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31. 发明申请

US20080220568A1 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 审中-公开
标题翻译：半导体器件的制造方法
公开(公告)号：US20080220568A1
公开(公告)日：2008-09-11
申请号：US12117359
申请日：2008-05-08
申请人： Akira MUTO , Ichio Shimizu , Katsuo Arai , Hidemasa Kagii , Hiroshi Sato , Hiroyuki Nakamura , Takuya Nakajo , Keiichi Okawa , Masahiko Osaka
发明人： Akira MUTO , Ichio Shimizu , Katsuo Arai , Hidemasa Kagii , Hiroshi Sato , Hiroyuki Nakamura , Takuya Nakajo , Keiichi Okawa , Masahiko Osaka
IPC分类号： H01L23/28
CPC分类号： H01L23/49562 , H01L23/3107 , H01L23/49537 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/84 , H01L2224/32245 , H01L2224/371 , H01L2224/37147 , H01L2224/83801 , H01L2224/8385 , H01L2224/84801 , H01L2224/8485 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01067 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1306 , H01L2924/14 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A semiconductor device in the form of a resin sealed semiconductor package is disclosed, wherein a gate terminal connected to a gate pad electrode formed on a surface of a semiconductor chip and a source terminal connected to a source pad electrode formed on the chip surface exposed to a back surface of a sealing resin portion, a first portion of a drain terminal connected to a back-surface drain electrode of the semiconductor chip is exposed to an upper surface of the sealing resin portion, and a second portion of the drain terminal formed integrally with the first portion of the drain terminal is exposed to the back surface of the sealing resin portion. When forming the sealing resin portion in such a semiconductor device, first the sealing resin portion is formed so as to also cover an upper surface of the first portion of the drain terminal and thereafter the upper surface side of the sealing resin portion is polished by liquid honing, thereby allowing the upper surface of the first portion of the drain terminal to be exposed on the upper surface of the sealing resin portion. Both heat dissipating property and production yield of the semiconductor device are improved.
摘要翻译：公开了一种树脂密封半导体封装形式的半导体器件，其中连接到形成在半导体芯片的表面上的栅极焊盘电极的栅极端子和连接到形成在芯片表面上的源极焊盘电极的源极端子暴露于密封树脂部分的背面，连接到半导体芯片的背面漏电极的漏极端子的第一部分暴露于密封树脂部分的上表面，并且漏极端子的第二部分整体地形成漏极端子的第一部分暴露于密封树脂部分的背面。当在这种半导体器件中形成密封树脂部分时，首先形成密封树脂部分，以便也覆盖漏极端子的第一部分的上表面，此后密封树脂部分的上表面侧被液体从而允许排水端子的第一部分的上表面暴露在密封树脂部分的上表面上。改善了半导体器件的散热性能和生产成本。

32. 发明授权

US07374965B2 Manufacturing method of semiconductor device 有权
标题翻译：半导体器件的制造方法
公开(公告)号：US07374965B2
公开(公告)日：2008-05-20
申请号：US11348362
申请日：2006-02-07
申请人： Akira Muto , Ichio Shimizu , Katsuo Arai , Hidemasa Kagii , Hiroshi Sato , Hiroyuki Nakamura , Takuya Nakajo , Keiichi Okawa , Masahiko Osaka
发明人： Akira Muto , Ichio Shimizu , Katsuo Arai , Hidemasa Kagii , Hiroshi Sato , Hiroyuki Nakamura , Takuya Nakajo , Keiichi Okawa , Masahiko Osaka
IPC分类号： H01L21/00
CPC分类号： H01L23/49562 , H01L23/3107 , H01L23/49537 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/84 , H01L2224/32245 , H01L2224/371 , H01L2224/37147 , H01L2224/83801 , H01L2224/8385 , H01L2224/84801 , H01L2224/8485 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01067 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1306 , H01L2924/14 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A semiconductor device in the form of a resin sealed semiconductor package is disclosed, wherein a gate terminal connected to a gate pad electrode formed on a surface of a semiconductor chip and a source terminal connected to a source pad electrode formed on the chip surface exposed to a back surface of a sealing resin portion, a first portion of a drain terminal connected to a back-surface drain electrode of the semiconductor chip is exposed to an upper surface of the sealing resin portion, and a second portion of the drain terminal formed integrally with the first portion of the drain terminal is exposed to the back surface of the sealing resin portion. When forming the sealing resin portion in such a semiconductor device, first the sealing resin portion is formed so as to also cover an upper surface of the first portion of the drain terminal and thereafter the upper surface side of the sealing resin portion is polished by liquid honing, thereby allowing the upper surface of the first portion of the drain terminal to be exposed on the upper surface of the sealing resin portion. Both heat dissipating property and production yield of the semiconductor device are improved.
摘要翻译：公开了一种树脂密封半导体封装形式的半导体器件，其中连接到形成在半导体芯片的表面上的栅极焊盘电极的栅极端子和连接到形成在芯片表面上的源极焊盘电极的源极端子暴露于密封树脂部分的背面，连接到半导体芯片的背面漏电极的漏极端子的第一部分暴露于密封树脂部分的上表面，并且漏极端子的第二部分整体地形成漏极端子的第一部分暴露于密封树脂部分的背面。当在这种半导体器件中形成密封树脂部分时，首先形成密封树脂部分，以便也覆盖漏极端子的第一部分的上表面，此后密封树脂部分的上表面侧被液体从而允许排水端子的第一部分的上表面暴露在密封树脂部分的上表面上。改善了半导体器件的散热性能和生产成本。

