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31. 发明申请

US20120200282A1 CHIP ELECTRONIC COMPONENT, MOUNTED STRUCTURE OF CHIP ELECTRONIC COMPONENT, AND SWITCHING SUPPLY CIRCUIT 审中-公开
标题翻译：芯片电子元件，芯片电子元件的安装结构和开关电源电路
公开(公告)号：US20120200282A1
公开(公告)日：2012-08-09
申请号：US13348203
申请日：2012-01-11
申请人： Masaaki TOGASHI
发明人： Masaaki TOGASHI
IPC分类号： G05F3/08 , H01L29/02 , H01L23/48
CPC分类号： H01F17/04 , H05K1/0231 , H05K1/0233 , H05K1/025 , H05K1/181
摘要： A chip electronic component is provided with an element body containing a ferrite material; a first terminal electrode, a second terminal electrode, and a third terminal electrode arranged on the surface of the element body; and an internal conductor electrically connected to the first terminal electrode, the second terminal electrode, and the third terminal electrode. The impedance of a current path through the internal conductor between the first terminal electrode and the second terminal electrode is different from that of a current path through the internal conductor between the first terminal electrode and the third terminal electrode.
摘要翻译：芯片电子部件设置有包含铁素体材料的元件主体; 第一端子电极，第二端子电极和布置在元件主体的表面上的第三端子电极; 以及与第一端子电极，第二端子电极和第三端子电极电连接的内部导体。通过第一端子电极和第二端子电极之间的内部导体的电流路径的阻抗与通过第一端子电极和第三端子电极之间的内部导体的电流路径的阻抗不同。

32. 发明申请

US20120188028A1 MULTILAYER ELECTRONIC COMPONENT AND MOUNTED STRUCTURE OF ELECTRONIC COMPONENT 有权
标题翻译：电子元件的多层电子元件和安装结构
公开(公告)号：US20120188028A1
公开(公告)日：2012-07-26
申请号：US13354794
申请日：2012-01-20
申请人： Masaaki TOGASHI
发明人： Masaaki TOGASHI
IPC分类号： H03H7/01 , H01F27/28 , H01F27/24
CPC分类号： H01F17/0006 , H01F2017/0066 , H03H1/0007
摘要： A ferrite bead inductor comprises a ferrite bead element body having magnetic layers and inner electrodes stacked therein, and first and second outer electrodes arranged on first and second side faces of the ferrite bead element body. The inner electrode extends in the direction of shorter sides which are shorter than longer sides, so as to connect with the first and second outer electrodes. The ferrite bead element body has an interstice for allowing the magnetic layers adjacent to each other in the stacking direction to join together within an inner electrode region adapted to form the inner electrode on the magnetic layer.
摘要翻译：铁氧体磁珠电感器包括具有堆叠在其中的磁性层和内部电极的铁氧体磁珠元件体，以及布置在铁氧体磁珠元件主体的第一和第二侧面上的第一和第二外部电极。内电极沿比长边短的短边方向延伸，以与第一外电极和第二外电极连接。铁氧体磁珠元件体具有用于使层叠方向上彼此相邻的磁性层在适于在磁性层上形成内部电极的内部电极区域中接合在一起的间隙。

33. 发明申请

US20100232086A1 MULTILAYER CAPACITOR 有权
标题翻译：多层电容器
公开(公告)号：US20100232086A1
公开(公告)日：2010-09-16
申请号：US12636393
申请日：2009-12-11
申请人： Masaaki TOGASHI
发明人： Masaaki TOGASHI
IPC分类号： H01G4/005
CPC分类号： H01G4/012 , H01G4/232 , H01G4/30
摘要： There are a plurality of types of first internal electrodes and each type of first internal electrode includes a first main electrode portion and a first lead portion. A second internal electrode includes a plurality of second main electrode portions forming respective capacitance components with the respective types of first internal electrodes, an interconnection portion connecting between each pair of second main electrode portions, and a second lead portion. Positions of the first lead portions of the respective types of first internal electrodes are different from each other and distances from the first lead portions of the respective types of first internal electrodes to the second lead portion are different from each other. The width of the interconnection portion is smaller than the width of at least one second main electrode portion out of the plurality of second main electrode portions.
摘要翻译：存在多种类型的第一内部电极，并且每种类型的第一内部电极包括第一主电极部分和第一引线部分。第二内部电极包括多个第二主电极部分，其形成与各种类型的第一内部电极相对应的电容部件，连接在每对第二主电极部分之间的互连部分和第二引线部分。各种类型的第一内部电极的第一引线部分的位置彼此不同，并且从各种类型的第一内部电极的第一引线部分到第二引线部分的距离彼此不同。互连部分的宽度小于多个第二主电极部分中的至少一个第二主电极部分的宽度。

