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31. 发明授权

US08455998B2 Method and package for circuit chip packaging 失效
标题翻译：电路芯片封装的方法和封装
公开(公告)号：US08455998B2
公开(公告)日：2013-06-04
申请号：US13251371
申请日：2011-10-03
申请人： Sushumna Iruvanti , Yves Martin , Theodore van Kessel , Xiaojin Wei
发明人： Sushumna Iruvanti , Yves Martin , Theodore van Kessel , Xiaojin Wei
IPC分类号： H01L23/34
CPC分类号： H01L23/433 , H01L23/10 , H01L23/367 , H01L24/32 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/32057 , H01L2224/83385 , H01L2924/00015 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/0132 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/1579 , H01L2924/16152 , H01L2924/167 , H01L2924/3511 , H01L2924/01028 , H01L2924/01026 , H01L2924/00014 , H01L2224/8381
摘要： A method and a package for circuit chip package having a bent structure. The circuit chip package includes: a substrate having a first coefficient of thermal expansion (CTE); a circuit chip, having a second CTE, mounted onto the substrate; a metal foil disposed on the circuit chip in thermal contact with the chip; a metal lid having (i) a third CTE that is different from the first CTE and (ii) a bottom edge region, where the metal lid is disposed on the metal foil in thermal contact with the metal foil; and an adhesive layer along the bottom edge of the metal lid, cured at a first temperature, bonding the lid to the substrate, producing an assembly which, at a second temperature, is transformed to a bent circuit chip package.
摘要翻译：一种具有弯曲结构的电路芯片封装的方法和封装。电路芯片封装包括：具有第一热膨胀系数（CTE）的衬底; 具有安装在所述基板上的第二CTE的电路芯片; 设置在与芯片热接触的电路芯片上的金属箔; 金属盖，其具有（i）与第一CTE不同的第三CTE和（ii）底部边缘区域，金属盖设置在与金属箔热接触的金属箔上; 以及沿着金属盖的底部边缘的粘合剂层，在第一温度下固化，将盖结合到基底上，产生在第二温度下被转换成弯曲的电路芯片封装的组件。

32. 发明授权

US08310132B2 Insonification device having an internal cooling chamber 有权
标题翻译：具有内部冷却室的胰岛素化装置
公开(公告)号：US08310132B2
公开(公告)日：2012-11-13
申请号：US12922966
申请日：2009-03-17
申请人： Yves Martin , Mathieu Pernot
发明人： Yves Martin , Mathieu Pernot
IPC分类号： F25D31/00
CPC分类号： G10K11/004
摘要： The invention relates to an insonification device (100) comprising a plurality of elementary ultrasonic transducers (110) each comprising at least one electro-acoustic element (111) and distributed on a chassis (120, 140) so that the electro-acoustic elements (111) are distributed on a so-called front surface (120′) of the device (100) intended to be placed facing the medium to be insonified. According to the invention, as each transducer (110) comprises a longitudinal body (113) made in a heat conducting material at the so-called front end of which the electro-acoustic element (111) is placed, the chassis (120, 140) comprises a sealed cooling chamber (130) placed behind the front surface (120′), crossed by the bodies of the transducers (113) and intended to be gone through by a coolant fluid flow.
摘要翻译：本发明涉及一种包括多个基本超声换能器（110）的增音装置（100），每个基本超声波换能器包括至少一个电声元件（111）并分布在底架（120,140）上，使得电声元件 111）分布在设备（100）的所谓的正面（120'）上，用于面向要被增强的介质放置。根据本发明，由于每个换能器（110）包括在导电材料制成的纵向本体（113），所述导体材料位于所述电声元件（111）的所谓前端，所述底架（120,140））包括放置在前表面（120'）后面的密封冷却室（130），其通过换能器（113）的主体穿过并且旨在通过冷却剂流体流动。