33. 发明授权

US5434887A Quadrature modulation circuit for use in a radio transmitter 失效
标题翻译：用于无线电发射机的正交调制电路
公开(公告)号：US5434887A
公开(公告)日：1995-07-18
申请号：US109921
申请日：1993-08-23
申请人： Masahiko Osaka
发明人： Masahiko Osaka
IPC分类号： H03C3/09 , H03L7/185 , H04L27/36 , H04L27/04 , H04L27/20
CPC分类号： H04L27/362 , H03C3/0908 , H03L7/185
摘要： A quadrature modulation circuit is comprised of two frequency generators which generate a first frequency signal and a second frequency signal, respectively, and a mixer which mixes the first frequency signal and the second frequency signal to generate the carrier wave whose frequency is different from both the first frequency and the second frequency. By the quadrature modulation of this carrier wave according to a baseband signal, a transmission wave can be obtained. Since the first frequency differs from the carrier frequency and the second frequency differs from both the carrier frequency and the first frequency, the output signals of the frequency generators are not affected by the transmission wave.
摘要翻译：正交调制电路包括分别产生第一频率信号和第二频率信号的两个频率发生器和混合第一频率信号和第二频率信号以产生频率不同于两者的载波的混频器第一频率和第二频率。通过根据基带信号的该载波的正交调制，可以获得发送波。由于第一频率与载波频率不同，第二频率与载波频率和第一频率不同，所以频率发生器的输出信号不受传输波的影响。

34. 发明授权

US08454329B2 Sealed terminal device for motor-driven compressor 有权
标题翻译：电动压缩机密封端子装置
公开(公告)号：US08454329B2
公开(公告)日：2013-06-04
申请号：US12307117
申请日：2007-06-25
申请人： Masanori Taguchi , Masahiko Osaka , Eiichi Oshio , Kazuhiko Kameyama , Satoru Saito
发明人： Masanori Taguchi , Masahiko Osaka , Eiichi Oshio , Kazuhiko Kameyama , Satoru Saito
IPC分类号： F04B39/00 , H02K5/22 , H02K3/50
CPC分类号： H01R13/521 , F04C18/0215 , F04C23/008 , F04C2240/803 , H02G3/22 , H02G15/013 , H02K5/10 , H02K5/225
摘要： A sealed terminal device for a motor-driven compressor has an electrically insulating terminal holder (12) to be attached to the housing wall (2a) of the motor-driven compressor, a plurality of sealed terminals (18) held in the terminal holder (12), for penetrating the housing wall (2a) with play to the housing wall (2a), and a groove (40) or cavity (38) formed in the terminal holder (12) to increase a creepage distance for insulation between the sealed terminals.
摘要翻译：一种用于电动压缩机的密封端子装置，具有安装在电动压缩机的壳体壁（2a）上的电绝缘端子座（12），多个密封端子（18），保持在端子座（ 12），用于将所述壳体壁（2a）玩耍地穿过所述壳体壁（2a），以及形成在所述端子保持器（12）中的凹槽（40）或空腔（38），以增加所述密封终端。

