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31. 发明授权

US06410642B1 Adhesive and semiconductor devices 有权
标题翻译：粘合剂和半导体器件
公开(公告)号：US06410642B1
公开(公告)日：2002-06-25
申请号：US09597061
申请日：2000-06-20
申请人： Kimio Yamakawa , Minoru Isshiki , Katsutoshi Mine
发明人： Kimio Yamakawa , Minoru Isshiki , Katsutoshi Mine
IPC分类号： C08K300
CPC分类号： H01L24/32 , C08K7/18 , C08K2201/016 , C08L2666/54 , C09J11/02 , C09J183/04 , H01L21/563 , H01L24/83 , H01L2224/16225 , H01L2224/27013 , H01L2224/2919 , H01L2224/73203 , H01L2224/83051 , H01L2224/8319 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , Y10T428/31511 , Y10T428/31663 , H01L2924/00
摘要： An adhesive composition for bonding of semiconductor chips to their chip mounting component comprising a curable polymer composition that comprises a spherical filler having an average particle size from greater than 100 to 1,000 &mgr;m and an aspect ratio of 1 to 1.5. Semiconductor devices according to this invention are characterized in that a semiconductor chip therein is bonded to the mounting component for said chip by the aforementioned adhesive.
摘要翻译：一种用于将半导体芯片粘接到其芯片安装部件上的粘合剂组合物，其包含可固化聚合物组合物，其包含平均粒径大于100至1,000μm，长宽比为1至1.5的球形填料。根据本发明的半导体器件的特征在于，其中的半导体芯片通过上述粘合剂结合到用于所述芯片的安装部件。

32. 发明授权

US06384149B2 Process for production of chlorinated polyvinyl chloride resin 有权
标题翻译：氯化聚氯乙烯树脂生产工艺
公开(公告)号：US06384149B2
公开(公告)日：2002-05-07
申请号：US09740365
申请日：2000-12-19
申请人： Tadashi Tadokoro , Takeyuki Suzuki , Minoru Isshiki
发明人： Tadashi Tadokoro , Takeyuki Suzuki , Minoru Isshiki
IPC分类号： C08F822
CPC分类号： C08F8/22 , C08F14/06
摘要： A polyvinyl chloride resin having an average particle diameter of not less than 150 &mgr;m and porosity at 31-1,011 psi of not less than 0.15 cc/g is suspended in an aqueous medium and chlorinated by blowing gaseous chlorine into the aqueous suspension. In this way, the floating resin formation during chlorination can be prevented and a chlorinated polyvinyl chloride resin excellent in free flow property and showing good resistance to initial discoloration and good thermal stability in heating and molding processes can be produced.
摘要翻译：将平均粒径不小于150μm的聚氯乙烯树脂和31-1,011psi的孔隙率不低于0.15cc / g悬浮在水性介质中，并通过将气态氯吹入水性悬浮液中进行氯化。这样可以防止氯化过程中的漂浮树脂的形成，并且可以制得自由流动性优异的氯化聚氯乙烯树脂，并且可以制得良好的抗初始变色性和在加热和模制过程中良好的热稳定性。