33. 发明申请

US20120075734A1 MIRROR ASSEMBLY 有权
标题翻译：镜子总成
公开(公告)号：US20120075734A1
公开(公告)日：2012-03-29
申请号：US12890173
申请日：2010-09-24
申请人： Yves Martin , Robert L. Sandstrom , Theodore G. van Kessel
发明人： Yves Martin , Robert L. Sandstrom , Theodore G. van Kessel
IPC分类号： G02B5/10 , G02B5/08 , B05D5/10
CPC分类号： G02B5/0808 , F24S23/71 , F24S23/74 , F24S23/82 , F24S2025/601 , F24S2080/015 , F24S2080/016 , Y02E10/42 , Y02E10/45
摘要： A mirror is provided and includes a first layer including reflective material and an adhesive backing, a second layer including one or more layers of a cloth or a non woven fiber matrix and polymer composite and a third layer including polystyrene foam spheres in a polymer matrix.
摘要翻译：提供了一种镜子，包括包括反射材料和粘合剂背衬的第一层，包括一层或多层布或非编织纤维基质和聚合物复合物的第二层和在聚合物基质中包括聚苯乙烯泡沫球的第三层。

34. 发明授权

US08053284B2 Method and package for circuit chip packaging 有权
标题翻译：电路芯片封装的方法和封装
公开(公告)号：US08053284B2
公开(公告)日：2011-11-08
申请号：US12540481
申请日：2009-08-13
申请人： Sushumna Iruvanti , Yves Martin , Theodore van Kessel , Xiaojin Wei
发明人： Sushumna Iruvanti , Yves Martin , Theodore van Kessel , Xiaojin Wei
IPC分类号： H01L21/00
CPC分类号： H01L23/433 , H01L23/10 , H01L23/367 , H01L24/32 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/32057 , H01L2224/83385 , H01L2924/00015 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/0132 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/1579 , H01L2924/16152 , H01L2924/167 , H01L2924/3511 , H01L2924/01028 , H01L2924/01026 , H01L2924/00014 , H01L2224/8381
摘要： A method of assembling a bent circuit chip package and a circuit chip package having a bent structure. The circuit chip package includes: a substrate having a first coefficient of thermal expansion (CTE); a circuit chip, having a second CTE, mounted onto the substrate; a metal foil disposed on the circuit chip in thermal contact with the chip; a metal lid having (i) a third CTE that is different from the first CTE and (ii) a bottom edge region, where the metal lid is disposed on the metal foil in thermal contact with the metal foil; and an adhesive layer along the bottom edge of the metal lid, cured at a first temperature, bonding the lid to the substrate, producing an assembly which, at a second temperature, is transformed to a bent circuit chip package.
摘要翻译：一种组装弯曲电路芯片封装的方法和具有弯曲结构的电路芯片封装。电路芯片封装包括：具有第一热膨胀系数（CTE）的衬底; 具有安装在所述基板上的第二CTE的电路芯片; 设置在与芯片热接触的电路芯片上的金属箔; 金属盖，其具有（i）与第一CTE不同的第三CTE和（ii）底部边缘区域，金属盖设置在与金属箔热接触的金属箔上; 以及沿着金属盖的底部边缘的粘合剂层，在第一温度下固化，将盖结合到基底上，产生在第二温度下被转换成弯曲的电路芯片封装的组件。

