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31. 发明申请

US20110048063A1 COMPONENT FOR SOLAR ADSORPTION REFRIGERATION SYSTEM AND METHOD OF MAKING SUCH COMPONENT 有权
标题翻译：太阳能吸附制冷系统的组件和制造这种组件的方法
公开(公告)号：US20110048063A1
公开(公告)日：2011-03-03
申请号：US12666208
申请日：2008-06-22
申请人： J. Donald Carruthers , Karl Boggs , Luping Wang , Shaun Wilson , Jose I. Arno , Paul J. Marganski , Steven M. Bilodeau , Peng Zou , Brian Bobita , Joseph D. Sweeney , Douglas Edwards
发明人： J. Donald Carruthers , Karl Boggs , Luping Wang , Shaun Wilson , Jose I. Arno , Paul J. Marganski , Steven M. Bilodeau , Peng Zou , Brian Bobita , Joseph D. Sweeney , Douglas Edwards
IPC分类号： F25B15/00 , B01J20/00 , C09K5/00 , C01B31/08 , B01J20/26
CPC分类号： B01J20/26 , B01J20/20 , B01J20/28054 , B01J20/28092 , B01J20/30 , B01J20/305 , B01J20/3078 , B01J2220/445 , C09K5/047 , F25B17/08 , F25B27/007 , F25B35/04 , F25B37/00 , F25B2500/01
摘要： An adsorption structure is described that includes at least one adsorbent member formed of an adsorbent material and at least one porous member provided in contact with a portion of the adsorbent member to allow gas to enter and exit the portion of the adsorbent member. Such adsorption structure is usefully employed in adsorbent-based refrigeration systems. A method also is described for producing an adsorbent material, in which a first polymeric material is provided having a first density and a second polymeric material is provided having a second density, in which the second polymeric material is in contact with the first polymeric material to form a structure. The structure is pyrolyzed to form a porous adsorbent material including a first region corresponding to the first polymeric material and a second region corresponding to the second polymeric material, in which at least one of the pore sizes and the pore distribution differs between the first region and the second region.
摘要翻译：描述了吸附结构，其包括由吸附剂材料形成的至少一个吸附构件和与吸附构件的一部分接触设置的至少一个多孔构件，以允许气体进入和离开吸附构件的该部分。这种吸附结构在吸附剂型制冷系统中有用。描述了一种用于生产吸附材料的方法，其中提供具有第一密度的第一聚合物材料，并且提供具有第二密度的第二聚合物材料，其中第二聚合物材料与第一聚合物材料接触，形成一个结构。该结构被热解以形成多孔吸附材料，其包括对应于第一聚合物材料的第一区域和对应于第二聚合物材料的第二区域，其中孔径和孔分布中的至少一个在第一区域和第第二个地区。

32. 发明授权

US07857880B2 Semiconductor manufacturing facility utilizing exhaust recirculation 有权
标题翻译：利用排气再循环的半导体制造设备
公开(公告)号：US07857880B2
公开(公告)日：2010-12-28
申请号：US12364800
申请日：2009-02-03
申请人： W. Karl Olander , Joseph D. Sweeney , Luping Wang
发明人： W. Karl Olander , Joseph D. Sweeney , Luping Wang
IPC分类号： B01D46/00
CPC分类号： C23C14/48 , B01D53/74 , C23C14/564 , Y10S438/905 , Y10S438/909
摘要： A semiconductor manufacturing process facility requiring use therein of air exhaust for its operation, such facility including clean room and gray room components, with the clean room having at least one semiconductor manufacturing tool therein, and wherein air exhaust is flowed through a region of the clean room. The facility includes an air exhaust treatment apparatus arranged to (i) receive air exhaust after flow thereof through said region of said clean room, (ii) produce a treated air exhaust, and (iii) recirculate the treated air exhaust to an ambient air environment in the facility, e.g., to the gray room of the facility.
摘要翻译：一种半导体制造工艺设备，其中需要使用其中的排气用于其操作，这种设施包括洁净室和灰色房间部件，洁净室在其中具有至少一个半导体制造工具，并且其中排气流过干净的区域房间。该设施包括排气处理设备，其布置成（i）在其流过所述洁净室的所述区域之后接收排气，（ii）产生经处理的排气，以及（iii）将经处理的排气再循环到环境空气环境在设施中，例如，到设施的灰色房间。

