10T442/671
摘要： A curable material comprising a blend of a fluorine-containing cyanate and a fluorine-containing poly(arylene ether) wherein said cyanate is a monomer having the structureN.ident.C--O--R--.sub.n --O--C.ident.Nsaid fluorine containing poly(arylene ether) has the structureX--R--.sub.m --Xwherein X is any group capable of reacting with a --C.ident.N group;R is an aliphatic or aromatic group which may or may not be fluorosubstituted;R.sup.1 is an aliphatic or aromatic group which may or may not be fluoro substituted or R.sup.1 is selected from the group consisting of ether, carbonyl, sulfone, phosphine oxide and sulfide, and at least one of R or R.sup.1 must be fluoro substituted;n is 0-10; andm is 0-100;said material being heat-curable at a temperatures between 180.degree. and 325.degree. C.;said material in the cured state comprising a fluorine-containing polycyanurate network having a plurality of discrete phases of said fluorine-containing thermoplastic polymer dispersed therein wherein said thermoplastic polymer phases are of submicron size.
摘要翻译：一种包含含氟氰酸酯和含氟聚（亚芳基醚）的共混物的可固化材料，其中所述氰酸酯是具有结构N = CORnOC = N含氟聚（亚芳基醚）的单体，其结构为X-Rm-X，其中X 是能够与-C = N组反应的任何基团; R是可以是或不是氟取代的脂族或芳族基团; R1是脂族或芳族基团，其可以是或不是氟取代的，或者R1选自醚，羰基，砜，氧化膦和硫化物，并且R或R 1中的至少一个必须是氟取代的; n为0-10; m为0-100; 所述材料在180至325℃的温度下是可热固化的; 所述固化状态的材料包括含氟聚氰化酸盐网络，其中分散有所述含氟热塑性聚合物的多个离散相，其中所述热塑性聚合物相具有亚微米尺寸。

40. 发明授权

US5527592A Multilayer article having a planarized outer layer comprising a toughened polycyanurate 失效
标题翻译：具有包括增韧的聚氰化脲的平坦化外层的多层制品
公开(公告)号：US5527592A
公开(公告)日：1996-06-18
申请号：US344454
申请日：1994-11-23
申请人： Ali Afzali-Ardakani , Jeffrey T. Gotro , Jeffrey C. Hedrick , Konstantinos Papathomas , Niranjan M. Patel , Jane M. Shaw , Alfred Viehbeck
发明人： Ali Afzali-Ardakani , Jeffrey T. Gotro , Jeffrey C. Hedrick , Konstantinos Papathomas , Niranjan M. Patel , Jane M. Shaw , Alfred Viehbeck
IPC分类号： B32B27/06 , C08G65/40 , C08G73/06 , C08G75/00 , C08G75/20 , C08G79/02 , C08G79/04 , C08J5/24 , C08L79/04 , C08L101/00 , C08L101/02 , C08L101/04 , H05K1/03 , B32B3/00
CPC分类号： C08L79/04 , H05K1/0373 , Y10S428/901 , Y10T428/24917 , Y10T442/2902 , Y10T442/2992 , Y10T442/3423 , Y10T442/3431 , Y10T442/3569 , Y10T442/656 , Y10T442/671
摘要： An electronic circuit package comprising an electrically conductive circuit layer on a polymer, ceramic or multi-layer substrate wherein a curable dielectric material is applied over the electrically conductive circuit layer. The curable dielectric material comprises a blend of a fluorine-containing cyanate and a fluorine-containing arylene ether polymer. The cyanate is a monomer having the structureN.tbd.C--O--R--[R.sup.1 ].sub.n --O--C.tbd.Nand the fluorine containing arylene ether polymer has the structureX--R--[R.sup.1 ].sub.m --Xwherein X is any group capable of reacting with a --C.tbd.N group;R is an aliphatic or aromatic group which may or may not be fluorosubstituted;R.sup.1 is an aliphatic or aromatic group which may or may not be fluoro substituted or R.sup.1 is selected from the group consisting of ether, carbonyl, sulfone, phosphine oxide and sulfide, and at least one of R or R.sup.1 must be fluoro substituted;n is 0-10; andm is 0-100.The dielectric material in the cured state comprises a fluorine-containing polycyanurate network having a plurality of discrete phases of the fluorine-containing thermoplastic polymer dispersed therein. The thermoplastic polymer phases are of submicron size.
摘要翻译：一种电子电路封装，包括在聚合物，陶瓷或多层基底上的导电电路层，其中可固化介电材料施加在导电电路层上。可固化电介质材料包括含氟氰酸酯和含氟亚芳基醚聚合物的共混物。氰酸酯是具有结构N 3BOND C-O-R- [R 1] n -O-C 3 N N的单体，含氟亚芳基醚聚合物具有X-R- [R 1] m -X的结构，其中X是可与-C 3 N N基反应的基团; R是可以是或不是氟取代的脂族或芳族基团; R1是脂族或芳族基团，其可以是或不是氟取代的，或者R1选自醚，羰基，砜，氧化膦和硫化物，并且R或R 1中的至少一个必须是氟取代的; n为0-10; m为0-100。固化状态下的电介质材料含有分散在其中的含氟热塑性聚合物的多个离散相的含氟聚氰脲酸酯网络。热塑性聚合物相具有亚微米尺寸。

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