35. 发明授权

US08012309B2 Method of making wet embossed paperboard 有权
标题翻译：制作湿压花纸板的方法
公开(公告)号：US08012309B2
公开(公告)日：2011-09-06
申请号：US12551247
申请日：2009-08-31
申请人： Éric Paré , Yves Martin , Matieu Jacques
发明人： Éric Paré , Yves Martin , Matieu Jacques
IPC分类号： D21H27/30 , B31F1/07 , D21F11/00
CPC分类号： B31F1/07 , B31F2201/0733 , B31F2201/0738 , B31F2201/0756 , D21F11/006 , D21H27/002 , D21H27/02 , D21H27/30 , Y10T156/1039
摘要： A process for manufacturing an embossed paperboard comprising the steps of: forming a wet mat including more than 60 wt % of cellulose fibers; pressure molding, with at least one embossing roll, the wet mat having 20 to 70 wt % solid to create a nested surface texture thereon; and drying the embossed wet mat to obtain the embossed paperboard with a grammage ranging between 125 and 1500 grams per square meter.
摘要翻译：一种用于制造压纹纸板的方法，包括以下步骤：形成包含大于60重量％的纤维素纤维的湿垫; 加压成型，使用至少一个压花辊，湿垫具有20至70重量％的固体以在其上产生嵌套表面纹理; 并干燥压花湿垫以获得压纹纸板，其克重范围在125至1500克/平方米之间。

36. 发明申请

US20110037167A1 METHOD AND PACKAGE FOR CIRCUIT CHIP PACKAGING 有权
标题翻译：电路芯片封装的方法和封装
公开(公告)号：US20110037167A1
公开(公告)日：2011-02-17
申请号：US12540481
申请日：2009-08-13
申请人： Sushumna Iruvanti , Yves Martin , Theodore van Kessel , Xiaojin Wei
发明人： Sushumna Iruvanti , Yves Martin , Theodore van Kessel , Xiaojin Wei
IPC分类号： H01L23/36 , H01L21/58
CPC分类号： H01L23/433 , H01L23/10 , H01L23/367 , H01L24/32 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/32057 , H01L2224/83385 , H01L2924/00015 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/0132 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/1579 , H01L2924/16152 , H01L2924/167 , H01L2924/3511 , H01L2924/01028 , H01L2924/01026 , H01L2924/00014 , H01L2224/8381
摘要： A method of assembling a bent circuit chip package and a circuit chip package having a bent structure. The circuit chip package includes: a substrate having a first coefficient of thermal expansion (CTE); a circuit chip, having a second CTE, mounted onto the substrate; a metal foil disposed on the circuit chip in thermal contact with the chip; a metal lid having (i) a third CTE that is different from the first CTE and (ii) a bottom edge region, where the metal lid is disposed on the metal foil in thermal contact with the metal foil; and an adhesive layer along the bottom edge of the metal lid, cured at a first temperature, bonding the lid to the substrate, producing an assembly which, at a second temperature, is transformed to a bent circuit chip package.
摘要翻译：一种组装弯曲电路芯片封装的方法和具有弯曲结构的电路芯片封装。电路芯片封装包括：具有第一热膨胀系数（CTE）的衬底; 具有安装在所述基板上的第二CTE的电路芯片; 设置在与芯片热接触的电路芯片上的金属箔; 金属盖，其具有（i）与第一CTE不同的第三CTE和（ii）底部边缘区域，金属盖设置在与金属箔热接触的金属箔上; 以及沿着金属盖的底部边缘的粘合剂层，在第一温度下固化，将盖结合到基底上，产生在第二温度下被转换成弯曲的电路芯片封装的组件。

37. 发明申请

US20090203536A1 Assay supports comprising a peg support, said support attached from a peg solution in cloud point (theta solvent) conditions 审中-公开
标题翻译：测定支持物包含栓支持物，所述支持物由浊点（θ溶剂）条件下的栓溶液附着
公开(公告)号：US20090203536A1
公开(公告)日：2009-08-13
申请号：US12308054
申请日：2007-06-06
申请人： Patrick Vermette , Yves Martin , Emmanuelle Monchaux
发明人： Patrick Vermette , Yves Martin , Emmanuelle Monchaux
IPC分类号： C40B30/04 , C12Q1/02 , C12N11/08 , C12N5/02 , C12N5/00 , C12N11/02 , C40B40/04
CPC分类号： G01N33/54386 , C12N11/00 , G01N33/5008 , G01N33/54393
摘要： Assay supports, such as microarrays and similar devices, and methods of use and manufacture thereof, are described. The assay support is capable of assaying binding and/or activity of a bioactive entity, such as a bioactive molecule or a cell. Analytical and diagnostic uses of the supports are also described.
摘要翻译：描述了诸如微阵列和类似装置的分析支持及其使用和制造方法。测定支持物能够测定生物活性实体如生物活性分子或细胞的结合和/或活性。还描述了支撑体的分析和诊断用途。