34. 发明申请

US20090141421A1 FEEDTHROUGH CAPACITOR MOUNTED STRUCTURE 有权
标题翻译：有源电容器安装结构
公开(公告)号：US20090141421A1
公开(公告)日：2009-06-04
申请号：US12250870
申请日：2008-10-14
申请人： Masaaki TOGASHI
发明人： Masaaki TOGASHI
IPC分类号： H01G4/35
CPC分类号： H01G4/35 , H01G4/232 , H05K1/0231 , H05K1/114 , H05K2201/10636 , H05K2201/10969 , Y02P70/611
摘要： A feedthrough capacitor having a pair of first terminal electrodes and a second terminal electrode is mounted on a mounting surface of a substrate. The substrate is an insulating substrate internally having first and second conductor portions isolated from each other, and has a plurality of first via holes, a plurality of second via holes, a plurality of first land electrodes, and a second land electrode. The first via holes and the second via holes, when viewed from the mounting surface side, are arranged in a matrix pattern and alternately arranged in a row direction and in a column direction. The feedthrough capacitor, when viewed from the mounting surface side, is located between a pair of said first via holes adjacent to each other in a direction intersecting with the row direction and also adjacent to each other in a direction intersecting with the column direction. The pair of first terminal electrodes are connected to the respective first land electrodes corresponding to the pair of adjacent first via holes. The second terminal electrode is connected to the second land electrode.
摘要翻译：具有一对第一端子电极和第二端子电极的穿通电容器安装在基板的安装表面上。衬底是内部具有彼此隔离的第一和第二导体部分的绝缘衬底，并且具有多个第一通孔，多个第二通孔，多个第一焊盘电极和第二焊盘电极。当从安装表面侧观察时，第一通孔和第二通孔布置成矩阵图案，并且在行方向和列方向上交替布置。馈通电容器从安装表面侧观察时位于与行方向相交的方向上彼此相邻的一对所述第一通孔之间，并且在与列方向相交的方向上彼此相邻。一对第一端子电极连接到对应于该对相邻的第一通孔的相应的第一焊盘电极。第二端子电极连接到第二焊盘电极。

35. 发明申请

US20090034153A1 FEEDTHROUGH MULTILAYER CAPACITOR 有权
标题翻译：生产多层电容器
公开(公告)号：US20090034153A1
公开(公告)日：2009-02-05
申请号：US12178188
申请日：2008-07-23
申请人： Masaaki TOGASHI
发明人： Masaaki TOGASHI
IPC分类号： H01G4/35 , H01G4/228
CPC分类号： H01G4/35 , H01G4/228
摘要： A first signal internal electrode is connected to a first signal terminal electrode and a second signal internal electrode is connected to a second signal terminal electrode. A first ground internal electrode is connected to a first ground terminal electrode and a second ground internal electrode is connected to a second ground terminal electrode. The first signal internal electrode and the first ground internal electrode have their respective opposed regions. The second signal internal electrode and the second ground internal electrode have their respective opposed regions. The first signal internal electrode and the second ground internal electrode are not opposed to each other. The second signal internal electrode and the first ground internal electrode are not opposed to each other. The first signal internal electrode and the second signal internal electrode are connected through a signal throughhole conductor. The first ground internal electrode and the second ground internal electrode are connected through a ground throughhole conductor.
摘要翻译：第一信号内部电极连接到第一信号端子电极，第二信号内部电极连接到第二信号端子电极。第一接地内部电极连接到第一接地端子电极，第二接地内部电极连接到第二接地端子电极。第一信号内部电极和第一接地内部电极具有它们各自的对置区域。第二信号内部电极和第二接地内部电极具有各自的对置区域。第一信号内部电极和第二接地内部电极彼此不相对。第二信号内部电极和第一接地内部电极彼此不相对。第一信号内部电极和第二信号内部电极通过信号通孔导体连接。第一接地内部电极和第二接地内部电极通过接地通孔导体连接。