33. 发明授权

US07798168B2 Pressure-based gas delivery system and method for reducing risks associated with storage and delivery of high pressure gases 有权
标题翻译：基于压力的气体输送系统和降低高压气体储存和输送相关风险的方法
公开(公告)号：US07798168B2
公开(公告)日：2010-09-21
申请号：US12615722
申请日：2009-11-10
申请人： W. Karl Olander , Matthew B. Donatucci , Luping Wang , Michael J. Wodjenski
发明人： W. Karl Olander , Matthew B. Donatucci , Luping Wang , Michael J. Wodjenski
IPC分类号： F16K3/36 , B08B9/027 , G05B11/01
CPC分类号： F17C13/04 , F17C5/00 , F17C2201/0109 , F17C2201/0119 , F17C2201/032 , F17C2201/056 , F17C2201/058 , F17C2205/0111 , F17C2205/0176 , F17C2205/0326 , F17C2205/0332 , F17C2205/0335 , F17C2205/0338 , F17C2205/0341 , F17C2205/0391 , F17C2205/0394 , F17C2221/012 , F17C2221/014 , F17C2221/016 , F17C2221/037 , F17C2221/05 , F17C2223/0123 , F17C2223/036 , F17C2225/0123 , F17C2225/033 , F17C2225/035 , F17C2225/038 , F17C2227/044 , F17C2227/045 , F17C2250/032 , F17C2250/043 , F17C2260/036 , F17C2260/044 , F17C2270/0518 , Y02E60/321 , Y10T137/0324 , Y10T137/0419 , Y10T137/2569 , Y10T137/4259 , Y10T137/7759 , Y10T137/7761 , Y10T137/7762 , Y10T137/7793 , Y10T137/8158 , Y10T137/87249
摘要： Apparatus and method for dispensing a gas using a gas source coupled in selective flow relationship with a gas manifold. The gas manifold includes flow circuitry for discharging gas to a gas-using zone, and the gas source includes a pressure-regulated gas source vessel containing the gas at superatmospheric pressure. The pressure-regulated gas source vessel can be arranged with a pressure regulator at or within the vessel and a flow control valve coupled in flow relationship to the vessel, so that gas dispensed from the vessel flows through the regulator prior to flow through the flow control valve, and into the gas manifold. The apparatus and method permit an enhancement of the safety of storage and dispensing of toxic or otherwise hazardous gases used in semiconductor processes.
摘要翻译：使用与气体歧管以选择性流动关系耦合的气体源分配气体的装置和方法。气体歧管包括用于将气体排放到气体使用区域的流动回路，并且气体源包括在超大气压下容纳气体的压力调节气体源容器。压力调节的气体源容器可以布置有在容器内或容器内的压力调节器，以及与容器流动关系的流量控制阀，使得从容器分配的气体在流过流量控制器之前流过调节器阀，并进入气体歧管。该装置和方法允许提高半导体工艺中使用的有毒或其他有害气体的储存和分配的安全性。