38. 发明申请

US20080258068A1 DEVICE AND METHOD FOR GENERATING AN X-RAY POINT SOURCE BY GEOMETRIC CONFINEMENT 审中-公开
标题翻译：通过几何确定产生X射线点源的装置和方法
公开(公告)号：US20080258068A1
公开(公告)日：2008-10-23
申请号：US12165500
申请日：2008-06-30
申请人： Hendrik F. Hamann , Yves Martin , Theodore G. van Kessel , Hemantha K. Wickramasinghe
发明人： Hendrik F. Hamann , Yves Martin , Theodore G. van Kessel , Hemantha K. Wickramasinghe
IPC分类号： H01J37/06 , H01J35/02 , G01T1/24
CPC分类号： H01J35/08 , G21K7/00 , H01J2235/083 , H01J2235/086
摘要： A device for generating an x-ray point source includes a target, and an electron source for producing electrons which intersect with the target to generate an x-ray point source having a size which is confined by a dimension of the target.
摘要翻译：用于产生x射线点源的装置包括靶，以及用于产生与靶相交的电子的电子源，以产生具有被靶的尺寸限制的尺寸的x射线点源。

39. 发明申请

US20060157898A1 Imprint reference template for multilayer or multipattern registration and method therefor 审中-公开
标题翻译：用于多层或多模式注册的印刷参考模板及其方法
公开(公告)号：US20060157898A1
公开(公告)日：2006-07-20
申请号：US11037890
申请日：2005-01-18
申请人： Matthew Colburn , Yves Martin , Charles Rettner , Theodore van Kessel , Hematha Wickramasinghe
发明人： Matthew Colburn , Yves Martin , Charles Rettner , Theodore van Kessel , Hematha Wickramasinghe
IPC分类号： B29C35/08
CPC分类号： G03F7/0002 , B01D2239/045 , B82Y10/00 , B82Y40/00 , G03F9/7011 , G03F9/7019
摘要： A method (and resultant structure) of forming a plurality of masks, includes creating a reference template, using imprint lithography to print at least one reference template alignment mark on all of a plurality of mask blanks for a given chip set, and printing sub-patterns on each of the plurality of mask blanks, and aligning the sub-patterns to the at least one reference template alignment mark.
摘要翻译：一种形成多个掩模的方法（和结果）包括使用压印光刻法创建参考模板以在给定芯片组的所有多个掩模坯料上打印至少一个参考模板对准标记，所述多个掩模坯料中的每一个上的图案，以及将所述子图案对准所述至少一个参考模板对准标记。

40. 发明申请

US20060110890A1 Cut-and-paste imprint lithographic mold and method therefor 有权
标题翻译：切割和糊化印刷光刻模具及其方法
公开(公告)号：US20060110890A1
公开(公告)日：2006-05-25
申请号：US10992072
申请日：2004-11-19
申请人： Matthew Colburn , Yves Martin , Theodore van Kessel , Hematha K. Wickramasinghe
发明人： Matthew Colburn , Yves Martin , Theodore van Kessel , Hematha K. Wickramasinghe
IPC分类号： H01L21/76
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00
摘要： A method (and apparatus) of replicating a pattern on a structure, includes using imprint lithography to replicate a pattern formed on a first structure onto a portion of a second structure.
摘要翻译：在结构上复制图案的方法（和装置）包括使用压印光刻将形成在第一结构上的图案复制到第二结构的一部分上。

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