36. 发明申请

US20080239624A1 Multilayer Feedthrough Capacitor 有权
标题翻译：多层馈电电容
公开(公告)号：US20080239624A1
公开(公告)日：2008-10-02
申请号：US12051411
申请日：2008-03-19
申请人： Masaaki TOGASHI
发明人： Masaaki TOGASHI
IPC分类号： H01G4/236
CPC分类号： H01G4/35 , H01G4/012 , H01G4/232 , H01G4/30
摘要： A capacitor body of a multilayer feedthrough capacitor is arranged with grounding inner electrodes and signal inner electrodes. The grounding inner electrodes include first and second grounding main electrode portions, grounding connection electrode portions having no areas opposing the signal inner electrodes, and first and second grounding lead electrode portions. The signal inner electrodes include first and second signal main electrode portions, signal connection electrode portions having no areas opposing the grounding inner electrodes, and first and second signal lead electrode portions.
摘要翻译：多层馈通电容器的电容器主体具有接地内部电极和信号内部电极。接地内部电极包括第一和第二接地主电极部分，没有与信号内部电极相对的区域的接地连接电极部分，以及第一和第二接地引线电极部分。信号内部电极包括第一和第二信号主电极部分，没有与接地内部电极相对的区域的信号连接电极部分，以及第一和第二信号引线电极部分。

37. 发明申请

US20110102969A1 MULTILAYER CAPACITOR, MOUNTING STRUCTURE THEREOF, AND METHOD OF MANUFACTURING SAME 审中-公开
标题翻译：多层电容器，其安装结构及其制造方法
公开(公告)号：US20110102969A1
公开(公告)日：2011-05-05
申请号：US12899974
申请日：2010-10-07
申请人： Masaaki TOGASHI
发明人： Masaaki TOGASHI
IPC分类号： H01G4/228 , H05K7/00 , H01G9/00
CPC分类号： H01G4/012 , H01G4/232 , H01G4/30
摘要： A multilayer capacitor 1 comprises a capacitor element body 2 constituted by a plurality of dielectric layers 10; inner electrodes 3, 4, disposed within the capacitor element body 2, having main electrode parts 31, 41 separated by a distance Wg from third and fourth side faces 2c, 2d; and terminal electrodes 5, 6 disposed on respective end faces 2e, 2f and a part of first to fourth side faces 2a to 2d. The inner electrodes 3, 4 are alternately laminated with the dielectric layer 10. The distance Cv between the inner electrode 3, 4 at the outermost layer on each of the first and second side face 2a, 2b sides and the first or second side face 2a, 2b adjacent to the inner electrode 3, 4 is shorter than the distance Wg between the main electrode part 31, 41 and the third or fourth side face 2c, 2d.
摘要翻译：多层电容器1包括由多个电介质层10构成的电容器元件主体2; 设置在电容器元件主体2内的内电极3,4具有与第三和第四侧面2c，2d分开距离Wg的主电极部分31,41; 以及设置在各个端面2e，2f和第一至第四侧面2a至2d的一部分上的端子电极5,6。内电极3,4与电介质层10交替层叠。在第一和第二侧面2a，2b侧和第一或第二侧面2a之间的最外层的内部电极3,4之间的距离Cv 2b与内电极3,4相比短于主电极部31,41与第三或第四侧面2c，2d之间的距离Wg。

38. 发明申请

US20110096464A1 MULTILAYER CAPACITOR 有权
标题翻译：多层电容器
公开(公告)号：US20110096464A1
公开(公告)日：2011-04-28
申请号：US12904694
申请日：2010-10-14
申请人： Masaaki TOGASHI , Kazuyuki HASEBE
发明人： Masaaki TOGASHI , Kazuyuki HASEBE
IPC分类号： H01G4/228
CPC分类号： H01G4/228
摘要： Disclosed is a multilayer capacitor capable of improving adhesiveness of layers of an element body and improving reliability. Outer edge 12a, 12c, and 12d of a second principal-surface electrode portion 12 are respectively separated from an end surface 1a and lateral surfaces 1e and 1f, and are respectively arranged so as to surround the forefront portion of a third principal-surface electrode portion 21 at one end 1A side when viewed from a lamination direction. Outer edges 22a, 22c, and 22d of a fourth principal-surface electrode portion 22 are respectively separated from an end surface 1b and lateral surfaces 1e and 1f, and are arranged so as to surround the forefront portion of a first principal-surface electrode portion 11 in the width direction at the other end 1B side when viewed from the lamination direction. First lead portions 14 and 16 are respectively connected to the outer edges 12c and 12d of the second principal-surface electrode portion 12 in a width direction at the other end 1B side, and second lead portions 24 and 26 are respectively connected to the outer edges 22c and 22d of the fourth principal-surface electrode portion 22 in the width direction at the one end 1A side.
摘要翻译：公开了能够提高元件体的层的粘附性并提高可靠性的层叠电容器。第二主表面电极部分12的外边缘12a，12c和12d分别与端面1a和侧表面1e和1f分开，并且分别布置成围绕第三主表面电极的前端部分在从层叠方向观察时的一端1A侧的部分21。第四主表面电极部分22的外边缘22a，22c和22d分别与端面1b和侧表面1e和1f分离，并且被布置成围绕第一主表面电极部分的第一主表面电极部分 11在从层叠方向观察时在另一端1B侧的宽度方向上。第一引线部14和16分别在第二主表面电极部分12的外边缘12c和12d沿另一端1B侧的宽度方向连接，第二引线部分24和26分别连接到外边缘 22c和22d在第一主体1A侧的宽度方向上。