33. 发明授权

US06225433B1 Curable silicone composition and electronic components 有权
标题翻译：可固化有机硅组合物和电子元件
公开(公告)号：US06225433B1
公开(公告)日：2001-05-01
申请号：US09168811
申请日：1998-10-08
申请人： Minoru Isshiki , Katsutoshi Mine , Yoshiko Otani , Kimio Yamakawa
发明人： Minoru Isshiki , Katsutoshi Mine , Yoshiko Otani , Kimio Yamakawa
IPC分类号： C08G7708
CPC分类号： H01L24/32 , C08G77/12 , C08G77/16 , C08G77/20 , C08G77/70 , C08L83/00 , C08L83/04 , C09J183/04 , H01L21/563 , H01L24/83 , H01L2224/16225 , H01L2224/27013 , H01L2224/2919 , H01L2224/29191 , H01L2224/73203 , H01L2224/83051 , H01L2224/8319 , H01L2224/83855 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/14 , H01L2924/351 , Y10T428/31663 , H01L2924/0715 , H01L2924/00 , H01L2924/3512
摘要： A curable silicon composition, comprising (A) 100 parts by weight of an organopolysiloxane containing silicon-bonded aryl groups and at least two alkenyl groups per molecule, and having a viscosity of from 0.01 to 1,000 Pa.s at 25° C., wherein the aryl groups comprise from 1 to 40 mole % of the total silicon-bonded organic groups in the organopolysiloxane; (B) an organopolysiloxane having a viscosity of from 0.001 to 10 Pa.s at 25° C. and containing at least 2 silicon-bonded hydrogen atoms per molecule, in a quantity sufficient to cure the composition; (C) a platinum catalyst in a quantity sufficient to cure the composition; and (D) 0.00001 to 100 parts by weight of an organopolysiloxane having a viscosity of from 0.01 to 10,000 Pa.s at 25° C., with the proviso that when the organopolysiloxane contains aryl groups, the aryl groups comprise less than 1 mole % or more than 40 mole % of the total silicon-bonded organic groups in the organopolysiloxane, and wherein the organopolysiloxane cures to form a silicone having a complex modulus≦1×108 Pa at −65° C. and a shear frequency of 10 Hz or a cured silicone having a Young's modulus≦2.9×108 Pa at −65° C.
摘要翻译：一种可固化硅组合物，其包含（A）100重量份的每分子含硅键合芳基和至少两个烯基的有机聚硅氧烷，并且在25℃下具有0.01至1,000Pa.s的粘度，其中所述芳基包含有机聚硅氧烷中总硅键合有机基团的1至40摩尔％（B）在25℃下粘度为0.001至10Pa.s并且每分子含有至少2个硅键合的氢原子的有机聚硅氧烷，其量足以固化该组合物; （C）足以固化组合物的量的铂催化剂; 和（D）0.00001至100重量份在25℃下粘度为0.01至10,000Pa.s的有机聚硅氧烷，条件是当有机聚硅氧烷含有芳基时，芳基包含小于1摩尔％或多于40摩尔％的有机聚硅氧烷中总硅结合的有机基团，并且其中有机聚硅氧烷固化以形成在-65℃下的复数模量<= 1×108Pa和10Hz的剪切频率或在-65℃下具有杨氏模量<= 2.9×10 8 Pa的固化的硅氧烷

34. 发明授权

US6140423A Chlorinated vinyl chloride resin composition 有权
标题翻译：氯化氯乙烯树脂组合物
公开(公告)号：US6140423A
公开(公告)日：2000-10-31
申请号：US218140
申请日：1998-12-22
申请人： Takeyuki Suzuki , Toshio Okuhara , Minoru Isshiki
发明人： Takeyuki Suzuki , Toshio Okuhara , Minoru Isshiki
IPC分类号： C08L23/28 , C08L27/24 , C08L51/04 , C08L27/06 , B29D24/00
CPC分类号： C08L27/24 , C08L23/286 , C08L51/04
摘要： A chlorinated vinyl chloride resin composition, which is suitably used for the production of extruded pipes, containing a chlorinated vinyl chloride resin which has a polymerization degree of from 600 to 1500 prior to chlorination and a chlorination degree of from 62 to 70 wt. %, methyl methacrylate-butadiene-styrene copolymer particles having a butadiene content of less than 60 wt. % and a styrene content of larger than 30 wt. % in the whole particles, and a chlorinated polyethylene having a chlorine content of from 10 to 50 wt. %, in which the methyl methacrylate-butadiene-styrene copolymer particles have an average dispersed particle size of 2,000 angstroms or less in an extruded pipe produced from the composition.
摘要翻译：氯化氯乙烯树脂组合物，其适用于生产挤出管道，其含氯化氯乙烯树脂，氯化氯化氯化树脂的聚合度为600至1500，氯化度为62至70重量％。％，丁二烯含量小于60wt。％的甲基丙烯酸甲酯 - 丁二烯 - 苯乙烯共聚物颗粒。％，苯乙烯含量大于30wt。在整个颗粒中的含量为％，氯含量为10至50重量％的氯化聚乙烯。％，其中甲基丙烯酸甲酯 - 丁二烯 - 苯乙烯共聚物颗粒在由组合物制备的挤出管中的平均分散粒径为2000埃或更小。