34. 发明申请

US20100059694A1 PRESSURE-BASED GAS DELIVERY SYSTEM AND METHOD FOR REDUCING RISKS ASSOCIATED WITH STORAGE AND DELIVERY OF HIGH PRESSURE GASES 有权
标题翻译：基于压力的气体输送系统和减少与储存和输送高压气体有关的风险的方法
公开(公告)号：US20100059694A1
公开(公告)日：2010-03-11
申请号：US12615722
申请日：2009-11-10
申请人： W. Karl Olander , Matthew B. Donatucci , Luping Wang , Michael J. Wodjenski
发明人： W. Karl Olander , Matthew B. Donatucci , Luping Wang , Michael J. Wodjenski
IPC分类号： G21K5/00 , F16K31/12
CPC分类号： F17C13/04 , F17C5/00 , F17C2201/0109 , F17C2201/0119 , F17C2201/032 , F17C2201/056 , F17C2201/058 , F17C2205/0111 , F17C2205/0176 , F17C2205/0326 , F17C2205/0332 , F17C2205/0335 , F17C2205/0338 , F17C2205/0341 , F17C2205/0391 , F17C2205/0394 , F17C2221/012 , F17C2221/014 , F17C2221/016 , F17C2221/037 , F17C2221/05 , F17C2223/0123 , F17C2223/036 , F17C2225/0123 , F17C2225/033 , F17C2225/035 , F17C2225/038 , F17C2227/044 , F17C2227/045 , F17C2250/032 , F17C2250/043 , F17C2260/036 , F17C2260/044 , F17C2270/0518 , Y02E60/321 , Y10T137/0324 , Y10T137/0419 , Y10T137/2569 , Y10T137/4259 , Y10T137/7759 , Y10T137/7761 , Y10T137/7762 , Y10T137/7793 , Y10T137/8158 , Y10T137/87249
摘要： Apparatus and method for dispensing a gas using a gas source coupled in selective flow relationship with a gas manifold. The gas manifold includes flow circuitry for discharging gas to a gas-using zone, and the gas source includes a pressure-regulated gas source vessel containing the gas at superatmospheric pressure. The pressure-regulated gas source vessel can be arranged with a pressure regulator at or within the vessel and a flow control valve coupled in flow relationship to the vessel, so that gas dispensed from the vessel flows through the regulator prior to flow through the flow control valve, and into the gas manifold. The apparatus and method permit an enhancement of the safety of storage and dispensing of toxic or otherwise hazardous gases used in semiconductor processes.
摘要翻译：使用与气体歧管以选择性流动关系耦合的气体源分配气体的装置和方法。气体歧管包括用于将气体排放到气体使用区域的流动回路，并且气体源包括在超大气压下容纳气体的压力调节气体源容器。压力调节的气体源容器可以布置有在容器内或容器内的压力调节器，以及与容器流动关系的流量控制阀，使得从容器分配的气体在流过流量控制器之前流过调节器阀，并进入气体歧管。该装置和方法允许提高半导体工艺中使用的有毒或其他有害气体的储存和分配的安全性。

35. 发明申请

US20050224116A1 Pressure-based gas delivery system and method for reducing risks associated with storage and delivery of high pressure gases 有权
公开(公告)号：US20050224116A1
公开(公告)日：2005-10-13
申请号：US11062509
申请日：2005-02-22
申请人： W. Olander , Matthew Donatucci , Luping Wang , Michael Wodjenski
发明人： W. Olander , Matthew Donatucci , Luping Wang , Michael Wodjenski
IPC分类号： F17C7/00 , F17C5/00 , F16K3/36
CPC分类号： F17C13/04 , F17C5/00 , F17C2201/0109 , F17C2201/0119 , F17C2201/032 , F17C2201/056 , F17C2201/058 , F17C2205/0111 , F17C2205/0176 , F17C2205/0326 , F17C2205/0332 , F17C2205/0335 , F17C2205/0338 , F17C2205/0341 , F17C2205/0391 , F17C2205/0394 , F17C2221/012 , F17C2221/014 , F17C2221/016 , F17C2221/037 , F17C2221/05 , F17C2223/0123 , F17C2223/036 , F17C2225/0123 , F17C2225/033 , F17C2225/035 , F17C2225/038 , F17C2227/044 , F17C2227/045 , F17C2250/032 , F17C2250/043 , F17C2260/036 , F17C2260/044 , F17C2270/0518 , Y02E60/321 , Y10T137/0324 , Y10T137/0419 , Y10T137/2569 , Y10T137/4259 , Y10T137/7759 , Y10T137/7761 , Y10T137/7762 , Y10T137/7793 , Y10T137/8158 , Y10T137/87249
摘要： Apparatus and method for dispensing a gas using a gas source coupled in selective flow relationship with a gas manifold. The gas manifold includes flow circuitry for discharging gas to a gas-using zone, and the gas source includes a pressure-regulated gas source vessel containing the gas at superatmospheric pressure. The pressure-regulated gas source vessel can be arranged with a pressure regulator at or within the vessel and a flow control valve coupled in flow relationship to the vessel, so that gas dispensed from the vessel flows through the regulator prior to flow through the flow control valve, and into the gas manifold. The apparatus and method permit an enhancement of the safety of storage and dispensing of toxic or otherwise hazardous gases used in semiconductor processes.