39. 发明申请

US20110032655A1 MULTILAYER CAPACITOR ARRAY MOUNTING STRUCTURE 有权
标题翻译：多层电容器阵列安装结构
公开(公告)号：US20110032655A1
公开(公告)日：2011-02-10
申请号：US12824669
申请日：2010-06-28
申请人： Masaaki TOGASHI
发明人： Masaaki TOGASHI
IPC分类号： H01G4/30
CPC分类号： H01G4/232 , H01G2/06 , H01G4/30 , H01G4/385
摘要： A multilayer capacitor array 1 comprises a capacitor element body 2 having first, second, third, and fourth inner electrodes 13 to 16, and first to fourth terminal electrodes 3 to 6 disposed on the outer surface of the capacitor element body 2 and respectively connected to the inner electrodes 13 to 16. The first and second inner electrodes 13, 14 form a first capacitor section C1, while the third and fourth inner electrodes 15, 16 form a second capacitor section C2. The multilayer capacitor array 1 is mounted to a circuit board such that the first and third terminal electrodes 3, 5 are connected to first leads 22, 23, while the second and fourth terminal electrodes 4, 6 are connected to a second lead 24.
摘要翻译：层叠电容器阵列1包括具有第一，第二，第三和第四内部电极13至16的电容器元件体2和设置在电容器元件主体2的外表面上的第一至第四端子电极3至6，并且分别连接到内部电极13至16.第一和第二内部电极13,14形成第一电容器部分C1，而第三和第四内部电极15,16形成第二电容器部分C2。多层电容器阵列1安装到电路板上，使得第一和第三端子电极3,5连接到第一引线22,23，而第二和第四端子电极4,6连接到第二引线24。

40. 发明申请

US20100188798A1 MULTILAYER CAPACITOR AND METHOD OF MANUFACTURING SAME 有权
标题翻译：多层电容器及其制造方法
公开(公告)号：US20100188798A1
公开(公告)日：2010-07-29
申请号：US12629646
申请日：2009-12-02
申请人： Masaaki TOGASHI , Sunao MASUDA , Hiroshi ABE
发明人： Masaaki TOGASHI , Sunao MASUDA , Hiroshi ABE
IPC分类号： H01G4/228 , H01L21/00
CPC分类号： H01G4/232 , H01G2/06 , H01G4/30 , H05K3/3426 , H05K2201/10636 , H05K2201/10856 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , Y10T29/41
摘要： A multilayer capacitor which can prevent chattering noises from occurring and improve the packaging density and packaging yield, and a method of manufacturing a multilayer capacitor are provided.Even when an electrostrictive vibration is generated in this multilayer capacitor upon voltage application, a joint surface of a metal terminal can flex, so as to mitigate the electrostrictive vibration, thereby preventing chattering noises from occurring. The joint surface is formed with a cutout and thus can fully secure its flexibility. In this multilayer capacitor, a step formed by a terminal connecting surface, a substrate connecting surface, and the joint surface is positioned within an area overlapping a capacitor element body as seen in the laminating direction of dielectric layers. Therefore, solder fillets do not protrude out of the capacitor element body, whereby the packaging density on a mounting substrate K can be improved. The state of solder fillets is easy to see from the outside, and a connection yield can also be secured.
摘要翻译：提供一种能够防止发生振动噪声并提高封装密度和封装产率的层叠电容器，以及制造多层电容器的方法。即使当在施加电压时在该多层电容器中产生电致伸缩振动，金属端子的接合表面也可以弯曲，以减轻电致伸缩振动，从而防止发生振动噪声。接头表面形成有切口，从而可以完全确保其柔性。在该层叠电容器中，由电极连接面，基板连接面和接合面形成的台阶位于与电介质层的层叠方向相反的与电容器元件本体重叠的区域内。因此，焊料圆角不会从电容器元件主体突出，从而可以提高安装基板K上的封装密度。焊接圆角的状态从外部容易看出，也可以确保连接良率。

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