35. 发明授权

US5958176A Electrical parts and method for manufacturing the same 失效
标题翻译：电气部件及其制造方法
公开(公告)号：US5958176A
公开(公告)日：1999-09-28
申请号：US899967
申请日：1997-07-24
申请人： Minoru Isshiki , Katsutoshi Mine , Kimio Yamakawa
发明人： Minoru Isshiki , Katsutoshi Mine , Kimio Yamakawa
IPC分类号： C08L83/06 , C08G59/18 , C08G77/14 , C08G77/22 , C08L83/04 , H01G4/224 , H01L23/24 , H01L23/29 , H01L23/31 , B27G11/02
CPC分类号： H01L23/296 , C08L83/04 , H01L23/24 , C08G77/12 , C08G77/16 , C08G77/20 , C08G77/70 , H01L2224/48091 , H01L2224/73265 , H01L2224/8592 , H01L2924/09701
摘要： An electrical part containing an electrical element, a cured silicone resin which has been treated with ultraviolet light, a cured sealing resin which has been integrally bonded to the UV treated silicone resin. The cured silicone resin is prepared from an addition reaction curable silicone composition which is a mixture or reaction mixture of (a) an organosiloxane which has silanol groups and (b) an alkoxysilane which has epoxy groups, and/or (c) an organosiloxane which can be expressed by the average unit formula(R.sup.1 SiO.sub.3/2).sub.a (R.sup.2.sub.2 SiO.sub.2/2).sub.b (R.sup.2.sub.3 SiO.sub.1/2).sub.c (R.sup.3 O.sub.1/2).sub.dwherein R.sup.1 is an epoxy group containing monovalent organic group R.sup.2 is monovalent hydrocarbon group, R.sup.3 is a hydrogen atom or an alkyl group with 1 to 4 carbon atoms, a, b and d are>0 and c is.gtoreq.0.A method for manufacturing an electrical part containing the steps (I) covering an electrical element with the above mentioned silicone composition; (ii) curing the silicone composition to form a cured silicone resin; (iii) subjecting the cured silicone resin to ultraviolet irradiation treatment; and (iv) sealing the cured silicone resin with a sealing resin.
摘要翻译：含有电气元件的电气部件，已经用紫外线处理过的固化的硅氧烷树脂，已固化的密封树脂已经与紫外线处理过的硅树脂整体结合。固化的有机硅树脂由加成反应固化的硅氧烷组合物制备，该组合物是（a）具有硅烷醇基的有机硅氧烷和（b）具有环氧基的烷氧基硅烷的混合物或反应混合物，和/或（c）有机硅氧烷，可以由平均单元式（R1SiO3 / 2）a（R22SiO2 / 2）b（R23SiO1 / 2）c（R3O1 / 2）d表示，其中R1是含有一价有机基团的环氧基，R2是一价烃基，R3是氢原子或碳原子数1〜4的烷基，a，b，d分别为0以上且c为0以上。一种制造电气部件的方法，该电气部件包含用上述硅酮组合物覆盖电气元件的步骤（I）（ii）固化硅氧烷组合物以形成固化的有机硅树脂; （iii）对固化的有机硅树脂进行紫外线照射处理; 和（iv）用密封树脂密封固化的硅氧烷树脂。

36. 发明授权

US5872194A Curable liquid-form composition, cured product of the same, and electronic part 失效
标题翻译：可固化的液态组合物，固化产物和电子部件
公开(公告)号：US5872194A
公开(公告)日：1999-02-16
申请号：US889377
申请日：1997-07-08
申请人： Minoru Isshiki , Katsutoshi Mine , Kimio Yamakawa
发明人： Minoru Isshiki , Katsutoshi Mine , Kimio Yamakawa
IPC分类号： C08L63/00 , C08L83/04 , C08L83/07 , H01L23/29 , H01L23/31 , C08F283/12
CPC分类号： C08L63/00 , C08L83/04 , C08G77/045 , C08G77/10 , C08G77/12 , C08G77/14 , C08G77/16 , C08G77/70 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , Y10T428/31663
摘要： A curable composition containing a curable liquid-form organopolysiloxane composition and a curable liquid-form organic resin composition. The organic resin composition is contained as liquid particles in the organopolysiloxane composition. A cured product formed by curing the abovementioned curable liquid composition such that the cured product contains fine particles of a cured organic resin in a cured organopolysiloxane matrix. An electronic part which is covered by the cured product of the abovementioned curable liquid-form composition.
摘要翻译：一种含有可固化液体形式的有机基聚硅氧烷组合物和可固化液体形式的有机树脂组合物的可固化组合物。有机树脂组合物作为液体颗粒包含在有机聚硅氧烷组合物中。通过固化上述可固化液体组合物形成的固化产物，使得固化产物在固化的有机聚硅氧烷基质中含有固化的有机树脂的细颗粒。由上述可固化液体形式组合物的固化产物覆盖的电子部件。

