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31. 发明申请

US20060188098A1 Encryption/decryption device, communication controller, and electronic instrument 审中-公开
标题翻译：加密/解密设备，通信控制器和电子仪器
公开(公告)号：US20060188098A1
公开(公告)日：2006-08-24
申请号：US11355999
申请日：2006-02-17
申请人： Tomonori Kumagai , Nobuyuki Saito , Mitsuhiro Matsuo
发明人： Tomonori Kumagai , Nobuyuki Saito , Mitsuhiro Matsuo
IPC分类号： H04N7/167
CPC分类号： H04L9/0637 , H04L2209/60
摘要： An encryption/decryption device includes an encryption/decryption processing section which performs encryption or decryption processing for divided data of first and second content data in an operation mode of a block cipher method using data in a block other than a block under processing, and an intermediate value storage section which stores a processing result or an input value of the encryption/decryption processing section in content units. After the processing result or the input value of the encryption/decryption processing section for one of the divided data of the second content data has been stored in the intermediate value storage section, the processing result or the input value for the Kth divided data of the first content data is read from the intermediate value storage section, and the encryption/decryption processing section performs the encryption or decryption processing for the (K+1)th divided data of the first content data by using the processing result or the input value.
摘要翻译：一种加密/解密装置包括：加密/解密处理部分，其使用在处理中的块以外的块中的数据的块密码方法的操作模式中对第一和第二内容数据的划分数据执行加密或解密处理，中间值存储部，其以内容单位存储加密/解密处理部的处理结果或输入值。在第二内容数据的划分数据之一的处理结果或加密/解密处理部分的输入值已被存储在中间值存储部分中之后，处理结果或第K个分割数据的输入值从中间值存储部分读取第一内容数据，并且加密/解密处理部分通过使用处理结果或输入值来执行第一内容数据的第（K + 1）个划分数据的加密或解密处理。

32. 发明授权

US07038310B1 Power module with improved heat dissipation 有权
标题翻译：功率模块具有改善的散热性能
公开(公告)号：US07038310B1
公开(公告)日：2006-05-02
申请号：US09587768
申请日：2000-06-06
申请人： Seiichi Nakatani , Koichi Hirano , Mitsuhiro Matsuo , Hiroyuki Handa
发明人： Seiichi Nakatani , Koichi Hirano , Mitsuhiro Matsuo , Hiroyuki Handa
IPC分类号： H01L23/10 , H01L23/34
CPC分类号： H01L21/6835 , H01L21/568 , H01L23/3107 , H01L23/36 , H01L23/4951 , H01L23/4952 , H01L23/49524 , H01L23/49575 , H01L23/5389 , H01L24/81 , H01L25/16 , H01L2224/16 , H01L2224/16245 , H01L2224/81801 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/3025 , H01L2924/00 , H01L2224/0401
摘要： The invention provides a power module that is excellent in heat dissipation and suitable for the trend of miniaturization with high density, and provides also a method of manufacturing the same. The power module includes an insulating layer including an inorganic filler and a thermosetting resin composition, a lead formed on the surface of the insulating layer, and a semiconductor chip mounted on a insulating layer side of the lead, and a heat sink formed on the backside of the insulating layer. The semiconductor chip is mounted on the lead by flip-chip bonding and sealed in the insulating layer.
摘要翻译：本发明提供一种功率模块，该功率模块具有优异的散热性，适合于高密度小型化的趋势，并且还提供了一种制造该功率模块的方法。功率模块包括绝缘层，其包括无机填料和热固性树脂组合物，形成在绝缘层的表面上的引线和安装在引线的绝缘层侧的半导体芯片，以及形成在背面的散热片的绝缘层。半导体芯片通过倒装芯片接合安装在引线上并密封在绝缘层中。

33. 发明授权

US06860004B2 Method of manufacturing a thermally conductive circuit board with a ground pattern connected to a heat sink 有权
标题翻译：制造具有连接到散热器的接地图案的导热电路板的方法
公开(公告)号：US06860004B2
公开(公告)日：2005-03-01
申请号：US10309707
申请日：2002-12-03
申请人： Koichi Hirano , Seiichi Nakatani , Mitsuhiro Matsuo , Yoshihisa Yamashita
发明人： Koichi Hirano , Seiichi Nakatani , Mitsuhiro Matsuo , Yoshihisa Yamashita
IPC分类号： C08J5/18 , B29C43/18 , C08K3/00 , C08L101/00 , H01L23/373 , H01L23/433 , H01L23/498 , H01L23/50 , H05K1/02 , H05K1/03 , H05K1/05 , H05K3/20 , H05K3/40 , H05K7/20 , H05K3/30
CPC分类号： H05K7/205 , H01L23/3737 , H01L23/4334 , H01L23/49861 , H01L24/45 , H01L24/48 , H01L2224/451 , H01L2224/48247 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/1305 , H01L2924/13055 , H01L2924/19041 , H05K1/0204 , H05K1/056 , H05K3/0061 , H05K3/202 , H05K3/4084 , H05K7/20463 , H05K2201/0209 , H05K2201/0382 , H05K2201/09054 , H05K2201/0969 , H05K2201/10416 , H05K2203/1189 , Y10T29/49121 , Y10T29/4913 , Y10T29/49146 , Y10T29/49158 , Y10T29/49171 , Y10T29/49172 , H01L2924/00 , H01L2224/05599
摘要： In a method of manufacturing a thermally conductive circuit board with high heat dissipation, high conductivity and high ground-connection, a sheet-like thermally conductive resin composition containing 70 to 95 wt. % inorganic filler and 5 to 30 wt. % thermosetting resin composition, a lead frame as a wiring pattern, and an electrically conductive heat sink with a metal pole placed therein are superposed, heated and compressed, and thus are combined to form one body. Consequently, a thermally conductive circuit board with a flat surface is obtained in which a grounding pattern is grounded to the heat sink inside the insulating layer. Thus, the grounding pattern and the heat sink can be connected electrically with each other in an arbitrary position inside the insulating layer of the thermally conductive circuit board. The method provides that a part of a lead frame and heat sink are connected not only mechanically, but also electrically, and allows an associated power module size to be reduced and its density to be increased.
摘要翻译：在具有高散热，高导电性和高接地连接的导热电路板的制造方法中，含有70〜95重量份的片状导热性树脂组合物，％无机填料和5〜30wt。热固性树脂组合物，作为布线图案的引线框架和放置有金属极的导电散热器叠加，加热和压缩，从而组合形成一体。因此，获得了具有平坦表面的导热电路板，其中接地图被接地到绝缘层内的散热片。因此，接地图案和散热器可以在导热电路板的绝缘层内的任意位置彼此电连接。该方法提供引线框架和散热器的一部分不仅机械地而且电连接，并且允许相关联的功率模块尺寸减小并且其密度增加。

