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    • 35. 发明申请
    • DEVELOPABLE BOTTOM ANTIREFLECTIVE COATING COMPOSITIONS FOR NEGATIVE RESISTS
    • 可开发的底部抗反射涂层组合物
    • US20130040238A1
    • 2013-02-14
    • US13206796
    • 2011-08-10
    • KUANG-JUNG CHENSteven J. HolmesWu-Song HuangSen Liu
    • KUANG-JUNG CHENSteven J. HolmesWu-Song HuangSen Liu
    • G03F7/004G03F7/20
    • G03F7/0382C09J133/14G03F7/091G03F7/094G03F7/095
    • A negative developable bottom antireflective coating (NDBARC) material includes a polymer containing an aliphatic alcohol moiety, an aromatic moiety, and a carboxylic acid moiety. The NDBARC composition is insoluble in a typical resist solvent such as propylene glycol methyl ether acetate (PGMEA) after coating and baking. The NDBARC material also includes a photoacid generator, and optionally a crosslinking compound. In the NDBARC material, the carboxylic acid provides the developer solubility, while the alcohol alone, the carboxylic acid alone, or their combination provides the PGMEA resistance. The NDBARC material has resistance to the resist solvent, and thus, intermixing does not occur between NDBARC and resist during resist coating over NDBARC. After exposure and bake, the lithographically exposed portions of both the negative photoresist and the NDBARC layer become insoluble in developer due to the chemically amplified crosslinking of the polymers in negative resist and NDBARC layer in the lithographically exposed portions.
    • 负显影底部抗反射涂层(NDBARC)材料包括含有脂族醇部分,芳族部分和羧酸部分的聚合物。 NDBARC组合物在涂布和烘烤后不溶于典型的抗蚀剂溶剂如丙二醇甲基醚乙酸酯(PGMEA)。 NDBARC材料还包括光致酸发生剂和任选的交联化合物。 在NDBARC材料中,羧酸提供了显影剂的溶解度,而单独的醇,单独的羧酸或它们的组合提供了PGMEA的抗性。 NDBARC材料对抗蚀剂溶剂具有抗性,因此在NDBARC的抗蚀涂层期间,NDBARC和抗蚀剂之间不会发生混合。 在曝光和烘烤之后,由于在光刻曝光部分中的负光刻胶和NDBARC层中的聚合物的化学扩展交联,负光致抗蚀剂和NDBARC层的光刻曝光部分变得不溶于显影剂。
    • 37. 发明授权
    • Photoresist compositions
    • 光刻胶组合物
    • US08846296B2
    • 2014-09-30
    • US13461960
    • 2012-05-02
    • Kuang-Jung ChenWu-Song HuangRanee Wai-Ling KwongSen LiuPushkara R. Varanasi
    • Kuang-Jung ChenWu-Song HuangRanee Wai-Ling KwongSen LiuPushkara R. Varanasi
    • G03F7/004G03F7/028
    • G03F7/038G03F7/0045G03F7/0382G03F7/0392G03F7/095G03F7/20G03F7/2022G03F7/30G03F7/38G03F7/70466Y10S430/12
    • A composition is provided. The composition includes a polymer and a photosensitive acid generator capable of generating a first amount of acid upon exposure to a first dose of radiation and a second amount of acid upon exposure to a second dose of radiation. The second amount of acid is greater than the first amount of acid. The second dose is greater than the first dose. The composition includes a photosensitive base generator capable of generating a first amount of base upon exposure to the first dose and a second amount of base upon exposure to the second dose, where the first amount of base is greater than the first amount of acid and the second amount of base is less than the second amount of acid. The photosensitive base generator may include benzoin carbamates, O-carbamoylhydroxylamines, O-carbamoyloximes, aromatic sulfonamides, α-lactones, N-(2-Arylethenyl)amides, azides, amides, oximines, quaternary ammonium salts, or amineimides.
    • 提供了组合物。 组合物包括聚合物和感光酸产生剂,其能够在暴露于第一剂量的辐射时产生第一量的酸,并且在暴露于第二剂量的辐射时能够产生第二量的酸。 第二量的酸大于第一量的酸。 第二剂量大于第一剂量。 所述组合物包括能够在暴露于第一剂量时产生第一量碱的光敏碱产生剂,以及暴露于第二剂量时第二量的碱,其中第一量的碱大于第一量的酸, 碱的第二量少于第二量的酸。 光敏基底产生剂可以包括安息香氨基甲酸酯,O-氨基甲酰羟基胺,O-氨基甲酰肟,芳族磺酰胺,α-内酯,N-(2-亚乙烯基)酰胺,叠氮化物,酰胺,肟,季铵盐或胺酰胺。
    • 38. 发明授权
    • Developable bottom antireflective coating compositions for negative resists
    • 用于负性抗蚀剂的可开发的底部抗反射涂料组合物
    • US08715907B2
    • 2014-05-06
    • US13206796
    • 2011-08-10
    • Kuang-Jung ChenSteven J. HolmesWu-Song HuangSen Liu
    • Kuang-Jung ChenSteven J. HolmesWu-Song HuangSen Liu
    • G03F7/09G03F7/11G03F7/30
    • G03F7/0382C09J133/14G03F7/091G03F7/094G03F7/095
    • A negative developable bottom antireflective coating (NDBARC) material includes a polymer containing an aliphatic alcohol moiety, an aromatic moiety, and a carboxylic acid moiety. The NDBARC composition is insoluble in a typical resist solvent such as propylene glycol methyl ether acetate (PGMEA) after coating and baking. The NDBARC material also includes a photoacid generator, and optionally a crosslinking compound. In the NDBARC material, the carboxylic acid provides the developer solubility, while the alcohol alone, the carboxylic acid alone, or their combination provides the PGMEA resistance. The NDBARC material has resistance to the resist solvent, and thus, intermixing does not occur between NDBARC and resist during resist coating over NDBARC. After exposure and bake, the lithographically exposed portions of both the negative photoresist and the NDBARC layer become insoluble in developer due to the chemically amplified crosslinking of the polymers in negative resist and NDBARC layer in the lithographically exposed portions.
    • 负显影底部抗反射涂层(NDBARC)材料包括含有脂族醇部分,芳族部分和羧酸部分的聚合物。 NDBARC组合物在涂布和烘烤后不溶于典型的抗蚀剂溶剂如丙二醇甲基醚乙酸酯(PGMEA)。 NDBARC材料还包括光致酸发生剂和任选的交联化合物。 在NDBARC材料中,羧酸提供了显影剂的溶解度,而单独的醇,单独的羧酸或它们的组合提供了PGMEA的抗性。 NDBARC材料对抗蚀剂溶剂具有抗性,因此在NDBARC的抗蚀涂层期间,NDBARC和抗蚀剂之间不会发生混合。 在曝光和烘烤之后,由于在光刻曝光部分中的负光刻胶和NDBARC层中的聚合物的化学扩展交联,负光致抗蚀剂和NDBARC层的光刻曝光部分变得不溶于显影剂。