37. 发明授权

US4571279A Continuous process for producing reinforced resin laminates 失效
标题翻译：生产增强树脂层压板的连续工艺
公开(公告)号：US4571279A
公开(公告)日：1986-02-18
申请号：US555836
申请日：1983-11-28
申请人： Masayuki Oizumi , Masakazu Uekita , Masana Goto , Ichiro Azumi , Shoji Uozumi , Masaharu Abe , Yasuo Fushiki , Minoru Isshiki , Kunio Kawasaki
发明人： Masayuki Oizumi , Masakazu Uekita , Masana Goto , Ichiro Azumi , Shoji Uozumi , Masaharu Abe , Yasuo Fushiki , Minoru Isshiki , Kunio Kawasaki
IPC分类号： B32B37/00 , B29C57/00 , B29C63/00 , B29C67/00 , B29C70/00 , B29C70/50 , B32B15/08 , B32B27/04 , B32B38/08 , D21H25/06 , H05K1/03 , H05K3/02 , B32B31/00 , C09J5/02
CPC分类号： B32B38/08 , B29C70/50 , B32B27/04 , D21H25/06 , H05K1/0346 , H05K1/0366 , H05K2201/0145 , H05K2201/0166 , H05K2201/0284 , H05K2201/0293 , H05K2203/1545 , H05K3/022 , Y10S428/901 , Y10T156/1085 , Y10T29/49124 , Y10T442/3431 , Y10T442/3528 , Y10T442/656 , Y10T442/67
摘要： A continuous process for producing reinforced resin laminates comprising the steps of impregnating a fibrous substrate with a liquid resin which is free of volatile solvent and is capable of curing without generating liquid and gaseous byproducts, laminating a plurality of the resin-impregnated substrates into a unitary member, sandwiching the laminate between a pair of covering sheets, and curing the laminate between said pair of covering sheets without applying appreciable pressure. The improvement comprises adjusting the final resin content in said resin impregnated substrate at 10 to 90% by weight based on the total weight of said impregnated substrate.
摘要翻译：一种用于生产增强树脂层压板的连续方法，包括以下步骤：用不含挥发性溶剂的液体树脂浸渍纤维基材，并且能够固化而不产生液体和气体副产物，将多个浸渍树脂的基材层压成单一构件，将层压体夹在一对覆盖片之间，并且在施加明显的压力之间固化所述一对覆盖片之间的层压体。该改进包括基于所述浸渍的基材的总重量将所述树脂浸渍的基材中的最终树脂含量调节为10至90重量％。

38. 发明授权

US4451317A Continuous process for producing reinforced resin laminates 失效
标题翻译：生产增强树脂层压板的连续工艺
公开(公告)号：US4451317A
公开(公告)日：1984-05-29
申请号：US384438
申请日：1982-06-02
申请人： Masayuki Oizumi , Masakazu Uekita , Masana Goto , Ichiro Azumi , Shoji Uozumi , Masaharu Abe , Yasuo Fushiki , Minoru Isshiki , Kunio Kawasaki
发明人： Masayuki Oizumi , Masakazu Uekita , Masana Goto , Ichiro Azumi , Shoji Uozumi , Masaharu Abe , Yasuo Fushiki , Minoru Isshiki , Kunio Kawasaki
IPC分类号： B32B37/00 , B29C57/00 , B29C63/00 , B29C67/00 , B29C70/00 , B29C70/50 , B32B15/08 , B32B27/04 , B32B38/08 , D21H25/06 , H05K1/03 , H05K3/02 , C09J5/02
CPC分类号： B32B38/08 , B29C70/50 , B32B27/04 , D21H25/06 , H05K1/0346 , H05K1/0366 , H05K2201/0145 , H05K2201/0166 , H05K2201/0284 , H05K2201/0293 , H05K2203/1545 , H05K3/022 , Y10S428/901 , Y10T156/1085 , Y10T29/49124 , Y10T442/3431 , Y10T442/3528 , Y10T442/656 , Y10T442/67
摘要： A continuous process for producing reinforced resin laminates comprising the steps of impregnating a fibrous substrate with a liquid resin which is free of volatile solvent and is capable of curing without generating liquid and gaseous byproducts, laminating a plurality of the resin-impregnated substrates into a unitary member, sandwiching the laminate between a pair of covering sheets, and curing the laminate between said pair of covering sheets without applying appreciable pressure. The improvement comprises adjusting the final resin content in said resin impregnated substrate at 10 to 90% by weight based on the total weight of said impregnated substrate.
摘要翻译：一种用于生产增强树脂层压板的连续方法，包括以下步骤：用不含挥发性溶剂的液体树脂浸渍纤维基材，并且能够固化而不产生液体和气体副产物，将多个浸渍树脂的基材层压成单一构件，将层压体夹在一对覆盖片之间，并且在施加明显的压力之间固化所述一对覆盖片之间的层压体。该改进包括基于所述浸渍的基材的总重量将所述树脂浸渍的基材中的最终树脂含量调节为10至90重量％。