36. 发明授权

US06909839B2 Delivery systems for efficient vaporization of precursor source material 有权
公开(公告)号：US06909839B2
公开(公告)日：2005-06-21
申请号：US10625179
申请日：2003-07-23
申请人： Luping Wang , Thomas H. Baum , Chongying Xu
发明人： Luping Wang , Thomas H. Baum , Chongying Xu
IPC分类号： B01D1/00 , B01D7/00 , C23C14/00 , C23C16/00 , C23C16/448
CPC分类号： C23C16/4481 , B01D1/0082
摘要： The present invention relates to a delivery system for vaporizing and delivering vaporized solid and liquid precursor materials at a controlled rate having particular utility for semiconductor manufacturing applications. The system includes a vaporization vessel, a processing tool and a connecting vapor line therebetween, where the system further includes an input flow controller and/or an output flow controller to provide a controlled delivery of a vaporizable source material to the vaporization vessel and a controlled flow rate of vaporized source material to the processing tool.

37. 发明授权

US06805728B2 Method and apparatus for the abatement of toxic gas components from a semiconductor manufacturing process effluent stream 失效
标题翻译：用于从半导体制造工艺流出物流中减少有毒气体组分的方法和装置
公开(公告)号：US06805728B2
公开(公告)日：2004-10-19
申请号：US10314727
申请日：2002-12-09
申请人： Joseph D. Sweeney , Paul J. Marganski , W. Karl Olander , Luping Wang
发明人： Joseph D. Sweeney , Paul J. Marganski , W. Karl Olander , Luping Wang
IPC分类号： B01D5304
CPC分类号： B01D53/0407 , B01D2253/10 , B01D2253/112 , B01D2253/304 , B01D2257/2022 , B01D2257/2025 , B01D2257/2027 , B01D2257/204 , B01D2257/2042 , B01D2257/2045 , B01D2257/2047 , B01D2257/206 , B01D2257/406 , B01D2257/70 , B01D2258/0216 , B01D2259/4146
摘要： An apparatus and process for abating at least one acid or hydride gas component or by-product thereof, from an effluent stream deriving from a semiconductor manufacturing process, comprising, a first sorbent bed material having a high capacity sorbent affinity for the acid or hydride gas component, a second and discreet sorbent bed material having a high capture rate sorbent affinity for the same gas component, and a flow path joining the process in gas flow communication with the sorbent bed materials such that effluent is flowed through the sorbent beds, to reduce the acid or hydride gas component. The first sorbent bed material preferably comprises basic copper carbonate and the second sorbent bed preferably comprises at least one of, CuO, AgO, CoO, Co3O4, ZnO, MnO2 and mixtures thereof.
摘要翻译：一种用于从源自半导体制造工艺的流出物流中减轻至少一种酸或氢气体组分或其副产物的装置和方法，包括：具有对酸或氢化物气体具有高容量吸附剂亲和性的第一吸附剂床材料组分，具有对相同气体组分的高捕获率吸附剂亲和力的第二和离散的吸附剂床材料，以及将流程连接到与吸附剂床材料气流连通的流路，使得流出物流过吸附剂床，以减少酸或氢气组分。第一吸附剂床材料优选包含碱式碳酸铜，第二吸附剂床优选包含CuO，AgO，CoO，Co 3 O 4，ZnO，MnO 2及其混合物中的至少一种。