35. 发明授权

US08301201B2 Cellular phone 失效
标题翻译：手机
公开(公告)号：US08301201B2
公开(公告)日：2012-10-30
申请号：US12671844
申请日：2008-08-12
申请人： Masahiko Osaka
发明人： Masahiko Osaka
IPC分类号： H04B1/38 , H04M1/00 , F21V13/00
CPC分类号： H04M1/22 , G02B6/0081 , H04M1/0225 , H04M1/0233 , H04M1/0235 , H04M1/0241
摘要： A cellular phone of the present invention comprises upper housing 10 and lower housing 20 connected together for displacement relative to each other. Upper housing 10 incorporates liquid crystal unit 30 which includes light source 35 and liquid crystal panel 34 illuminated by light emitted from light source 35. Lower housing 20 incorporates an input device. Upper housing 10 comprises slit 13 which communicates with the interior and exterior of upper housing 10, and light guide means for guiding light emitted from light source 35 to slit 35. Operating unit 21 of the input device arranged on lower housing 20 is illuminated by light which is guided by the light guide means and which is emitted to the outside of upper housing 10 through slit 13.
摘要翻译：本发明的便携式电话机包括连接在一起以便相对于彼此移位的上壳体10和下壳体20。上壳体10包括液晶单元30，其包括由光源35和由从光源35发射的光照射的液晶面板34.下壳体20包括输入装置。上壳体10包括与上壳体10的内部和外部连通的狭缝13和用于将从光源35发射的光引导到狭缝35的导光装置。布置在下壳体20上的输入装置的操作单元21被光照射其由导光装置引导，并且通过狭缝13发射到上壳体10的外部。

36. 发明授权

US08083545B2 Shield structural body, connector assembly and connector structural body having shield structural body, casing assembly, and electric compressor 有权
标题翻译：屏蔽结构体，连接器组件和具有屏蔽结构体，壳体组件和电动压缩机的连接器结构体
公开(公告)号：US08083545B2
公开(公告)日：2011-12-27
申请号：US12307911
申请日：2007-06-20
申请人： Takatoshi Koitabashi , Masahiko Osaka , Hideo Ikeda
发明人： Takatoshi Koitabashi , Masahiko Osaka , Hideo Ikeda
IPC分类号： H01R13/648
CPC分类号： F04B39/12 , H01R13/5205 , H01R13/648
摘要： Disclosed are a shield structural body, a connector assembly and connector structural body using the shield structural body, a casing assembly having the connector assembly, and an electric compressor having the casing assembly. The shield structural body is formed of an electrically conductive material and has a tube section, a ground electrode terminal formed electrically integrally with the tube section, claw sections integrally formed with the tube section, projected at least either radially outward or inward from the tube section, and engageable with a shield structural body holding member. The shield structural body can be produced at low cost, the connector assembly can provide high productivity and can be produced at low cost, the connector structural body is highly reliable, the casing assembly using the connector assembly is highly versatile, and the electric compressor having the casing assembly can easily cope with model changes.
摘要翻译：公开了一种屏蔽结构体，使用屏蔽结构体的连接器组件和连接器结构体，具有连接器组件的壳体组件和具有壳体组件的电动压缩机。屏蔽结构体由导电材料形成，具有管部，与管部电连接形成的接地电极端子，与管部一体形成的爪部，至少从管部向外侧或内侧突出并且能够与盾构结构体保持构件接合。可以以低成本制造屏蔽结构体，连接器组件可以提供高生产率并且可以以低成本生产，连接器结构体是高度可靠的，使用连接器组件的壳体组件是非常通用的，并且电动压缩机具有套管组件可以轻松应对模型变化。