39. 发明授权

US08338527B2 Curable silicone composition and electronic components 失效
标题翻译：可固化有机硅组合物和电子元件
公开(公告)号：US08338527B2
公开(公告)日：2012-12-25
申请号：US11912643
申请日：2006-04-27
申请人： Yoshitsugu Morita , Minoru Isshiki , Tomoko Kato
发明人： Yoshitsugu Morita , Minoru Isshiki , Tomoko Kato
IPC分类号： C08L83/06 , C08G77/14
CPC分类号： C08G59/686 , C08G59/3254 , C08G59/4085 , C08L83/06 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/92125 , H01L2924/00011 , H01L2924/00014 , C08L83/00 , H01L2224/0401
摘要： A curable silicone composition comprising: (A) an organopolysiloxane that is represented by a specific average unit formula and that has at least two of the aforementioned epoxy-functional monovalent organic groups in each molecule; (B) a diorganosiloxane represented by the general formula: A-R5—(R42SiO)mR42Si—R5-A, wherein R4 is substituted or unsubstituted mono-valent hydrocarbon group that does not contain an aliphatically unsaturated bond, R5 is a divalent organic group, A is a siloxane residue with a specific average unit formula, and m is an integer with a value of at least 1; and (C) a curing agent for epoxy resin, exhibits excellent handling and curing characteristics and that cures to give a cured product that exhibits excellent flexibility and adhesiveness.
摘要翻译：一种可固化的有机硅组合物，其包含：（A）由特定平均单元式表示并且在每个分子中具有至少两个上述环氧官能的一价有机基团的有机聚硅氧烷; （B）由以下通式表示的二有机硅氧烷：A-R5-（R42SiO）mR42Si-R5-A，其中R4是不含脂族不饱和键的取代或未取代的一价烃基，R5是二价有机基团 A是具有特定平均单元式的硅氧烷残基，m是至少为1的整数; 和（C）环氧树脂固化剂，具有优异的处理和固化特性，并且可以固化，得到表现出优异的柔软性和粘合性的固化产物。

40. 发明授权

US07863399B2 Curing silicone composition and cured product thereof 有权
标题翻译：固化硅酮组合物及其固化产物
公开(公告)号：US07863399B2
公开(公告)日：2011-01-04
申请号：US10584655
申请日：2004-12-20
申请人： Yoshitsugu Morita , Minoru Isshiki , Hiroshi Ueki , Hiroji Enami
发明人： Yoshitsugu Morita , Minoru Isshiki , Hiroshi Ueki , Hiroji Enami
IPC分类号： C08G77/00
CPC分类号： C08L63/00 , C08G59/306 , C08G59/3254 , C08L83/06 , C08L83/00
摘要： A curable silicone composition comprising: (A) an organopolysiloxane that has a branched molecular structure and contains in one molecule at least two univalent hydrocarbon groups with phenolic hydroxyl groups therein; (B) a linear-chain organopolysiloxane having at least two univalent hydroxyl groups with epoxy groups that are free of aromatic rings; and (C) a curing accelerator.
摘要翻译：一种可固化有机硅组合物，其包含：（A）具有支链分子结构并在一个分子中含有至少两个具有酚羟基的一价烃基的有机聚硅氧烷; （B）具有至少两个不含芳环的环氧基的单价羟基的直链有机聚硅氧烷; 和（C）固化促进剂。

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