38. 发明授权

US06592653B2 Fluid storage and delivery system utilizing low heels carbon sorbent medium 有权
标题翻译：使用低跟鞋碳吸附剂介质的流体储存和输送系统
公开(公告)号：US06592653B2
公开(公告)日：2003-07-15
申请号：US10020268
申请日：2001-11-12
申请人： Luping Wang , Joseph Salsbury
发明人： Luping Wang , Joseph Salsbury
IPC分类号： B01D5304
CPC分类号： B01D53/0407 , B01D2253/102 , B01D2259/40083 , B01D2259/4525 , B01D2259/455 , B01J20/20 , Y10S95/903
摘要： A fluid storage and dispensing system including a vessel containing a low heel carbon sorbent having fluid adsorbed thereon, with the system arranged to effect desorption of the fluid from the sorbent for dispensing of fluid on demand. The low heel carbon sorbent preferably is characterized by at least one of the following characteristics: (i) Heel, measured for gaseous arsine (AsH3) at 20° C. at 20 Torr, of not more than 50 grams AsH3 per liter of bed of the sorbent material; (ii) Heel, measured for gaseous boron trifluoride (BF3) at 20° C. at 20 Torr, of not more than 20 grams boron trifloride per liter of bed of the sorbent material; (iii) Heel, measured for gaseous germanium tetrafluoride (GeF4) at 20° C. at 20 Torr, of not more than 250 grams AsH3 per liter of bed of the sorbent material; (iv) Heel, measured for gaseous arsenic pentafluoride (AsF5) at 20° C. at 20 Torr, of not more than 700 grams AsF5 per liter of bed of the sorbent material; (v) Heel, measured for gaseous trimethyl silane (3MS) at 20° C. at 20 Torr, of not more than 160 grams 3MS per liter of bed of the sorbent material; and (vi) Heel, measured for gaseous ethane (C2H4) at 21° C. at 25 Torr, of not more than 10 grams ethane per liter of bed of the sorbent material.
摘要翻译：一种流体存储和分配系统，包括容纳含有吸附在其上的流体的低跟踪碳吸附剂的容器，该系统被设置成实现流体从吸附剂的解吸，用于根据需要分配流体。优选地，低跟碳酸吸着剂的特征在于以下特征中的至少一个：（i）在20乇下在20℃下测量的气态胂（AsH 3）的鞋跟，每升床不超过50克AsH 3 吸附剂材料; （ii）在20乇下在20℃下测量气态三氟化硼（BF 3）的鞋跟，每升吸附剂材料床不超过20克三氯化硼; （iii）在20乇下在20℃下测量气态四氟化锗（GeF 4）的鞋跟，每升吸附剂材料床不超过250克AsH 3; （iv）在20乇下在20℃下测量气态五氧化二砷（AsF5）的鞋跟，每升吸附剂材料床不超过700克AsF5; （v）在20乇下在20℃下测量气态三甲基硅烷（3MS）的鞋跟，每升吸附剂材料床不超过160克3MS; 和（vi）在21℃，25乇下测量气态乙烷（C 2 H 4）的鞋跟，每升吸附剂材料床不超过10克乙烷。

39. 发明授权

US06257000B1 Fluid storage and dispensing system featuring interiorly disposed and exteriorly adjustable regulator for high flow dispensing of gas 有权
标题翻译：流体储存和分配系统，具有内部布置和可外部调节的调节器，用于高流量分配气体
公开(公告)号：US06257000B1
公开(公告)日：2001-07-10
申请号：US09532268
申请日：2000-03-22
申请人： Luping Wang
发明人： Luping Wang
IPC分类号： F17C704
CPC分类号： F17C9/00 , F17C7/00 , F17C13/025 , F17C13/04 , F17C2201/0109 , F17C2201/0114 , F17C2201/032 , F17C2201/056 , F17C2203/0636 , F17C2203/066 , F17C2203/0663 , F17C2205/018 , F17C2205/0326 , F17C2205/0329 , F17C2205/0338 , F17C2205/0341 , F17C2205/0385 , F17C2205/0391 , F17C2205/0394 , F17C2221/014 , F17C2221/016 , F17C2221/017 , F17C2223/033 , F17C2223/035 , F17C2223/036 , F17C2223/038 , F17C2227/044 , F17C2250/0626 , F17C2250/0636 , F17C2250/072 , F17C2270/0518 , Y02E60/321
摘要： A fluid storage and dispensing system including a vessel for holding a fluid, an adjustable set point pressure regulator in the interior volume of the vessel, a dispensing assembly in fluid flow communication with the regulator for dispensing fluid at a pressure determined by the set point of the regulator, and an adjusting assembly exterior to the vessel for in situ adjustment of the set point of the internally disposed regulator. By such arrangement, fluid storage and dispensing operations can have respectively differing regulator set point pressures, as for example a sub-atmospheric pressure set point for storage and a super-atmospheric pressure set point for dispensing.
摘要翻译：流体存储和分配系统，包括用于保持流体的容器，在容器的内部容积中的可调节的设定点压力调节器，与调节器流体流动连通的分配组件，用于以由设定点调节器和调节组件，用于原位调节内部调节器的设定点。通过这种布置，流体储存和分配操作可以具有分别不同的调节器设定点压力，例如用于储存的次大气压力设定点和用于分配的超大气压力设定点。

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