34. 发明授权

US06700182B2 Thermally conductive substrate, thermally conductive substrate manufacturing method and power module 失效
标题翻译：导热基板，导热基板的制造方法和电源模块
公开(公告)号：US06700182B2
公开(公告)日：2004-03-02
申请号：US09870684
申请日：2001-06-01
申请人： Yoshihisa Yamashita , Koichi Hirano , Seiichi Nakatani , Mitsuhiro Matsuo
发明人： Yoshihisa Yamashita , Koichi Hirano , Seiichi Nakatani , Mitsuhiro Matsuo
IPC分类号： H01L23495
CPC分类号： H05K1/0256 , H01L23/367 , H01L23/498 , H01L23/49861 , H01L23/60 , H01L2924/0002 , H05K1/0373 , H05K1/056 , H05K3/202 , H05K2201/0209 , H05K2201/0355 , H05K2201/09145 , H01L2924/00
摘要： By providing an end portion of a radiation plate located on and near an end portion of an insulator sheet, to which a lead frame extends, at a position away from the end portion of the insulator sheet inside of the insulator sheet in a plane direction of the insulator sheet, it is possible to secure a creeping distance between the lead frame and the radiation plate without decreasing a lead frame area on which components can be actually mounted.
摘要翻译：通过设置位于绝缘片的端部和靠近引线框架延伸的绝缘片的端部上的辐射板的端部，在离开绝缘片的端部的位置远离绝缘体片的端部的位置处，绝缘体片材，可以确保引线框架和辐射板之间的蠕变距离，而不会减少可实际安装部件的引线框区域。

35. 发明授权

US06570099B1 Thermal conductive substrate and the method for manufacturing the same 有权
标题翻译：导热基板及其制造方法
公开(公告)号：US06570099B1
公开(公告)日：2003-05-27
申请号：US09694445
申请日：2000-10-23
申请人： Koichi Hirano , Seiichi Nakatani , Mitsuhiro Matsuo , Hiroyuki Handa , Yoshihisa Yamashita
发明人： Koichi Hirano , Seiichi Nakatani , Mitsuhiro Matsuo , Hiroyuki Handa , Yoshihisa Yamashita
IPC分类号： H05K100
CPC分类号： H01L23/49861 , H01L23/36 , H01L23/3737 , H01L2924/0002 , H01L2924/09701 , H05K1/036 , H05K1/0366 , H05K1/0373 , H05K1/056 , H05K3/202 , H05K2201/0209 , Y10T428/24917 , Y10T428/25 , Y10T428/253 , H01L2924/00
摘要： A thermal conductive substrate includes a first electrical insulator layer, a second electrical insulator layer and a lead frame serving as a circuit pattern. The first electrical insulator layer is formed of a thermal conductive resin composition containing a thermosetting resin and an inorganic filler, and is joined to the lead frame. The second electrical insulator layer is provided on the side of the first electrical insulator layer not in contact with the lead frame, and is formed of a thermal conductive resin composition containing the inorganic filler and a resin composition containing the thermosetting resin. The second electrical insulator layer has a higher thermal conductivity than the first electrical insulator layer. Thus, it is possible to achieve higher heat-radiating characteristics and component packaging reliability without deteriorating formability and adhesive characteristics of the electrical insulator layers.
摘要翻译：导热基板包括第一电绝缘体层，第二电绝缘体层和用作电路图案的引线框架。第一电绝缘体层由含有热固性树脂和无机填料的导热性树脂组合物形成，并与引线框架接合。第二电绝缘体层设置在不与引线框架接触的第一电绝缘体层的一侧，并且由含有无机填料的热导性树脂组合物和含有该热固性树脂的树脂组合物形成。第二电绝缘体层具有比第一电绝缘体层更高的热导率。因此，可以在不降低电绝缘体层的成形性和粘合特性的情况下实现更高的散热特性和部件封装可靠性。

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