37. 发明申请

US20100254833A1 TERMINAL DEVICE FOR ELECTRIC COMPRESSOR 审中-公开
标题翻译：电动压缩机终端装置
公开(公告)号：US20100254833A1
公开(公告)日：2010-10-07
申请号：US12743156
申请日：2008-11-14
申请人： Masanori Taguchi , Masahiko Osaka , Shigeyuki Koyama , Eiji Kobayashi
发明人： Masanori Taguchi , Masahiko Osaka , Shigeyuki Koyama , Eiji Kobayashi
IPC分类号： F04B35/04
CPC分类号： F04B39/023 , F04B39/12 , F04C18/0215 , F04C23/008 , F04C2240/803 , H02K5/12 , H02K5/225
摘要： Provided is a terminal device for an electric compressor including: a partition wall arranged between a container part for a compression mechanism drive motor present with a lubricant-containing fluid to be compressed and a circuit part for supplying power to the motor; and a power supply terminal member hermetically extending through the partition wall so as to supply power to the motor. An electric communication portion of the terminal member extending between the two parts is covered with insulating varnish. Even when polyalkylene glycol-based oil is used as the lubricant-containing fluid to be compressed, it is possible to realize an electric compressor terminal device with a simple structure at a low cost which can exhibit a sufficiently high insulation performance.
摘要翻译：本发明提供一种电动压缩机的终端装置，其特征在于，包括：分隔壁，其设置在压缩机构驱动电动机的容器部分与待压缩的含润滑剂的流体之间，以及向所述电动机供电的电路部; 以及电源端子构件，其气密地延伸穿过所述分隔壁，以向所述电动机供电。在两部分之间延伸的端子构件的电连通部分用绝缘漆覆盖。即使使用聚亚烷基二醇系油作为要被压缩的含润滑剂的流体，也可以以低成本实现具有简单结构的电动压缩机端子装置，其可以表现出足够高的绝缘性能。

38. 发明申请

US20090285703A1 Motor-Driven Compressor 审中-公开
标题翻译：电机驱动压缩机
公开(公告)号：US20090285703A1
公开(公告)日：2009-11-19
申请号：US12307122
申请日：2007-06-26
申请人： Masahiko Osaka , Masanori Taguchi , Satoru Saito , Eiichi Oshio , Kazuhiko Kameyama , Kou Tsukamoto
发明人： Masahiko Osaka , Masanori Taguchi , Satoru Saito , Eiichi Oshio , Kazuhiko Kameyama , Kou Tsukamoto
IPC分类号： F04B35/04
CPC分类号： H01R13/521 , F04C18/0215 , F04C23/008 , F04C2240/803 , H02G3/22 , H02K5/10 , H02K5/225 , H02K7/14
摘要： An energization bolt (102), which includes an input portion (102a) to be connected to a motor (40), an intermediate portion (102b) contiguous to the input portion and positioned in an insertion hole (23d) formed in a housing (20), and an output portion (102c) contiguous to the intermediate portion and to be connected to a drive circuit (98), and energizes between the drive circuit and the motor, and a seal member (100), which surrounds the intermediate portion, is sandwiched and supported by the input portion side and the output portion side, and is fastened to the housing, are included.
摘要翻译：一个通电螺栓（102），包括一个与马达（40）连接的输入部分（102a），一个与输入部分邻接的中间部分（102b），并定位在一个形成在壳体中的插入孔（23d）中 20）和与中间部分邻接并连接到驱动电路（98）的输出部分（102c），并且在驱动电路和电动机之间通电;以及密封构件（100），其围绕中间部分被输入部分侧和输出部分侧夹持和支撑，并被固定到壳体。

39. 发明授权

US07220617B2 Semiconductor device and method of manufacturing the same 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US07220617B2
公开(公告)日：2007-05-22
申请号：US11349219
申请日：2006-02-08
申请人： Hidemasa Kagii , Akira Muto , Ichio Shimizu , Katsuo Arai , Hiroshi Sato , Hiroyuki Nakamura , Masahiko Osaka , Takuya Nakajo , Keiichi Okawa , Hiroi Oka
发明人： Hidemasa Kagii , Akira Muto , Ichio Shimizu , Katsuo Arai , Hiroshi Sato , Hiroyuki Nakamura , Masahiko Osaka , Takuya Nakajo , Keiichi Okawa , Hiroi Oka
IPC分类号： H01L21/44 , H01L21/48
CPC分类号： H01L23/24 , H01L21/52 , H01L23/488 , H01L23/49562 , H01L24/36 , H01L24/40 , H01L2224/05155 , H01L2224/05166 , H01L2224/05568 , H01L2224/05573 , H01L2224/0558 , H01L2224/05624 , H01L2224/05644 , H01L2224/16 , H01L2224/16245 , H01L2224/32245 , H01L2224/40225 , H01L2224/73153 , H01L2224/73253 , H01L2224/83801 , H01L2224/8385 , H01L2224/84801 , H01L2224/8485 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12032 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/00014
摘要： A semiconductor chip is sealed by resin without covering an outer terminal of a semiconductor device having a power transistor. A semiconductor chip having a power transistor is housed within a recess of a metal cap while a drain electrode on a first surface of the semiconductor chip is bonded to a bottom of the recess via a connection material. A gate electrode and a source electrode are formed on a second surface opposite to the first surface of the semiconductor chip, and the gate electrode and the source electrode are bonded with metal plate terminals. In addition, the semiconductor chip is sealed by a resin sealing body with mounting-surfaces of the metal plate terminals being exposed. Mounting surfaces of the metal plate terminals and a third part of the metal cap are bonded to electrodes on a mounting board.
摘要翻译：半导体芯片由树脂密封而不覆盖具有功率晶体管的半导体器件的外部端子。具有功率晶体管的半导体芯片容纳在金属盖的凹部内，而半导体芯片的第一表面上的漏电极经由连接材料接合到凹部的底部。在与半导体芯片的第一表面相对的第二表面上形成栅电极和源电极，并且栅极电极和源极电极与金属板端子接合。此外，半导体芯片被树脂密封体密封，金属板端子的安装表面露出。金属板端子和金属盖的第三部分的安装表面与安装板上的电极接合。

40. 发明申请

US20060175700A1 Semiconductor device and method of manufacturing the same 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US20060175700A1
公开(公告)日：2006-08-10
申请号：US11349219
申请日：2006-02-08
申请人： Hidemasa Kagii , Akira Muto , Ichio Shimizu , Katsuo Arai , Hiroshi Sato , Hiroyuki Nakamura , Masahiko Osaka , Takuya Nakajo , Keiichi Okawa , Hiroi Oka
发明人： Hidemasa Kagii , Akira Muto , Ichio Shimizu , Katsuo Arai , Hiroshi Sato , Hiroyuki Nakamura , Masahiko Osaka , Takuya Nakajo , Keiichi Okawa , Hiroi Oka
IPC分类号： H01L23/34
CPC分类号： H01L23/24 , H01L21/52 , H01L23/488 , H01L23/49562 , H01L24/36 , H01L24/40 , H01L2224/05155 , H01L2224/05166 , H01L2224/05568 , H01L2224/05573 , H01L2224/0558 , H01L2224/05624 , H01L2224/05644 , H01L2224/16 , H01L2224/16245 , H01L2224/32245 , H01L2224/40225 , H01L2224/73153 , H01L2224/73253 , H01L2224/83801 , H01L2224/8385 , H01L2224/84801 , H01L2224/8485 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12032 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/00014
摘要： A semiconductor chip is sealed by resin without covering an outer terminal of a semiconductor device having a power transistor. A semiconductor chip having a power transistor is housed within a recess of a metal cap while a drain electrode on a first surface of the semiconductor chip is bonded to a bottom of the recess via a connection material. A gate electrode and a source electrode are formed on a second surface opposite to the first surface of the semiconductor chip, and the gate electrode and the source electrode are bonded with metal plate terminals In addition, the semiconductor chip is sealed by a resin sealing body with mounting-surfaces of the metal plate terminals being exposed. Mounting surfaces of the metal plate terminals and a third part of the metal cap are bonded to electrodes on a mounting board.
摘要翻译：半导体芯片由树脂密封而不覆盖具有功率晶体管的半导体器件的外部端子。具有功率晶体管的半导体芯片容纳在金属盖的凹部内，而半导体芯片的第一表面上的漏电极经由连接材料接合到凹部的底部。在与半导体芯片的第一表面相对的第二表面上形成栅极电极和源极电极，并且栅极电极和源极电极与金属板端子接合。此外，半导体芯片由树脂密封体金属板端子的安装表面露出。金属板端子和金属盖的第三部分的安装表面与安装板上的电极接合。

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